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Texas Instruments SN74CB3T16212DGVR
- Part No.:
- SN74CB3T16212DGVR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 56-TFSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74CB3T16212DGVR.pdf
- Description:
- IC BUS FET EXC SW 12X2:2 56TVSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,921
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Product details
Overview
SN74CB3T16212DGVR from Texas Instruments is a 24-bit FET bus-exchange switch with 5-V-tolerant I/Os, supporting mixed-mode level translation (5 V ↔ 3.3 V ↔ 2.5 V), 5 Ω typical ON-state resistance, 9 pF typical OFF-state I/O capacitance, and operation across 2.3 V–3.6 V VCC. It enables bidirectional data exchange between A/B ports under S0–S2 control in memory interleaving and PCI interface applications.
For engineers reviewing the SN74CB3T16212DGVR datasheet, SN74CB3T16212DGVR pinout, SN74CB3T16212DGVR application, or SN74CB3T16212DGVR equivalent, key selection criteria include its 5-V-tolerant I/O capability with powered-down isolation (Ioff), sub-0.25 ns propagation delay, 24-bit exchange path routing, and TVSOP-56 package compatibility for high-density PCB layouts.
Technical Context
The SN74CB3T16212DGVR implements a 12-channel dual-port bus-exchange architecture using low-threshold FET switches, where each A/B pair connects bidirectionally when enabled by S0–S2 select logic. Its voltage-tracking output translation ensures VOH ≈ VCC across 2.5 V/3.3 V supply conditions while maintaining 5-V input tolerance regardless of power state.
It integrates undershoot clamp diodes on all data and control inputs, supports partial-power-down via Ioff (≤10 µA at VCC = 0 V), and achieves latch-up immunity >250 mA per JESD 17. The device operates with near-zero propagation delay (0.15–0.25 ns) due to low rON–Cio(OFF) product and zero static current draw in OFF state.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3 V to 3.6 V - Enables interoperability across 2.5 V and 3.3 V system domains without external level shifters. |
| rON (Typ) | 5 Ω - Minimizes signal attenuation and voltage drop during high-speed data transfer (e.g., 24 mA load yields ≤120 mV drop). |
| Cio(OFF) (Typ) | 9 pF - Reduces capacitive loading on driving sources and preserves signal integrity in high-frequency bus environments. |
| tpd (A↔B) | 0.15–0.25 ns - Enables sub-nanosecond timing-critical switching for PCI, USB, and memory-bus applications. |
| Ioff (Max) | 10 µA at VCC = 0 V - Prevents backflow current and ensures safe hot-insertion or partial-power-down operation. |
| VI/O Range | 0 V to 5.5 V - Supports 5-V-tolerant signaling even when unpowered, eliminating need for external protection circuitry. |
| ESD Rating | 2000-V HBM, 1000-V CDM - Meets industrial-grade robustness requirements without additional ESD suppression. |
Pinout & Package
SN74CB3T16212DGVR uses a 56-pin TVSOP (DGV) package measuring 13.9 mm × 6.2 mm × 1.2 mm max height, JEDEC MO-194 compliant, with 0.4 mm pitch and exposed thermal pad (not electrically connected). Pin numbering follows standard top-view orientation with pin 1 at bottom-left corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| S0, S1, S2 | Select control inputs | Determine active A↔B channel mapping per function table; require pulldown resistors for defined power-up state. |
| A1–A12, B1–B12 | Data I/O pairs (24 total) | Bidirectional signal paths; each A/B pair connects when selected, with 5-V-tolerant I/O and 5 Ω rON. |
| VCC | Supply voltage | Powers internal FET gates and level-shifting circuitry; range 2.3–3.6 V defines output voltage translation reference. |
| GND (×4) | Ground terminals | Provide low-inductance return paths for all 24 channels; multiple pins reduce ground bounce in high-speed switching. |
Key Features
| Feature | Design Value |
|---|---|
| Mixed-mode level shifting | Translates 5-V inputs to 3.3-V or 2.5-V outputs dynamically tracking VCC - eliminates discrete translator ICs in multi-voltage systems. |
| Powered-down 5-V tolerance | I/Os remain 5-V-tolerant with VCC = 0 V - enables safe insertion into live backplanes or hot-swap subsystems. |
| Ultra-low propagation delay | 0.15–0.25 ns A↔B delay - preserves timing margins in DDR memory buses and PCIe Gen1 clock-forwarded links. |
| Ioff partial-power-down support | 10 µA max Ioff prevents backdrive current - allows selective shutdown of bus segments without affecting upstream logic. |
| Integrated undershoot clamps | Clamp diodes on all I/O and control pins - suppresses <−0.5 V transients without external Schottky diodes. |
Applications
| PCI Express Interconnect | Memory Interleaving System |
|---|---|
|
Use Scenario: Isolating two 32-bit PCI segments operating at different voltage levels (3.3 V and 2.5 V) while enabling dynamic reconfiguration. IC Role / Device Role / Timing Role: Bidirectional bus-exchange switch managing address/data flow between host bridge and peripheral slots with sub-0.25 ns latency. Use Value: Eliminates need for dual-supply translators and reduces board area by consolidating 24-bit exchange into single TVSOP-56 device. |
Use Scenario: Routing data between two DDR2 memory banks with independent VDDQ supplies (2.5 V and 3.3 V) in embedded baseband processors. IC Role / Device Role / Timing Role: Voltage-translating bus switch enabling simultaneous access to interleaved memory regions without level-shifter bottlenecks. Use Value: Maintains signal integrity via 9 pF Cio(OFF) and avoids timing skew with 0.15 ns tpd - critical for 400 MT/s DDR2 operation. |
| USB 2.0 Hub Signal Routing | Low-Power Portable Equipment Interface |
|
Use Scenario: Switching D+/D− lines between upstream host port and downstream device ports in battery-powered USB hubs. IC Role / Device Role / Timing Role: Low-capacitance, bidirectional analog switch providing 5-V-tolerant USB signaling with minimal jitter addition. Use Value: 5 Ω rON and 9 pF Cio(OFF) preserve USB eye diagram integrity; Ioff prevents battery drain during port sleep states. |
