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Texas Instruments SN74CB3T3253DGVR
- Part No.:
- SN74CB3T3253DGVR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 16-TFSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74CB3T3253DGVR.pdf
- Description:
- IC MUX/DEMUX 2 X 4:1 16TVSOP
- Quantity:
- Payment:
- Shipping:
Inventory:4,200
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Product details
Overview
SN74CB3T3253 from Texas Instruments is a dual 1-of-4 FET multiplexer/demultiplexer optimized for low-voltage bus switching with 5V-tolerant I/Os, 5Ω typical ON-state resistance, bidirectional near-zero propagation delay (≤0.25 ns), and VCC-operated voltage translation across 2.3V–3.6V supply range - deployed in USB interface signal routing and mixed-voltage memory interleaving.
For engineers reviewing the SN74CB3T3253 datasheet, SN74CB3T3253 pinout, SN74CB3T3253 application, or SN74CB3T3253 equivalent, key selection criteria include 5V-tolerant I/O operation with powered-down isolation (Ioff), sub-10 ns enable/disable timing, 5pF typical OFF-state I/O capacitance, and TVSOP-16 package compatibility with high-density PCB layouts.
Technical Context
The SN74CB3T3253 implements two independent 4:1 analog switch paths, each controlled by active-low OE and 2-bit binary S1/S0 select inputs, enabling bidirectional signal flow between common A ports and four B-channel I/Os per section. Its FET-based architecture delivers rail-to-rail switching and supports mixed-mode signaling without level-shifter ICs.
Voltage translation is achieved via VCC-tracked output drive: when VCC = 2.5V, 5V inputs translate to ~2.5V outputs; at VCC = 3.3V, 5V/3.3V inputs translate down to 3.3V outputs. The device maintains 5V tolerance on all I/Os regardless of VCC state - including during power-up/down - and guarantees isolation via Ioff current ≤±10 µA at 0V VCC.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3V to 3.6V - enables interoperability with 2.5V and 3.3V logic domains while maintaining 5V I/O tolerance |
| rON (typ) | 5Ω - minimizes insertion loss and signal distortion in high-speed digital buses up to 100+ MHz |
| CIO(OFF) (typ) | 5pF - reduces capacitive loading on source and destination buses, preserving signal integrity and timing margins |
| tpd (max) | 0.25 ns at 3.3V - ensures sub-nanosecond propagation delay for critical timing paths in USB 2.0 and memory interfaces |
| Ioff (max) | ±10 µA - prevents backflow current and enables safe partial-power-down operation in hot-swap systems |
| ESD Rating (HBM) | ±2000V - meets Class II ESD robustness for industrial and portable equipment handling environments |
| Operating Temp | –40°C to +85°C - qualified for extended-temperature industrial and automotive cabin applications |
Pinout & Package
SN74CB3T3253DGVR uses a 16-pin TVSOP (Thin Very Small Outline Package) with 0.65 mm pitch, 3.60 mm × 6.0 mm body size, and exposed pad-free construction - optimized for automated assembly and thermal performance in space-constrained designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE, 15OE | Active-low output enable (per channel) | Controls ON/OFF state of Channel 1 or 2 independently; OE high forces high-impedance isolation between A and B ports |
| S1, S0 (pins 2, 14) | Binary select inputs | Determines which of four B-port channels connects to the common A port (L/L → B1, L/H → B2, H/L → B3, H/H → B4) |
| 1A, 2A (pins 7, 9) | Common I/O ports | Bidirectional data path hubs - connect to system bus or controller; support 0V–5V signaling regardless of VCC |
| 1B1–1B4, 2B1–2B4 (pins 3–6, 10–13) | Channel I/O terminals | Four per channel; each provides 5V-tolerant, low-capacitance connection to peripheral devices or memory banks |
| VCC (pin 16), GND (pin 8) | Power and reference | VCC sets translation voltage level; GND establishes return path - both required for Ioff isolation and clamp diode operation |
Key Features
| Feature | Design Value |
|---|---|
| 5V-tolerant I/Os with powered-down isolation | Enables live insertion into 5V systems while VCC is off - eliminates need for external isolation switches in modular backplanes |
| VCC-tracked voltage translation | Automatically scales output levels to match VCC (e.g., 5V→2.5V at 2.5V VCC), removing discrete level shifters in multi-rail SoC interconnects |
| Bidirectional low-latency switching | Sub-0.3 ns propagation delay and <10 ns enable/disable times preserve timing budgets in USB 2.0 and DDR memory multiplexing |
| Low ON-resistance & capacitance | 5Ω rON and 5pF CIO(OFF) minimize RC delay and crosstalk - critical for maintaining eye diagram integrity above 100 Mbps |
| Undershoot clamp diodes | Protects connected logic from negative transients down to –1.2V, improving reliability in noisy industrial bus environments |
Applications
| USB 2.0 Signal Routing | Memory Interleaving |
|---|---|
|
Use Scenario: Switching differential D+/D− lines between multiple USB hosts and a single peripheral in embedded test fixtures. IC Role / Device Role / Timing Role: Dual-channel bidirectional analog switch providing 4:1 multiplexing per data line with matched trace lengths and sub-ns skew control. Use Value: Eliminates mechanical relays and discrete MOSFET arrays - reduces board area by 65% and enables software-controlled port selection without signal degradation. |
Use Scenario: Dynamically routing address/data lines between two DDR2 memory banks sharing a single controller in FPGA-based accelerators. IC Role / Device Role / Timing Role: Low-rON, low-CIO bus switch enabling time-multiplexed access with <10 ns setup/hold margin preservation. Use Value: Doubles effective memory bandwidth without doubling controller pins - supports real-time video buffering with zero added latency. |
| Industrial Bus Isolation | Mixed-Voltage Sensor Hub |
|
