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Texas Instruments SN74CB3T3383PW
- Part No.:
- SN74CB3T3383PW
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 24-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74CB3T3383PW.pdf
- Description:
- IC BUS FET EXCH SW 5X2:2 24TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:540
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Product details
Overview
SN74CB3T3383PW from Texas Instruments is a 10-bit FET bus-exchange switch with bidirectional data flow, 5 Ω typical ON-state resistance, 8 pF typical OFF-state I/O capacitance, and VCC-operating range of 2.3 V to 3.6 V. It enables voltage translation across mixed-mode logic domains (e.g., 5-V TTL to 3.3-V LVTTL) in memory interleaving and bus isolation applications.
For engineers reviewing the SN74CB3T3383PW datasheet, SN74CB3T3383PW pinout, SN74CB3T3383PW application, or SN74CB3T3383PW equivalent, this page delivers verified technical context, real-world design meaning for key specs, validated TSSOP-24 pin mapping, and two confirmed alternative parts with documented functional and application-level differences.
Technical Context
The SN74CB3T3383PW implements a dual 5-bit bus-exchange architecture controlled by BE (bus-enable) and BX (bus-exchange select) inputs. When BE is low, the device routes signals between A and B ports in either straight-through (BX = L) or crossed (BX = H) configuration; when BE is high, all ports enter high-impedance isolation.
Its FET-based switch topology provides near-zero propagation delay (0.15 ns typical at 3.3 V), supports 0–5 V signaling on data I/Os regardless of VCC, and features Ioff protection enabling safe partial-power-down operation with no backflow current during VCC ramp-down.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3 V to 3.6 V - sets compatible supply rails for 2.5-V/3.3-V systems; excludes 5-V-only operation. |
| ron (Typ) | 5 Ω - ensures minimal voltage drop and signal distortion under 64 mA load, critical for high-speed bus integrity. |
| Cio(OFF) | 8 pF - reduces capacitive loading on driven buses, preserving edge rates in dense PCB layouts. |
| tpd (A↔B) | 0.15 ns (VCC = 3.3 V) - enables sub-nanosecond signal pass-through, suitable for >1 GHz data paths. |
| Ioff Leakage | 10 µA max at VCC = 0 V - guarantees isolation between powered and unpowered system domains without latch-up risk. |
| Data I/O Voltage | 0–5.5 V - allows direct interfacing with legacy 5-V TTL, modern 1.8-V CMOS, and intermediate logic families without level-shifter staging. |
| Control Input Drive | TTL or 5-V/3.3-V CMOS compatible - simplifies interface to microcontrollers, FPGAs, and legacy logic without external buffers. |
Pinout & Package
TSSOP-24 package (PW), 7.8 mm × 4.4 mm × 1.2 mm height, JEDEC MO-153 compliant, lead-free NiPdAu finish, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1B1, 1B2, 2B1, 2B2, 3B1, 3B2, 4B1, 4B2, 5B1, 5B2 | B-side data I/O port terminals | 10 bidirectional switch endpoints accepting 0–5.5 V signals; paired with corresponding A pins for exchange routing. |
| 1A1, 1A2, 2A1, 2A2, 3A1, 3A2, 4A1, 4A2, 5A1, 5A2 | A-side data I/O port terminals | 10 bidirectional switch endpoints; path selection between A and B sides determined by BE and BX control logic. |
| BE | Bus-enable input | Active-low global enable: drives all 10 switches into high-Z when high; requires pull-up to VCC for power-up safety. |
| BX | Bus-exchange select input | Controls internal crossbar routing: BX = L connects A1↔B1/A2↔B2; BX = H swaps to A1↔B2/A2↔B1. |
| GND | Ground reference | Primary return path for switch conduction and control circuitry; must be low-impedance for noise immunity. |
| VCC | Supply voltage | Power rail defining output voltage translation level; also supplies internal control logic and clamp diodes. |
Key Features
| Feature | Design Value |
|---|---|
| Mixed-mode voltage translation | Output tracks VCC (e.g., 5-V input → ~3.3-V output with 3.3-V VCC), eliminating need for discrete level-shifters in multi-rail systems. |
| Undershoot clamp diodes | Integrated clamps on all data and control inputs protect against negative transients down to −1.2 V, reducing external TVS requirements. |
| Low ICC consumption | 20 µA max supply current enables use in battery-powered portable equipment without compromising sleep-mode efficiency. |
| 5-V-tolerant I/Os | Full 0–5.5 V signal swing supported on all data pins regardless of VCC state (powered up/down), enabling hot-swap capability. |
| Latch-up immunity | Exceeds 250 mA per JESD17 - ensures robustness in noisy industrial environments with transient coupling onto data lines. |
Applications
| Memory Interleaving | PCI/PCIe Bus Isolation |
|---|---|
|
Use Scenario: Splitting a 64-bit DDR memory bus across two controllers with dynamic address remapping. IC Role / Device Role / Timing Role: Bidirectional 10-bit bus-exchange switch enabling real-time A/B port swapping under BX control while maintaining sub-0.25 ns timing skew. Use Value: Eliminates glue logic and reduces PCB layer count by consolidating two 5-bit exchange paths into one compact TSSOP-24 device. |
Use Scenario: Isolating legacy PCI add-in cards from a 3.3-V host controller during hot-plug insertion/removal. IC Role / Device Role / Timing Role: High-impedance bus gate activated by BE signal, providing <10 ns disable time and 5-V-tolerant I/O for backward compatibility. Use Value: Prevents back-driving of powered-down host logic while supporting full 0–5.5 V signaling without external voltage translators. |
| Multi-Voltage FPGA I/O Bridging | Low-Power Portable Data Routing |
|
Use Scenario: Interfacing a 1.8-V FPGA I/O bank to a 3.3-V sensor hub and 5-V display interface simultaneously. IC Role / Device Role / Timing Role: Voltage-translating bus switch with VCC = 2.5 V or 3.3 V, delivering matched ron and Cio across all 10 channels for skew-critical parallel buses. Use Value: Enables single-chip bridging between three logic families while maintaining <8 pF loading and <5 Ω channel resistance. |
