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Texas Instruments SN74CB3T1G125DBVR
- Part No.:
- SN74CB3T1G125DBVR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- SC-74A, SOT-753
- Datasheet:
-
SN74CB3T1G125DBVR.pdf
- Description:
- IC BUS SWITCH 1 X 1:1 SOT23-5
- Quantity:
- Payment:
- Shipping:
Inventory:23,982
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Product details
Overview
SN74CB3T1G125DBVR from Texas Instruments is a single-channel FET bus switch IC designed for bidirectional level translation and bus isolation in mixed-voltage systems. It operates from 2.3 V to 3.6 V, supports 5-V-tolerant I/Os, delivers 5 Ω typical ON-state resistance, enables sub-0.25 ns propagation delay, and features Ioff partial-power-down protection-used in USB interface signal routing and low-power portable logic isolation.
For engineers reviewing the SN74CB3T1G125DBVR datasheet, SN74CB3T1G125DBVR pinout, SN74CB3T1G125DBVR application, or SN74CB3T1G125DBVR equivalent, key selection criteria include its 5-pin SOT-23 (DBV) package, 5-V-tolerant I/O capability with 2.5/3.3-V VCC, near-zero propagation delay, Ioff-enabled power-down isolation, and compatibility with TTL/CMOS mixed-mode signaling across data ports.
Technical Context
The SN74CB3T1G125DBVR implements a single high-speed transmission-gate FET switch controlled by an active-low OE input. Its voltage-tracking output architecture ensures VOH ≈ VCC when VI ≥ VCC − 1 V, enabling seamless level shifting between 0–5 V inputs and 2.5/3.3 V outputs without external biasing.
It integrates undershoot clamp diodes on all I/Os, supports partial-power-down via Ioff (≤10 µA leakage at VCC = 0), and maintains high-impedance isolation during power transitions-critical for hot-swap and multi-rail system integrity. Control inputs accept TTL- or CMOS-level signals across the full 2.3–3.6 V VCC range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3 V to 3.6 V - Enables operation in both 2.5-V and 3.3-V logic domains with stable switching performance. |
| ron (Typ) | 5 Ω - Minimizes voltage drop and signal distortion under 32 mA load, preserving signal integrity in high-speed data paths. |
| tpd (Max) | 0.25 ns - Enables sub-nanosecond timing-critical applications such as USB 2.0 data routing and FPGA I/O bridging. |
| Ioff (Max) | 20 µA at VCC = 0 - Prevents backflow current during partial power-down, protecting upstream/downstream circuitry. |
| Cio(OFF) (Typ) | 5 pF - Reduces capacitive loading on buses, supporting >100 MHz signal bandwidth without excessive rise/fall time degradation. |
| VI/O Range | 0 V to 5.5 V - Allows direct connection to 5-V peripherals while powered from 2.5-V or 3.3-V rails, eliminating external level shifters. |
| ICC (Max) | 20 µA - Supports ultra-low static power consumption in battery-powered portable electronics and always-on subsystems. |
Pinout & Package
SOT-23 (DBV) package: 5-pin, 1.45 mm max height, JEDEC MO-178 compliant, tape-and-reel (3000 pcs/reel), RoHS-compliant NIPDAU/SN finish, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | VCC | Positive supply rail - Powers internal switch and control logic; must be stable within 2.3–3.6 V for correct level translation behavior. |
| 2 | A | Data input/output port A - Bidirectionally connected to B when OE is low; accepts 0–5.5 V signals regardless of VCC. |
| 3 | GND | Ground reference - Common return path for VCC and I/O currents; required for proper clamp diode and Ioff operation. |
| 4 | B | Data input/output port B - Mirror of A port; bidirectional signal path with matched impedance and timing to A. |
| 5 | OE | Active-low output-enable - Driven low to enable A↔B conduction; tied to VCC via pullup resistor for power-up high-impedance safety. |
