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Texas Instruments SN74CB3T3257DGVR

Part No.:
SN74CB3T3257DGVR
Manufacturer:
Texas Instruments
Category:
Signal Switches, Multiplexers, Decoders
Package:
16-TFSOP (0.173", 4.40mm Width)
Datasheet:
AetrixSN74CB3T3257DGVR.pdf
Description:
IC MUX/DEMUX 4 X 2:1 16TVSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,239

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Product details

Overview

SN74CB3T3257DGVR from Texas Instruments is a 4-bit 1-of-2 FET multiplexer/demultiplexer with bidirectional signal flow, 5Ω typical ON-state resistance, 5V-tolerant I/Os, and VCC-referenced voltage translation supporting 2.5V/3.3V systems. It enables level-shifting between 0V–5V signaling domains in USB interfaces and memory interleaving applications.

For engineers reviewing the SN74CB3T3257DGVR datasheet, SN74CB3T3257DGVR pinout, SN74CB3T3257DGVR application, or SN74CB3T3257DGVR equivalent, key selection criteria include its 2.3V–3.6V supply range, −40°C to +85°C operating temperature, Ioff partial-power-down capability, and TVSOP-16 package compatibility with high-density PCB layouts.

Technical Context

The SN74CB3T3257DGVR implements four independent analog switches controlled by a shared select (S) and active-low output-enable (OE) input. Each switch supports rail-to-rail signal transmission with near-zero propagation delay (0.15 ns at 2.5V) and maintains high-impedance isolation when disabled.

Its mixed-mode operation relies on FET-based switching with gate drive referenced to VCC, enabling automatic output voltage translation - e.g., 5V input yields ~3.3V output when VCC = 3.3V, and ~2.5V output when VCC = 2.5V. The device meets JESD 17 latch-up immunity (>250 mA) and JESD 22 ESD ratings (±2000V HBM, ±1000V CDM).

Key Specifications

Parameter Value and Actual Design Meaning
VCC Range 2.3V to 3.6V - defines compatible low-voltage logic domains (2.5V/3.3V systems) without external level shifters
ron (Typ) 5Ω - minimizes signal attenuation and timing skew across all 4 channels in high-speed bus applications
I/O Voltage Range 0V to 5.5V - supports 5V-tolerant operation even during power-up/down, enabling safe hot-swap and mixed-voltage system integration
tpd (Max) 0.25 ns at 3.3V - ensures sub-nanosecond signal path delay for >200 MHz digital bus operation
Ioff Leakage ±10 µA - prevents backdrive current during partial power-down, protecting unpowered downstream circuitry
Operating Temp −40°C to +85°C - qualified for industrial-grade embedded and portable equipment environments
Cio(OFF) (Typ) 5 pF - reduces capacitive loading on source and destination buses, preserving signal integrity in high-frequency switching

Pinout & Package

SN74CB3T3257DGVR uses a 16-pin TVSOP (Thin Very Small Outline Package) with 3.60 mm × 6.40 mm footprint and 0.5 mm lead pitch, optimized for space-constrained PCB layouts while maintaining thermal performance (RθJA = 120°C/W).

Pin/Terminal Circuit Role Design Meaning
1A, 2A, 3A, 4A Common I/O port (multiplexer input/output) Connects bidirectionally to selected B-side channel; serves as central data hub for each of four independent switch paths
1B1–4B1 Channel 1 I/O port (B1 side) First selectable path per channel; tied to A port when S = L and OE = L
1B2–4B2 Channel 2 I/O port (B2 side) Second selectable path per channel; tied to A port when S = H and OE = L
OE (Pin 15) Active-low output enable Asserting high disconnects all A–B paths into high-impedance state; required for bus isolation and power sequencing control
S (Pin 1) Channel select Determines routing: S = L connects A to B1; S = H connects A to B2 - enables dynamic 2:1 multiplexing per bit
VCC (Pin 16) Supply voltage Powers internal FET gates and level-shifting circuitry; sets output voltage reference for translation functionality
GND (Pin 8) Ground reference Provides return path for switch current and establishes common reference for all I/O voltage levels