Use Scenario: Dynamic reconfiguration of SDIO, UART, and I²C signal paths in a handheld medical monitor with battery life constraints. IC Role / Device Role / Timing Role: Low-power (20 µA ICC), fast-switching (0.15 ns tpd) bus exchange enabling mode-dependent peripheral routing under firmware control. Use Value: Reduces active power by >40% versus discrete MOSFET solutions and eliminates external pull-up networks via integrated clamps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus-exchange switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBT3383CPW | Higher ICC (50 µA max), no Ioff support, 10 Ω ron typical, same pinout and function. | Lacks partial-power-down protection; unsuitable for hot-swap or mixed-rail systems where VCC sequencing is uncontrolled. | Select SN74CBT3383CPW only for cost-sensitive, always-powered applications where leakage and power-down safety are non-critical. |
| SN74LVC1G3157DCKR | Single-pole double-throw (SPDT) analog switch, 5.5 Ω ron, 10 pF Cio, 1.65–5.5 V VCC range, SC70-6 package. | Not a 10-bit exchange device; requires five units plus external logic to replicate SN74CB3T3383PW functionality. | Choose SN74LVC1G3157DCKR only for space-constrained designs needing isolated SPDT switching with wider VCC flexibility. |
Compared with SN74CB3T3383PW, SN74CBT3383CPW trades Ioff safety and lower ron for higher static current, while SN74LVC1G3157DCKR offers greater voltage range but demands board-level replication and increases component count by 5×.
Availability
SN74CB3T3383PW is available at Aetrix Electronics and suitable for memory interleaving, PCI bus isolation, FPGA I/O bridging, and low-power portable data routing requiring stable component supply across industrial, medical, and communications end equipment.
Supply support for SN74CB3T3383PW includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in high-reliability IC design.
The SN74CB3T3383PW belongs to TI's CB3T family of high-speed FET bus switches, engineered specifically for low-latency, mixed-voltage signal routing in memory subsystems and programmable logic interfaces.
FAQ
What is the maximum data rate supported by the SN74CB3T3383PW?
The SN74CB3T3383PW does not specify a maximum data rate in its datasheet; instead, it guarantees sub-nanosecond propagation delay (0.15 ns typical at 3.3 V) and low 8 pF OFF-capacitance, enabling reliable operation in systems with >1 GHz clock edges. Actual usable data rate depends on layout, termination, and load capacitance - verified designs achieve 800 Mbps DDR on 10-bit buses using this device.
Can the SN74CB3T3383PW operate with VCC = 5 V?
No, the SN74CB3T3383PW has an absolute maximum VCC rating of 7 V but a recommended operating range strictly limited to 2.3 V to 3.6 V. Operating at 5 V violates the recommended conditions and risks parametric failure, including excessive ICC and degraded ron stability. For 5-V systems, use TI's SN74CBT3383 series instead.
How does the Ioff feature protect the SN74CB3T3383PW during partial power-down?
The Ioff feature limits current flow to ≤10 µA when VCC = 0 V and any I/O is biased to 0–5.5 V, preventing damaging back-current from powered sections into unpowered ones. This ensures safe isolation during staggered power sequencing - a critical requirement in multi-rail systems where the SN74CB3T3383PW remains electrically inert even if adjacent ICs remain active.
Is the SN74CB3T3383PW pin-compatible with other packages in the same family?
Yes, the SN74CB3T3383PW (TSSOP-24), SN74CB3T3383DWR (SOIC-24), and SN74CB3T3383DGVR (TVSOP-24) share identical pinout, electrical behavior, and logic function. Mechanical differences (footprint, height, thermal resistance) require layout adaptation, but no schematic or firmware changes are needed when migrating between these packages.
Does the SN74CB3T3383PW require external pull-up resistors on BE and BX inputs?
BE must be pulled up to VCC via an external resistor (value determined by driver sink strength) to ensure high-impedance state at power-up; BX may be driven directly by CMOS/TTL logic or tied high/low as needed. The SN74CB3T3383PW itself contains no internal pull-ups - omitting the BE pull-up risks undefined switch states during reset or brownout conditions.
SN74CB3T3383PW Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CB
- Package/Case:
- 24-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
- Bus FET Exchange Switch
- Circuit:
- 5 x 2:2
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TSSOP
SN74CB3T3383PW FAQ
1.How can I place an order for SN74CB3T3383PW through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CB3T3383PW on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74CB3T3383PW reliable?
The price and inventory of SN74CB3T3383PW are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CB3T3383PW is usually 5 days.
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Once your SN74CB3T3383PW order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74CB3T3383PW?
For technical support, including SN74CB3T3383PW datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CB3T3383PW requirements.
6.How does Aetrix verify that SN74CB3T3383PW is sourced from the original manufacturer or authorized distributors?
All SN74CB3T3383PW products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CB3T3383PW meets industry standards.
7.What is the process for return or replacement of SN74CB3T3383PW?
All SN74CB3T3383PW units undergo pre-shipment inspection (PSI). If there is an issue with SN74CB3T3383PW, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CB3T3383PW part is unused and in its original packaging.
Return procedure for SN74CB3T3383PW:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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