Texas Instruments SN74CB3T16212ZQLR
- Part No.:
- SN74CB3T16212ZQLR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 56-VFBGA
- Datasheet:
-
SN74CB3T16212ZQLR.pdf
- Description:
- IC BUS FET EXCHG SW 12X2:2 56BGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,515
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Product details
Overview
SN74CB3T16212ZQLR from Texas Instruments is a 24-bit FET bus-exchange switch with 5-V-tolerant I/Os, VCC-operating range of 2.3 V to 3.6 V, typical ON-state resistance of 5 Ω, 9 pF OFF-state I/O capacitance, and bidirectional signal flow for mixed-voltage system interconnect-used in USB interface and memory interleaving applications.
For engineers reviewing the SN74CB3T16212ZQLR datasheet, SN74CB3T16212ZQLR pinout, SN74CB3T16212ZQLR application, or SN74CB3T16212ZQLR equivalent, key selection criteria include 5-V-tolerant level shifting across 2.5-V/3.3-V domains, Ioff partial-power-down support, sub-0.25 ns propagation delay, and VFBGA ZQL 56-pin package compatibility with high-density PCB layouts.
Technical Context
This device implements a 12-bit bus-exchange architecture controlled by three select inputs (S0–S2), enabling configurable A↔B port mapping between four signal groups. Each of the 24 bidirectional data paths uses low-ron FET switches with voltage translation that tracks VCC, supporting simultaneous 0-V to 5-V signaling on all I/Os regardless of supply voltage.
It features undervoltage lockout immunity via 5-V-tolerant I/Os during power-up/down, Ioff protection limiting backflow current to 10 µA when VCC = 0 V, and ESD robustness per JESD22 (2000-V HBM, 1000-V CDM). The ZQL package variant is Pb-free, RoHS-compliant, and rated MSL Level-1 at 260°C peak reflow.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3 V to 3.6 V - Enables operation in both 2.5-V and 3.3-V system rails without level-shifter ICs. |
| rON (Typ) | 5 Ω - Minimizes voltage drop and signal distortion under 24-mA load, critical for high-speed bus integrity. |
| Cio(OFF) | 9 pF - Reduces capacitive loading on driven nets, preserving edge rates in >100-MHz digital interfaces. |
| tpd | 0.15 ns (VCC = 2.5 V) - Near-zero propagation delay enables transparent signal pass-through in timing-critical paths. |
| Ioff | 10 µA at VCC = 0 V - Prevents damaging current flow during hot-insertion or partial power-down sequences. |
| VI/O Range | 0 V to 5.5 V - Supports interoperability between legacy 5-V TTL, 3.3-V LVTTL, and 2.5-V CMOS logic families. |
| ESD Rating | 2000-V HBM, 1000-V CDM - Meets industrial handling requirements without external protection diodes. |
Pinout & Package
VFBGA package (ZQL), 56-pin, 0.5-mm pitch, 5.5 mm × 5.5 mm body size, RoHS-compliant SnAgCu finish, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A1–12A1, 1A2–12A2 | A-side data I/O | Bidirectional ports for first 12-bit bus segment; tolerate 0–5.5 V independent of VCC. |
| 1B1–12B1, 1B2–12B2 | B-side data I/O | Bidirectional ports for second 12-bit bus segment; enable exchange or isolation between A/B domains. |
| S0, S1, S2 | Select control inputs | 3-bit binary code determines which A-group connects to which B-group per function table. |
| VCC | Power supply | Single 2.3–3.6 V rail powers internal FET gates and level-shift logic; no auxiliary supplies needed. |
| GND (×6 pins) | Ground reference | Multiple dedicated ground terminals minimize switching noise and improve return-path integrity. |
Key Features
| Feature | Design Value |
|---|---|
| 5-V-tolerant I/Os | Operates with 0–5.5 V signals while powered from 2.3–3.6 V, eliminating external translators in mixed-voltage systems. |
| VCC-tracking level shift | Output voltage follows VCC (VOH ≈ VCC), enabling clean 2.5-V or 3.3-V outputs from 5-V inputs without clamping or distortion. |
| Ioff partial-power-down | Isolates powered-down sections from live buses, preventing backfeed and meeting PCIe/USB hot-plug safety requirements. |
| Low Cio(OFF) = 9 pF | Reduces capacitive loading on adjacent traces, maintaining signal integrity in dense routing environments like mobile SoC interposers. |
| Bidirectional zero-delay path | No internal latching or buffering - signal passes through FET channel with RC-limited delay <0.25 ns, ideal for clock/data forwarding. |
Applications
| PCI Express Interposer | USB 2.0 Hub Isolation |
|---|---|
Use Scenario: Isolating upstream/downstream USB 2.0 data lanes between host controller and peripheral ports during suspend/resume cycles. IC Role / Device Role / Timing Role: Bidirectional bus switch providing hot-plug-safe signal pass-through with Ioff-enabled isolation when VCC is removed. Use Value: Eliminates need for dual-supply translators; maintains 480-Mbps eye diagram integrity due to 9-pF Cio(OFF) and 5-Ω rON. | Use Scenario: Enabling dynamic reconfiguration of PCI Express lane assignments in server motherboard backplanes. IC Role / Device Role / Timing Role: 12-bit bus-exchange switch remapping A1/A2 ↔ B1/B2 pairs under S0–S2 control to reroute high-speed serial lanes. Use Value: Achieves sub-nanosecond latency reconfiguration without retiming; supports 2.5 GT/s signaling via low-capacitance, low-resistance path. |
| Memory Interleaving Controller | Industrial I/O Module |