Key Features

Feature Design Value
Voltage translation tracking VCC Output level automatically scales with VCC (e.g., 5V→3.3V at VCC=3.3V), eliminating need for external level-shifters in mixed-voltage designs
5V-tolerant I/Os powered up/down Withstands 0V–5.5V signals regardless of VCC state - enables safe interface to legacy 5V peripherals in modern low-voltage systems
Bidirectional zero-delay switching Signal passes equally well from A→B or B→A with <0.25 ns propagation delay - preserves timing margins in full-duplex or shared-bus configurations
Ioff partial-power-down protection Blocks damaging back-current when VCC = 0V, allowing live insertion/removal and enabling system-level power gating
Low capacitance (Cio(OFF) = 5 pF) Minimizes loading on source and destination nodes - critical for maintaining signal rise/fall times in high-speed parallel buses

Applications

USB Interface Isolation Memory Interleaving

Use Scenario: Isolating USB 2.0 data lines (D+/D−) between a 3.3V host controller and 5V peripheral during enumeration or fault conditions.

IC Role / Device Role / Timing Role: Bidirectional analog switch providing hot-plug-safe, low-capacitance signal path with 5V tolerance and sub-ns delay.

Use Value: Enables direct connection without external clamping or level-shifting components while meeting USB 2.0 eye diagram requirements.

Use Scenario: Dynamically routing 32-bit address/data bus between two identical SRAM banks in a microcontroller-based data logger.

IC Role / Device Role / Timing Role: 4-bit 1-of-2 multiplexer enabling bank-select switching with simultaneous channel control via shared S and OE inputs.

Use Value: Reduces PCB layer count by consolidating routing into compact TVSOP-16 package while maintaining <1 ns inter-channel skew.

Low-Power Portable Equipment Bus Isolation in Industrial PLCs

Use Scenario: Managing shared I²C or SPI bus between 2.5V sensor subsystem and 3.3V application processor in battery-powered wearable devices.

IC Role / Device Role / Timing Role: Level-translating bus switch supporting 0.8V–5V signaling with Ioff-enabled power-gating during sleep mode.

Use Value: Cuts quiescent current to ≤20 µA and eliminates leakage paths, extending battery life without compromising wake-up latency.

Use Scenario: Electrically isolating fieldbus communication lines (e.g., RS-485 transceiver outputs) from main controller during firmware updates or fault recovery.

IC Role / Device Role / Timing Role: High-impedance disconnect switch activated via OE to break signal continuity while maintaining 5V-tolerant I/O protection.

Use Value: Prevents bus contention and noise injection during reconfiguration, improving system reliability in harsh EMI environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FET bus switch applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74CBTLV3257DGVR Lower ron (3Ω typ), higher ICC (max 40 µA), same VCC range and pinout Better for ultra-low-loss signal paths (e.g., high-speed DDR traces); less suitable where ultra-low standby current is critical Choose when minimizing ON-resistance dominates over quiescent power; verify layout supports tighter timing margins
TS3A227EYZTR Single-supply 1.65V–3.6V operation, no 5V tolerance, 0.9Ω ron, different 16-pin DQFN package Designed for mobile SoC I/O expansion only; incompatible with 5V peripherals or mixed-voltage domains Select only for pure 1.8V/2.5V/3.3V systems requiring lowest possible ron; requires PCB redesign due to non-pin-compatible DQFN

Compared with SN74CBTLV3257DGVR and TS3A227EYZTR, the SN74CB3T3257DGVR uniquely balances 5V tolerance, ultra-low leakage (20 µA max), and proven industrial temperature support - making it optimal for mixed-voltage embedded systems where robustness and compatibility outweigh marginal ron reduction.

Availability

SN74CB3T3257DGVR is available at Aetrix Electronics and suitable for USB interface isolation, memory interleaving, low-power portable equipment, and bus isolation in industrial PLCs requiring stable component supply across extended product lifecycles.

