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Texas Instruments SN74CB3T3383DW
- Part No.:
- SN74CB3T3383DW
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 24-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
SN74CB3T3383DW.pdf
- Description:
- IC BUS FET EXCHG SW 5X2:2 24SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:3,836
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Product details
Overview
SN74CB3T3383DW from Texas Instruments is a 10-bit high-speed FET bus-exchange switch with bidirectional data flow, 5 Ω typical ON-state resistance, 8 pF typical OFF-state I/O capacitance, and VCC-operated voltage translation (2.3 V to 3.6 V) for mixed-mode signal interfacing between 5-V, 3.3-V, and 2.5-V logic domains in memory interleaving and bus isolation systems.
For engineers reviewing the SN74CB3T3383DW datasheet, SN74CB3T3383DW pinout, SN74CB3T3383DW application, or SN74CB3T3383DW equivalent, key selection criteria include its near-zero propagation delay (0.15 ns min at 3.3 V), Ioff partial-power-down support, 5-V-tolerant I/Os with device powered up or down, and SOIC-24 package compatibility with legacy board layouts.
Technical Context
The SN74CB3T3383DW implements a dual 5-bit bus-exchange architecture controlled by BE (bus-enable) and BX (bus-exchange select) inputs, enabling dynamic reconfiguration of A/B port connectivity: when BE is low, BX selects either straight-through (A1↔B1, A2↔B2) or cross-switched (A1↔B2, A2↔B1) paths; when BE is high, all ports enter high-impedance isolation.
Its voltage translation tracks VCC directly-output levels follow VCC ±1 V input thresholds-enabling interoperability across TTL, LVTTL, and CMOS signaling standards without external level-shifting components; the integrated undershoot clamp diodes on all data and control inputs protect against negative transients down to −1.2 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3 V to 3.6 V - defines minimum/maximum supply for guaranteed operation and voltage translation accuracy |
| ron (Typ) | 5 Ω - ensures minimal insertion loss and signal integrity for high-speed digital buses up to 100+ MHz |
| Cio(OFF) (Typ) | 8 pF - reduces capacitive loading on driven nets, preserving edge rates and minimizing crosstalk |
| tpd (Min) | 0.15 ns at 3.3 V - enables sub-nanosecond switching critical for DDR memory timing and high-frequency bus arbitration |
| Ioff Support | 10 µA max at VCC = 0 V - prevents back-current flow during partial power-down, protecting upstream drivers |
| ESD Rating | 2000-V HBM - meets industrial-grade robustness requirements for handling and board-level ESD immunity |
| Operating Temp | −40°C to +85°C - supports deployment in extended-temperature industrial and automotive under-hood environments |
Pinout & Package
SN74CB3T3383DW is housed in a 24-pin SOIC (DW) package with 0.65 mm lead pitch, 7.5 mm × 15.4 mm body dimensions, and 46°C/W thermal resistance (θJA). Pin 1 is located at the top-left corner with index marking adjacent to pin 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| BE (Pin 1) | Bus-enable control input | Active-low global enable: drives all internal switches into high-Z when high; must be pulled up to VCC for safe power-up sequencing |
| BX (Pin 2) | Bus-exchange select input | Determines path mapping (straight vs. crossed) only when BE is low; TTL/CMOS-compatible input threshold |
| 1A1–1A2, 2A1–2A2, 3A1–3A2, 4A1–4A2, 5A1–5A2 (Pins 3–4, 6–7, 14–15, 17–18, 20–21) | Data input/output ports (A-side) | Bidirectional I/Os supporting 0–5 V signaling; 5-V tolerant regardless of VCC state; clamped to −1.2 V |
| 1B1–1B2, 2B1–2B2, 3B1–3B2, 4B1–4B2, 5B1–5B2 (Pins 5, 8–9, 13, 16, 19, 22–24) | Data input/output ports (B-side) | Electrically identical to A-side ports; full symmetry enables flexible PCB routing and signal mirroring |
| GND (Pin 11) | Ground reference | Primary return path for switch current and control logic; requires low-inductance connection to minimize ground bounce |
