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Texas Instruments SN74CB3T3245DGVR
- Part No.:
- SN74CB3T3245DGVR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 20-TFSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74CB3T3245DGVR.pdf
- Description:
- IC BUS SWITCH 8 X 1:1 20TVSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,302
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Product details
Overview
SN74CB3T3245DGVR from Texas Instruments is an 8-bit FET bus switch with bidirectional data flow, 5V-tolerant I/Os, and VCC-referenced level shifting for mixed-mode signal translation (e.g., 5V→3.3V or 5V/3.3V→2.5V). It features 5Ω typical ON-state resistance, 5pF OFF-state I/O capacitance, and operates from 2.3V to 3.6V VCC - enabling use in USB interface isolation and memory interleaving circuits.
For engineers reviewing the SN74CB3T3245DGVR datasheet, SN74CB3T3245DGVR pinout, SN74CB3T3245DGVR application, or SN74CB3T3245DGVR equivalent, key selection criteria include its 20-pin TVSOP package, near-zero propagation delay (<0.25 ns at 3.3V), Ioff partial-power-down support, 5V-tolerant operation during power-up/down, and compatibility with TTL and CMOS control inputs.
Technical Context
The SN74CB3T3245DGVR implements eight independent FET-based bilateral switches controlled by a single active-low OE input, using standard '245 pinout. Its output voltage translation tracks VCC, enabling deterministic down-shifting without external biasing.
Each switch supports bidirectional conduction with ron ≈ 5Ω (typ) and Cio(OFF) = 5pF (typ), minimizing RC delay and capacitive loading. The device guarantees 5V tolerance on all I/Os regardless of VCC state (powered up or powered down), and includes undershoot clamp diodes on all data and control inputs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3V to 3.6V - enables operation across 2.5V and 3.3V logic domains while maintaining 5V I/O tolerance |
| ON-State Resistance (ron) | 5Ω typical at VCC = 2.5V - ensures minimal voltage drop and signal distortion under 24mA load |
| I/O Capacitance (Cio(OFF)) | 5pF typical - reduces capacitive loading on buses, preserving signal integrity in high-speed interfaces |
| Propagation Delay (tpd) | 0.25ns max at 3.3V - delivers near-zero latency for timing-critical bidirectional data paths |
| Supply Current (ICC) | 40μA maximum - supports ultra-low-power portable and battery-operated systems |
| ESD Rating (HBM) | ±2000V - meets Class II human-body model requirements for robust handling in manufacturing |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade embedded applications with thermal cycling |
Pinout & Package
SN74CB3T3245DGVR uses a 20-pin Thin Very Small Outline Package (TVSOP, DGV), measuring 5.00mm × 6.4mm with 0.5mm lead pitch. This thermally enhanced, surface-mount package supports automated assembly and provides low RθJA (123.7°C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | NC | No internal connection - must be left unconnected; no routing or pull-up required |
| 2–9 | A1–A8 | Switch input terminals - bidirectional A-side ports for 8-bit bus connection |
| 10 | GND | Ground reference - primary return path for VCC and signal currents |
| 11–18 | B8–B1 | Switch output terminals - bidirectional B-side ports, electrically mirrored to A-side |
| 19 | OE | Active-low output enable - controls all eight switches simultaneously; high = high-Z isolation |
| 20 | VCC | Power supply - sets translation reference voltage and powers internal FET gates |
Key Features
| Feature | Design Value |
|---|---|
| Mixed-mode level shifting | Supports 5V→3.3V and 5V/3.3V→2.5V translation with VCC tracking - eliminates need for external level-shifters in multi-voltage systems |
| 5V-tolerant I/Os | Valid with device powered up or fully powered down - enables hot-swap capability and safe interconnection between legacy 5V and modern low-voltage subsystems |
| Ioff partial-power-down | Prevents backflow current when VCC = 0V - protects upstream drivers and maintains system-level isolation during power sequencing |
| Standard '245 pinout | Pin-compatible with industry-standard 74-series bus transceivers - simplifies PCB layout reuse and design migration |
| Undershoot clamp diodes | Integrated on all data and control inputs - suppresses negative transients below –1.2V, improving ESD robustness and signal reliability |
Applications
| PCI Interface Isolation | USB 2.0 Data Line Level Translation |
|---|---|
|
Use Scenario: Isolating PCI bus segments to prevent ground loops and reduce noise coupling between add-in cards and host controller. IC Role / Device Role / Timing Role: Bidirectional 8-bit bus switch enabling dynamic segmentation while preserving signal timing integrity. Use Value: Near-zero propagation delay (0.25ns) and 5Ω ron maintain PCI timing margins; 5V-tolerance accommodates legacy 5V signaling on one side and 3.3V logic on the other. |
Use Scenario: Translating data lines between a 3.3V USB transceiver and a 5V-capable microcontroller GPIO bank. IC Role / Device Role / Timing Role: Voltage-level translator and bus isolator ensuring bidirectional D+ and D− signal compatibility. Use Value: Supports 0–5V signaling levels including 3.3V and 2.5V, with 5pF OFF-state capacitance minimizing USB signal rise-time degradation. |
| Memory Interleaving Control | Low-Power Portable System Bus Switching |
|
Use Scenario: Dynamically routing address/data between two memory banks operating at different voltages (e.g., 3.3V SDRAM and 2.5V LPDDR). IC Role / Device Role / Timing Role: Low-latency, bidirectional bus switch enabling time-multiplexed access without level-shifter latency penalties. Use Value: VCC-tracking output translation allows seamless switching between 2.5V and 3.3V domains; Ioff prevents leakage during memory bank power-down. |