Key Features
| Feature | Design Value |
|---|---|
| 5-V-tolerant I/Os | Supports 0–5.5 V signaling on A/B pins with VCC = 2.3–3.6 V - eliminates need for discrete level-shifting components in mixed-voltage interfaces. |
| Output voltage translation | VOH tracks VCC (≈VCC) when VI ≥ VCC − 1 V - ensures compatible logic-high levels across voltage domains without external feedback. |
| Ioff partial-power-down | Leakage ≤20 µA when VCC = 0 - isolates powered and unpowered sections in multi-rail systems, preventing damage or data corruption. |
| Mixed-mode signal support | Valid operation with 0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5 V inputs - accommodates legacy and emerging logic families on same bus. |
| Low ON-state capacitance | Cio(ON) = 4–12 pF depending on VI/O state - minimizes signal reflection and crosstalk in high-frequency digital interconnects. |
Applications
| USB 2.0 Data Line Isolation | FPGA-to-Peripheral Voltage Translation |
|---|---|
|
Use Scenario: Isolating D+ and D− lines between a 3.3-V FPGA I/O bank and a 5-V USB transceiver during hot-plug events. IC Role / Device Role / Timing Role: Bidirectional bus switch providing 5-V-tolerant signal pass-through with <0.25 ns propagation delay and Ioff-enabled power-domain decoupling. Use Value: Eliminates external level shifters and prevents backfeed current when USB port is unplugged while FPGA remains powered. |
Use Scenario: Routing control signals from a 2.5-V FPGA bank to 5-V industrial sensors requiring TTL-compatible inputs. IC Role / Device Role / Timing Role: Single-bit level translator with VCC = 2.5 V, accepting 5-V sensor outputs and delivering 2.5-V-compatible logic levels to FPGA inputs. Use Value: Maintains signal integrity at >50 MHz edge rates while reducing BOM count and PCB area versus discrete MOSFET solutions. |
| Low-Power Portable Memory Interface | Hot-Swappable Module Bus Isolation |
|
Use Scenario: Enabling/disabling a 3.3-V SRAM chip on a battery-powered handheld device based on sleep/wake state. IC Role / Device Role / Timing Role: Low-leakage (20 µA Ioff) bus switch isolating memory address/data lines during deep-sleep mode. Use Value: Cuts standby current by blocking parasitic paths through memory I/Os, extending battery life without compromising wake latency. |
Use Scenario: Isolating a PCIe add-in card's 3.3-V configuration bus from the host motherboard during live insertion/removal. IC Role / Device Role / Timing Role: OE-controlled bidirectional switch ensuring high-Z state before and after power sequencing, meeting PCIe hot-plug safety requirements. Use Value: Prevents bus contention and latch-up during mechanical mating, verified per JESD 17 latch-up immunity (>250 mA). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CB3Q1G125DBVR | Enhanced ESD rating (4 kV HBM), lower ICC (10 µA max), same pinout and electrical specs. | Preferred for automotive or harsh-environment designs requiring higher robustness without layout change. | Select when extended ESD immunity and lower quiescent current are critical; identical footprint and function. |
| SN74LVC1G125DBVR | Non-level-shifting 3.3-V-only buffer; no 5-V tolerance; higher ron (~10 Ω); lacks Ioff. | Only suitable for same-voltage domain buffering; cannot replace SN74CB3T1G125DBVR in mixed-voltage or hot-swap use cases. | Choose only for cost-sensitive, single-rail 3.3-V applications where level translation and power-down isolation are unnecessary. |
Compared with SN74CB3T1G125DBVR, SN74CB3Q1G125DBVR offers superior ESD resilience and lower static power but identical functionality, while SN74LVC1G125DBVR lacks 5-V tolerance and Ioff-making it unsuitable for level-shifting or partial-power-down scenarios.