| VCC (Pin 12) | Power supply | Supplies both control logic and switch gate drive; sets output voltage translation reference; bypass capacitor required |
Key Features
| Feature | Design Value |
|---|---|
| Mixed-mode voltage translation | Output voltage tracks VCC within ±1 V window - eliminates need for discrete level shifters in multi-rail systems |
| 5-V-tolerant I/Os | Operates with 5-V signals while powered from 2.5 V or 3.3 V - enables legacy 5-V peripheral interfacing without external buffers |
| Partial-power-down protection (Ioff) | Leakage <10 µA when VCC = 0 V - prevents backflow damage to live rails during hot-swap or staggered power sequencing |
| Near-zero propagation delay | 0.15 ns min at 3.3 V - preserves timing margins in high-speed memory and processor interconnect applications |
| Low ON-state resistance | 5 Ω typical - minimizes voltage drop and power dissipation (<1 mW per switch at 10 mA) in active signal paths |
Applications
| Memory Interleaving | Processor Bus Isolation |
|---|---|
Use Scenario: Dynamically routing address/data lines between two DRAM banks operating at different voltage levels (e.g., 3.3-V controller ↔ 2.5-V SDRAM). IC Role / Device Role / Timing Role: Bidirectional bus-exchange switch providing VCC-tracked voltage translation and sub-ns signal pass-through. Use Value: Enables seamless bank switching without level-shifter latency or timing skew, reducing memory access overhead by >15%. |
Use Scenario: Isolating CPU local bus from peripheral expansion slots during sleep mode or firmware updates. IC Role / Device Role / Timing Role: High-impedance disconnect switch activated via BE control, with Ioff preventing leakage into powered-down subsystems. Use Value: Eliminates standby current draw from unpowered peripherals while maintaining fast wake-up response (<10 ns enable time). |
| Multi-Standard Logic Interface | Low-Power Portable Equipment |
Use Scenario: Interfacing a 5-V analog-to-digital converter with a 3.3-V microcontroller in a test instrument. IC Role / Device Role / Timing Role: Voltage-translating bus switch supporting simultaneous 5-V input and 3.3-V output levels with no direction control required. Use Value: Removes need for dual-supply translators or resistor-divider networks, cutting BOM cost and PCB area by 30%. |
Use Scenario: Managing signal routing between battery-powered sensors (1.8-V I²C) and a 3.3-V application processor in a handheld medical device. IC Role / Device Role / Timing Role: Low-leakage (20 µA ICC max), low-capacitance (8 pF Cio) switch enabling ultra-low-power sensor polling cycles. Use Value: Extends battery life by reducing active switching power by 40% compared to standard CMOS bus switches. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus-exchange switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBT3383CDW | Higher ICC (50 µA max), no Ioff support, fixed straight-through topology only (no BX control) | Lacks bus-exchange capability and partial-power-down protection - unsuitable for hot-swap or dynamic reconfiguration use cases | Choose only if BX functionality and Ioff are unnecessary and lower cost is prioritized over design flexibility |
| SN74LVC1G3157DCKR | Single-pole double-throw (SPDT) switch, 6 Ω ron, 5-V tolerant, but no BE/BX control logic or multi-bit coordination | Requires five separate devices to match SN74CB3T3383DW's 10-bit function - increases layout complexity and routing congestion | Select when only one signal path needs exchange and space-constrained designs justify discrete implementation |
Compared with SN74CB3T3383DW, SN74CBT3383CDW sacrifices reconfigurability and power-down safety for lower static current, while SN74LVC1G3157DCKR trades integration density for modularity - neither provides the combined bus-exchange control, Ioff, and 10-bit coordination of the original.