Use Scenario: Isolating Modbus RTU RS-485 transceivers from a 3.3V microcontroller during firmware updates or fault recovery. IC Role / Device Role / Timing Role: High-impedance disconnect switch activated by OE during power-down sequences - maintains 5V bus integrity while MCU resets. Use Value: Prevents bus contention and latch-up during brown-out conditions - extends field lifetime in unattended remote monitoring nodes. |
Use Scenario: Aggregating I²C signals from 1.8V, 2.5V, and 3.3V sensors (temperature, pressure, IMU) onto a single 3.3V host interface. IC Role / Device Role / Timing Role: Voltage-translating multiplexer enabling protocol-transparent signal aggregation without pull-up conflicts or level-shifter delays. Use Value: Reduces BOM count by three dedicated level shifters and simplifies layout - achieves <1 µA quiescent current in sensor sleep mode. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FET multiplexer/demultiplexer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTLV3253PWR | Same functional block and pinout; lower rON (3Ω typ) but narrower VCC range (2.3V–3.6V same), identical Ioff and ESD specs | Preferred for ultra-low-distortion applications like high-fidelity audio routing where <3Ω rON reduces THD | Select SN74CBTLV3253PWR if sub-3Ω rON is required and TVSOP-16 footprint is acceptable; verify thermal derating at >85°C ambient |
| TS3A227EYZTR | Single-supply 3.3V-only operation (no 2.5V mode); higher CIO(OFF) (12pF); supports 1.8V control logic but lacks 5V I/O tolerance | Suitable for cost-sensitive consumer IoT hubs with uniform 3.3V rails and no legacy 5V peripherals | Choose TS3A227EYZTR only for new 3.3V-only designs - avoid where 5V-tolerance or mixed-voltage translation is needed |
Compared with SN74CB3T3253DGVR, SN74CBTLV3253PWR offers tighter rON for precision analog routing, while TS3A227EYZTR trades 5V tolerance and voltage translation for lower unit cost in homogeneous 3.3V systems - neither is pin-compatible without layout revision.
Availability
SN74CB3T3253DGVR is available at Aetrix Electronics and suitable for USB interface routing, memory interleaving, industrial bus isolation, and mixed-voltage sensor hub applications requiring stable component supply across production lifecycles.
Supply support for SN74CB3T3253DGVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog and embedded processing solutions, with over 90 years of innovation in precision analog, power management, and interface technologies.
The SN74CB3T3253 belongs to TI's CB3T bus switch family, engineered specifically for low-latency, voltage-translating multiplexing in mixed-signal systems where 5V legacy compatibility and 2.5V/3.3V modern logic coexist.
FAQ
What is the maximum data rate supported by SN74CB3T3253DGVR?
The SN74CB3T3253DGVR does not specify a hard data rate limit but supports signal integrity up to ≥100 Mbps in typical USB 2.0 and memory bus applications due to its 5Ω rON, 5pF CIO(OFF), and ≤0.25 ns propagation delay. Actual usable rate depends on trace length, termination, and load capacitance - design validation is recommended for >200 Mbps operation.
Can SN74CB3T3253DGVR operate with VCC = 2.5V while interfacing to 5V logic?
Yes. The SN74CB3T3253DGVR supports 5V-tolerant I/Os at any VCC from 2.3V to 3.6V. At VCC = 2.5V, it translates 5V inputs down to ~2.5V outputs while maintaining full bidirectional functionality and Ioff isolation - confirmed in Typical DC Voltage-Translation Characteristics (Figure 5-1).
Does SN74CB3T3253DGVR require external pull-up resistors on OE pins?
Yes - to ensure defined high-impedance state during power-up/power-down, TI recommends tying OE pins to VCC via a pull-up resistor. Minimum value depends on driver sink capability; typical values range from 4.7kΩ to 10kΩ. This prevents undefined switching states that could cause bus contention before firmware initializes controls.
How does the Ioff feature protect SN74CB3T3253DGVR in partial-power-down systems?
The Ioff feature limits current to ±10 µA when VCC = 0V, preventing damaging backflow from live 5V buses into unpowered circuitry. This enables safe hot-swap operation in modular systems - for example, inserting an SN74CB3T3253DGVR-equipped daughterboard into a powered-backplane without risking latch-up or supply rail collapse.
Is SN74CB3T3253DGVR pin-compatible with older SN74CBT3253 variants?
No. SN74CB3T3253DGVR is not pin-compatible with SN74CBT3253 - the latter uses different select logic (active-high vs. active-low OE), lacks Ioff, and has higher rON (7Ω typ). Migration requires schematic and layout changes; TI explicitly positions SN74CB3T3253 as a functional upgrade, not drop-in replacement.
SN74CB3T3253DGVR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CB
- Package/Case:
- 16-TFSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Multiplexer/Demultiplexer
- Circuit:
- 2 x 4:1
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-TVSOP
SN74CB3T3253DGVR FAQ
1.How can I place an order for SN74CB3T3253DGVR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CB3T3253DGVR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74CB3T3253DGVR reliable?
The price and inventory of SN74CB3T3253DGVR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CB3T3253DGVR is usually 5 days.
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SN74CB3T3253DGVR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74CB3T3253DGVR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74CB3T3253DGVR?
For technical support, including SN74CB3T3253DGVR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CB3T3253DGVR requirements.
6.How does Aetrix verify that SN74CB3T3253DGVR is sourced from the original manufacturer or authorized distributors?
All SN74CB3T3253DGVR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CB3T3253DGVR meets industry standards.
7.What is the process for return or replacement of SN74CB3T3253DGVR?
All SN74CB3T3253DGVR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CB3T3253DGVR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CB3T3253DGVR part is unused and in its original packaging.
Return procedure for SN74CB3T3253DGVR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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