Availability
SN74CB3T1G125DBVR is available at Aetrix Electronics and suitable for USB interface design, FPGA I/O bridging, and low-power portable memory management requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for SN74CB3T1G125DBVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in precision logic and interface solutions.
The SN74CB3T1G125DBVR belongs to TI's CB3T family of FET bus switches, engineered specifically for low-latency, low-power, mixed-voltage signal routing in portable, industrial, and communications equipment.
FAQ
What is the maximum operating temperature range for the SN74CB3T1G125DBVR?
The SN74CB3T1G125DBVR is rated for operation from –40°C to +85°C ambient temperature. This industrial-grade range ensures reliable performance in portable electronics, industrial controllers, and automotive infotainment modules where thermal cycling and extended temperature exposure occur. The device maintains specified ron, tpd, and Ioff behavior across this full range per TI's SCDS150A datasheet.
Does the SN74CB3T1G125DBVR support true bidirectional signal flow?
Yes, the SN74CB3T1G125DBVR provides fully bidirectional signal conduction between A and B ports when OE is low. Its FET-based transmission gate architecture imposes no directionality-data flows equally well from A→B or B→A with matched 5 Ω typical ron and <0.25 ns tpd in either direction. This is confirmed in the functional diagram and switching characteristics table of the SN74CB3T1G125DBVR datasheet.
Can the SN74CB3T1G125DBVR be used with a 2.5-V supply to translate 5-V inputs down to 2.5-V outputs?
Yes, the SN74CB3T1G125DBVR supports 5-V-to-2.5-V level translation when VCC = 2.5 V. Per Figure 1 and the "5-V/3.3-V Input Down to 2.5-V Output Level" specification, VOH tracks VCC (≈2.5 V) for VI ≥ VCC − 1 V (i.e., ≥1.5 V), making it suitable for interfacing 5-V sensors or legacy peripherals to 2.5-V logic domains without external components.
Is the SN74CB3T1G125DBVR pin-compatible with other packages like DCK?
No, the SN74CB3T1G125DBVR (SOT-23, DBV) is not pin-compatible with SN74CB3T1G125DCKR (SC-70, DCK). Although both are 5-pin devices with identical signal assignments, their pinouts differ: DBV places VCC at Pin 1 and OE at Pin 5, while DCK places VCC at Pin 4 and OE at Pin 5. PCB layout must be redesigned when switching between these packages.
What is the recommended pull-up resistor value for OE on the SN74CB3T1G125DBVR?
Texas Instruments recommends tying OE to VCC via a pullup resistor to ensure high-impedance state during power-up. The minimum value is determined by the driver's current-sinking capability; for standard CMOS drivers, 10 kΩ is typical. The SN74CB3T1G125DBVR datasheet specifies that OE must be held at VCC or GND when unused, and the resistor value should limit current to <1 mA under worst-case VIH conditions.
SN74CB3T1G125DBVR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CB
- Package/Case:
- SC-74A, SOT-753
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Bus Switch
- Circuit:
- 1 x 1:1
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-23-5
SN74CB3T1G125DBVR FAQ
1.How can I place an order for SN74CB3T1G125DBVR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CB3T1G125DBVR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74CB3T1G125DBVR reliable?
The price and inventory of SN74CB3T1G125DBVR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CB3T1G125DBVR is usually 5 days.
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SN74CB3T1G125DBVR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74CB3T1G125DBVR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74CB3T1G125DBVR?
For technical support, including SN74CB3T1G125DBVR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CB3T1G125DBVR requirements.
6.How does Aetrix verify that SN74CB3T1G125DBVR is sourced from the original manufacturer or authorized distributors?
All SN74CB3T1G125DBVR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CB3T1G125DBVR meets industry standards.
7.What is the process for return or replacement of SN74CB3T1G125DBVR?
All SN74CB3T1G125DBVR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CB3T1G125DBVR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CB3T1G125DBVR part is unused and in its original packaging.
Return procedure for SN74CB3T1G125DBVR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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