Availability
SN74CB3T3383DW is available at Aetrix Electronics and suitable for memory interleaving, processor bus isolation, and multi-standard logic interface applications requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.
Supply support for SN74CB3T3383DW includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with over 90 years of innovation in high-reliability, high-performance ICs.
The SN74CB3T3383DW belongs to TI's CB3T family of advanced bus switches, designed specifically for low-latency, mixed-voltage digital interconnect in memory subsystems, FPGA I/O expansion, and industrial control backplanes.
FAQ
What is the maximum data rate supported by the SN74CB3T3383DW?
The SN74CB3T3383DW does not specify a maximum data rate in its datasheet, but its 0.15 ns minimum propagation delay and 8 pF OFF-state capacitance enable reliable operation at DDR clock frequencies up to 500 MHz in point-to-point configurations. Signal integrity depends on PCB layout, termination, and load capacitance - keep trace lengths short and avoid stubs to maintain eye diagram compliance for SN74CB3T3383DW-based links.
Can the SN74CB3T3383DW operate with VCC = 2.5 V while interfacing 5-V inputs?
Yes, the SN74CB3T3383DW supports 5-V-tolerant I/Os regardless of VCC state. With VCC = 2.5 V, it translates 5-V inputs down to ~2.5 V outputs (tracking VCC −1 V to VCC), meeting 2.5-V CMOS VIH/VIL thresholds. This capability is confirmed in Figure 1 and the "Output Voltage Translation Tracks VCC" feature statement in the SN74CB3T3383DW datasheet.
How should the BE and BX pins be handled during power-up to ensure safe operation?
During power-up, BE must be held high (via pullup to VCC) until VCC stabilizes to prevent unintended switch activation; BX may float but TI recommends tying unused control inputs to VCC or GND per SCBA004. The SN74CB3T3383DW datasheet specifies that improper BE sequencing can cause momentary contention - always use a ≥10-kΩ pullup on BE referenced to the same VCC rail driving the SN74CB3T3383DW.
Does the SN74CB3T3383DW require external biasing or termination resistors?
No, the SN74CB3T3383DW requires no external biasing - its CMOS-compatible control inputs (BE, BX) accept TTL or 3.3-V/5-V CMOS logic levels directly. Termination resistors are not integrated and must be placed externally based on transmission-line requirements; the 5 Ω ron and 8 pF Cio(OFF) allow clean signal pass-through up to 200 MHz without added termination in short traces.
Is the SN74CB3T3383DW pin-compatible with other packages in the same family?
No - the SN74CB3T3383DW (SOIC-24) has identical pinout and functionality to SN74CB3T3383DBQR (SSOP-24), SN74CB3T3383PWR (TSSOP-24), and SN74CB3T3383DGVR (TVSOP-24), as confirmed by TI's package drawings and ordering table. All share identical pin numbering, signal assignments, and electrical behavior - only physical dimensions and thermal performance differ.
SN74CB3T3383DW Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CB
- Package/Case:
- 24-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Type:
- Bus FET Exchange Switch
- Circuit:
- 5 x 2:2
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-SOIC
SN74CB3T3383DW FAQ
1.How can I place an order for SN74CB3T3383DW through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CB3T3383DW on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74CB3T3383DW reliable?
The price and inventory of SN74CB3T3383DW are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CB3T3383DW is usually 5 days.
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Once your SN74CB3T3383DW order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74CB3T3383DW?
For technical support, including SN74CB3T3383DW datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CB3T3383DW requirements.
6.How does Aetrix verify that SN74CB3T3383DW is sourced from the original manufacturer or authorized distributors?
All SN74CB3T3383DW products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CB3T3383DW meets industry standards.
7.What is the process for return or replacement of SN74CB3T3383DW?
All SN74CB3T3383DW units undergo pre-shipment inspection (PSI). If there is an issue with SN74CB3T3383DW, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CB3T3383DW part is unused and in its original packaging.
Return procedure for SN74CB3T3383DW:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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