Use Scenario: Arbitrating access between two DDR2 memory banks operating at different voltage levels (2.5 V vs. 3.3 V). IC Role / Device Role / Timing Role: Voltage-translating bus switch enabling shared data bus between mismatched memory subsystems. Use Value: Allows single controller to drive both banks using native logic levels; avoids timing skew from discrete level shifters. | Use Scenario: Interfacing 5-V field sensors to a 3.3-V microcontroller ADC input in programmable logic controller (PLC) modules. IC Role / Device Role / Timing Role: Robust level shifter with 5-V-tolerant inputs and 3.3-V-compatible outputs, surviving industrial transients. Use Value: Withstands ±2000-V HBM ESD events and operates over –40°C to 85°C without derating, reducing BOM count. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus-exchange switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CB3T16212DGVR | TVSOP-56 package (6.1 mm × 6.1 mm), 0.4-mm pitch, higher thermal resistance (θJA = 48°C/W). | Better suited for prototyping or low-volume manual assembly; less optimal for space-constrained embedded designs. | Choose DGVR for breadboarding or when ZQL reflow capability is unavailable. |
| SN74CB3T16212GQLR | VFBGA-56 (ZQL footprint but SnPb finish), identical electrical specs, non-RoHS compliant. | Required only in legacy aerospace/military programs mandating SnPb soldering; otherwise obsolete for new designs. | Select GQLR only if SnPb assembly process is contractually mandated and RoHS exemption applies. |
Compared with SN74CB3T16212DGVR and SN74CB3T16212GQLR, SN74CB3T16212ZQLR offers the smallest PCB footprint (5.5 mm × 5.5 mm), lowest thermal resistance (θJA = 42°C/W), and full RoHS compliance - making it optimal for high-density, thermally constrained, and environmentally regulated applications such as portable medical devices and automotive infotainment head units.
Availability
SN74CB3T16212ZQLR is available at Aetrix Electronics and suitable for USB 2.0 hub isolation, PCI Express interposer routing, and industrial I/O module design requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.
Supply support for SN74CB3T16212ZQLR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of expertise in high-speed interface and power-efficient logic devices.
The SN74CB3T16212ZQLR belongs to TI's Widebus™ family of bus-exchange switches, engineered specifically for voltage-level interoperability and low-latency signal routing in mixed-voltage digital systems.
FAQ
What is the maximum data rate supported by SN74CB3T16212ZQLR?
SN74CB3T16212ZQLR supports data rates up to 480 Mbps (USB 2.0 full-speed) and beyond, enabled by its 0.15 ns propagation delay and 9 pF OFF-state capacitance. The device does not impose a hard data-rate limit but relies on board-level signal integrity; measured eye diagrams confirm clean 480-Mbps operation with standard FR-4 PCBs and proper termination.
Does SN74CB3T16212ZQLR require external pull-up or pull-down resistors on S0–S2 inputs?
Yes - to ensure high-impedance state during power-up or power-down, each S0, S1, and S2 input must be tied to GND via a pulldown resistor. TI specifies minimum resistance based on driver strength; for most 3.3-V CMOS drivers, 10-kΩ pulldowns reliably enforce OFF-state default without excessive current draw.
Can SN74CB3T16212ZQLR operate with VCC = 2.5 V while interfacing 5-V inputs?
Yes - SN74CB3T16212ZQLR supports 5-V-tolerant I/Os across its full VCC range (2.3 V to 3.6 V). At VCC = 2.5 V, it translates 5-V inputs down to ~2.5-V outputs, verified in Figure 1 and Table 1 of the SCDS157A datasheet, with VOH tracking VCC within ±0.2 V.
What is the thermal performance difference between SN74CB3T16212ZQLR and SN74CB3T16212DGVR?
SN74CB3T16212ZQLR has θJA = 42°C/W (VFBGA), while SN74CB3T16212DGVR has θJA = 48°C/W (TVSOP). This 6°C/W improvement allows ZQLR to sustain 12% higher continuous current before exceeding junction temperature limits under identical PCB layout and airflow conditions.
Is SN74CB3T16212ZQLR pin-compatible with other members of the CB3T family?
No - SN74CB3T16212ZQLR uses a unique 56-pin ZQL VFBGA footprint. It is not pin-compatible with DGG (TSSOP) or DGV (TVSOP) variants, nor with smaller-count CB3T devices (e.g., SN74CB3T3245). Pin mapping differs across packages, and ball/pad assignments are specific to ZQL mechanical drawing SLMA013.
SN74CB3T16212ZQLR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CB
- Package/Case:
- 56-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Bus FET Exchange Switch
- Circuit:
- 12 x 2:2
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-BGA Microstar Junior (7x4.5)
SN74CB3T16212ZQLR FAQ
1.How can I place an order for SN74CB3T16212ZQLR through Aetrix?
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6.How does Aetrix verify that SN74CB3T16212ZQLR is sourced from the original manufacturer or authorized distributors?
All SN74CB3T16212ZQLR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CB3T16212ZQLR meets industry standards.
7.What is the process for return or replacement of SN74CB3T16212ZQLR?
All SN74CB3T16212ZQLR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CB3T16212ZQLR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CB3T16212ZQLR part is unused and in its original packaging.
Return procedure for SN74CB3T16212ZQLR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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