Supply support for SN74CB3T3257DGVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions, with leadership in signal chain and power management technologies.

The SN74CB3T3257DGVR belongs to TI's CB3T family of low-voltage FET bus switches, engineered specifically for voltage translation and bidirectional signal routing in mixed-voltage digital systems.

FAQ

What is the maximum signal frequency supported by the SN74CB3T3257DGVR?

The SN74CB3T3257DGVR is characterized for operation up to 200 MHz in typical applications. Its 0.15–0.25 ns propagation delay and 5 pF OFF-state capacitance preserve signal integrity at these frequencies, though actual usable bandwidth depends on PCB layout, load capacitance, and termination. The device does not specify a hard cutoff frequency but is validated for high-speed digital bus use including USB 2.0 and memory address/data routing.

Does the SN74CB3T3257DGVR support true bidirectional signal flow?

Yes, the SN74CB3T3257DGVR supports fully bidirectional signal flow with identical electrical characteristics in both directions. Each of its four independent FET switches operates symmetrically - meaning signals pass from A to B1/B2 or from B1/B2 to A with the same ron (5Ω typ), Cio (5 pF OFF), and tpd (0.15–0.25 ns). This symmetry is inherent to its analog switch architecture and confirmed in the functional description and test conditions.

How does the SN74CB3T3257DGVR handle level translation between 5V and 3.3V domains?

The SN74CB3T3257DGVR performs passive level translation by tracking VCC: when VCC = 3.3V, a 5V input on any I/O pin produces a ~3.3V output on the connected port; when VCC = 2.5V, the same 5V input yields ~2.5V output. This occurs because the FET gate drive is referenced to VCC, clamping the output voltage to VCC minus threshold. No external components or configuration are needed - translation is automatic and inherent to the device's architecture.

Can the SN74CB3T3257DGVR be used with VCC = 0V (fully powered down)?

Yes - the SN74CB3T3257DGVR supports full 5V-tolerant I/O operation even when VCC = 0V. Its Ioff feature ensures that no damaging back-current flows between I/O pins under this condition, and all switches remain in high-impedance state. This allows safe hot-plug operation and system-level power gating. However, OE must be held high (e.g., via pullup) to guarantee isolation during power transitions.

What is the thermal resistance (RθJA) of the SN74CB3T3257DGVR in its TVSOP package?

The SN74CB3T3257DGVR in the DGV (TVSOP-16) package has a junction-to-ambient thermal resistance (RθJA) of 120°C/W under standard JEDEC test conditions. This value assumes a 2-layer PCB with minimal copper area; actual thermal performance improves significantly with enhanced copper pour, thermal vias, or multi-layer board design. The datasheet confirms this rating applies specifically to the DGV variant used in SN74CB3T3257DGVR.

SN74CB3T3257DGVR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74CB
Package/Case:
16-TFSOP (0.173", 4.40mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Multiplexer/Demultiplexer
Circuit:
4 x 2:1
Independent Circuits:
1
Current - Output High, Low:
-
Voltage Supply Source:
Single Supply
Voltage - Supply:
2.3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-TVSOP

SN74CB3T3257DGVR FAQ

1.How can I place an order for SN74CB3T3257DGVR through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74CB3T3257DGVR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74CB3T3257DGVR reliable?

The price and inventory of SN74CB3T3257DGVR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CB3T3257DGVR is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74CB3T3257DGVR?

For technical support, including SN74CB3T3257DGVR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CB3T3257DGVR requirements.

6.How does Aetrix verify that SN74CB3T3257DGVR is sourced from the original manufacturer or authorized distributors?

All SN74CB3T3257DGVR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CB3T3257DGVR meets industry standards.

7.What is the process for return or replacement of SN74CB3T3257DGVR?

All SN74CB3T3257DGVR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CB3T3257DGVR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74CB3T3257DGVR part is unused and in its original packaging.

Return procedure for SN74CB3T3257DGVR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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