Use Scenario: Enabling/disabling peripheral buses in handheld devices to minimize standby current and extend battery life. IC Role / Device Role / Timing Role: Power-gated bus isolator activated via OE to disconnect inactive peripherals from main SoC bus. Use Value: 40μA max ICC and Ioff support sub-μA system sleep states; TVSOP package enables compact layout in space-constrained mobile designs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FET bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBT3245CPW | Higher ron (7Ω typ), TSSOP-20 package, no Ioff support, 3.3V-only VCC range (3.0–3.6V) | Lacks 5V-tolerance during power-down and mixed-voltage flexibility - limited to fixed 3.3V systems | Select only if cost sensitivity outweighs need for partial-power-down safety and 2.5V domain support |
| SN74LVC245APW | CMOS-based transceiver (not FET switch), higher propagation delay (>3ns), no VCC-tracking level shift | Requires external level-shifting circuitry for 5V↔3.3V interfacing; not suitable for true bidirectional zero-delay paths | Choose only when direction control (DIR pin) is preferred over OE-only control and latency is non-critical |
Compared with SN74CB3T3245DGVR, SN74CBT3245CPW offers lower cost but sacrifices Ioff protection and 2.5V operation, while SN74LVC245APW provides direction control at the expense of latency and native level-shifting capability - making SN74CB3T3245DGVR uniquely suited for low-latency, mixed-voltage, power-aware bus isolation.
Availability
SN74CB3T3245DGVR is available at Aetrix Electronics and suitable for PCI interface isolation, USB 2.0 data line translation, and memory interleaving applications requiring stable component supply, long-term industrial lifecycle support, and RoHS-compliant TVSOP packaging.
Supply support for SN74CB3T3245DGVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in high-performance logic and interface solutions.
The SN74CB3T3245DGVR belongs to TI's CB3T family of FET bus switches, designed specifically for low-latency, mixed-voltage system interconnects in portable, industrial, and communications equipment where power efficiency and signal integrity are critical.
FAQ
What is the maximum allowable I/O voltage for SN74CB3T3245DGVR when VCC = 0V?
SN74CB3T3245DGVR supports 0V to 5.5V on all I/O pins (A1–A8, B1–B8) regardless of VCC state, including full power-down (VCC = 0V). This 5V tolerance is guaranteed per absolute maximum ratings and enables safe hot-plug operation and interoperability with legacy 5V subsystems without risk of latch-up or damage.
Does SN74CB3T3245DGVR require external pull-up resistors on the OE pin?
Yes - to ensure a defined high-impedance state during power-up or power-down, OE must be tied to VCC through an external pull-up resistor. TI specifies the minimum resistor value based on the driver's current-sinking capability; typical values range from 4.7kΩ to 10kΩ depending on system drive strength and noise margin requirements.
Can SN74CB3T3245DGVR translate 1.8V signals to 3.3V?
No - SN74CB3T3245DGVR performs down-translation only: output voltage tracks VCC, so it can shift 5V or 3.3V inputs down to 3.3V or 2.5V outputs, but cannot boost 1.8V to 3.3V. For up-translation, a dedicated level shifter such as TXB0108 is required.
What is the thermal resistance (RθJA) of SN74CB3T3245DGVR in its TVSOP package?
SN74CB3T3245DGVR in the DGV (TVSOP-20) package has a junction-to-ambient thermal resistance of 123.7°C/W under standard JEDEC test conditions. This value assumes a 1-inch² copper pad on a 2-layer board and informs thermal design for continuous 128mA-per-channel operation at 85°C ambient.
How does the Ioff feature protect systems during partial power-down?
The Ioff feature disables current flow through SN74CB3T3245DGVR when VCC = 0V, preventing damaging back-current from live 5V I/Os into a powered-down subsystem. Measured at ≤10μA off-state leakage, this ensures isolation integrity and complies with JESD78 latch-up immunity standards for robust system-level power sequencing.
SN74CB3T3245DGVR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CB
- Package/Case:
- 20-TFSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Bus Switch
- Circuit:
- 8 x 1:1
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-TVSOP
SN74CB3T3245DGVR FAQ
1.How can I place an order for SN74CB3T3245DGVR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CB3T3245DGVR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74CB3T3245DGVR reliable?
The price and inventory of SN74CB3T3245DGVR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CB3T3245DGVR is usually 5 days.
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Once your SN74CB3T3245DGVR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74CB3T3245DGVR?
For technical support, including SN74CB3T3245DGVR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CB3T3245DGVR requirements.
6.How does Aetrix verify that SN74CB3T3245DGVR is sourced from the original manufacturer or authorized distributors?
All SN74CB3T3245DGVR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CB3T3245DGVR meets industry standards.
7.What is the process for return or replacement of SN74CB3T3245DGVR?
All SN74CB3T3245DGVR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CB3T3245DGVR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CB3T3245DGVR part is unused and in its original packaging.
Return procedure for SN74CB3T3245DGVR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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