Use Scenario: Enabling flexible I/O voltage domain bridging in handheld medical monitors with mixed 1.8 V sensor interfaces and 3.3 V display controllers. IC Role / Device Role / Timing Role: Level-translating bus switch allowing real-time reconfiguration of sensor-to-processor data paths. Use Value: 2.3 V minimum VCC supports ultra-low-power operation; 70 µA ICC enables >10-year battery life in always-on monitoring modes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus-exchange switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBT16212DGVR | Lacks 5-V-tolerant I/O; VCC-only operation (2.3–3.6 V); no level shifting; higher rON (6 Ω typ). | Suitable only for same-voltage-domain switching; cannot replace SN74CB3T16212DGVR in mixed-voltage systems. | Select only if all connected devices share identical VCC and no 5-V signals are present. |
| SN74LVC1G3157DCKR | Single-channel SPDT analog switch; 5-V-tolerant; 10 Ω rON; 12 pF Cio(OFF); no S0–S2 decoding logic. | Requires 24 separate devices + external decode logic to replicate 24-bit exchange functionality. | Use only for low-channel-count prototyping or space-constrained single-line isolation where density is secondary. |
Compared with SN74CBT16212DGVR and SN74LVC1G3157DCKR, the SN74CB3T16212DGVR uniquely combines 24-bit exchange routing, 5-V-tolerant mixed-voltage translation, and sub-0.25 ns delay in one TVSOP-56 package - making it irreplaceable for compact, multi-standard interface consolidation.
Availability
SN74CB3T16212DGVR is available at Aetrix Electronics and suitable for PCI Express interconnect, memory interleaving systems, and USB 2.0 hub signal routing requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for SN74CB3T16212DGVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with over 90 years of innovation in high-reliability interface and signal-path components.
The SN74CB3T16212DGVR belongs to TI's Widebus™ family of high-speed bus switches, designed specifically for voltage-domain bridging in mixed-signal computing, communications, and portable electronics infrastructure.
FAQ
What voltage levels can SN74CB3T16212DGVR translate between?
The SN74CB3T16212DGVR supports bidirectional level translation between 0 V–5.5 V inputs and outputs, with output voltage tracking VCC (2.3 V–3.6 V). When VCC = 2.5 V, it translates 5-V or 3.3-V inputs down to 2.5-V outputs; when VCC = 3.3 V, it translates 5-V inputs down to 3.3-V outputs. This behavior is confirmed in Figure 1 and the DC voltage translation specifications.
Does SN74CB3T16212DGVR support hot-plug or partial-power-down operation?
Yes, SN74CB3T16212DGVR supports partial-power-down via its Ioff feature, limiting current to ≤10 µA when VCC = 0 V while maintaining 5-V tolerance on all I/Os. This enables safe insertion into live backplanes and isolation of powered-down subsystems without damaging upstream drivers - verified in Absolute Maximum Ratings and Electrical Characteristics tables.
What is the maximum data rate supported by SN74CB3T16212DGVR?
SN74CB3T16212DGVR does not specify a maximum data rate directly, but its 0.15–0.25 ns propagation delay and 9 pF OFF-state capacitance enable reliable operation up to 2+ Gbps in differential applications like USB 2.0 (480 Mbps) and PCI (33 MHz) without signal degradation - consistent with its use in memory interleaving and PCI interface applications per the datasheet description.
How does the S0/S1/S2 control logic configure the 24-bit exchange paths in SN74CB3T16212DGVR?
The SN74CB3T16212DGVR uses S0/S1/S2 to select among eight possible A↔B connection states per the Function Table. For example, S2S1S0 = LHL connects A1–A12 to B2–B12 (i.e., A1↔B2, A2↔B1, etc.), while HHL enables full bidirectional exchange between all A and B ports. Each combination routes specific A/B pairs without internal multiplexing - confirmed in the Function Table and Logic Diagram.
Is SN74CB3T16212DGVR pin-compatible with other members of the Widebus™ family?
No, SN74CB3T16212DGVR is not pin-compatible with other Widebus™ devices such as SN74CBT16212DGVR or SN74CB3T3125PWR. Its 56-pin TVSOP (DGV) footprint, dual 12-bit A/B port layout, and three-select-input architecture are unique to this part number - verified by comparing terminal assignments and package drawings in the datasheet.
SN74CB3T16212DGVR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CB
- Package/Case:
- 56-TFSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Bus FET Exchange Switch
- Circuit:
- 12 x 2:2
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TVSOP
SN74CB3T16212DGVR FAQ
1.How can I place an order for SN74CB3T16212DGVR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CB3T16212DGVR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74CB3T16212DGVR reliable?
The price and inventory of SN74CB3T16212DGVR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CB3T16212DGVR is usually 5 days.
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Once your SN74CB3T16212DGVR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74CB3T16212DGVR?
For technical support, including SN74CB3T16212DGVR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CB3T16212DGVR requirements.
6.How does Aetrix verify that SN74CB3T16212DGVR is sourced from the original manufacturer or authorized distributors?
All SN74CB3T16212DGVR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CB3T16212DGVR meets industry standards.
7.What is the process for return or replacement of SN74CB3T16212DGVR?
All SN74CB3T16212DGVR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CB3T16212DGVR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CB3T16212DGVR part is unused and in its original packaging.
Return procedure for SN74CB3T16212DGVR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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