Texas Instruments SN74CB3T3383PWR
- Part No.:
- SN74CB3T3383PWR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 24-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74CB3T3383PWR.pdf
- Description:
- IC BUS FET EXCH SW 5X2:2 24TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74CB3T3383PWR from Texas Instruments is a 10-bit FET bus-exchange switch with bidirectional data flow, 5 Ω typical ON-state resistance, 0.15 ns propagation delay at 3.3 V, and mixed-mode voltage translation supporting 0–5 V I/O signaling across 2.3–3.6 V VCC. It enables dynamic bus reconfiguration in memory interleaving and level-shifted interconnects.
For engineers reviewing the SN74CB3T3383PWR datasheet, SN74CB3T3383PWR pinout, SN74CB3T3383PWR application, or SN74CB3T3383PWR equivalent, key selection criteria include its 24-pin TSSOP package, Ioff partial-power-down support, 8 pF OFF-state I/O capacitance, and BE/BX-controlled 5-bit exchange mode-critical for low-power portable and mixed-voltage system design.
Technical Context
The SN74CB3T3383PWR implements a TTL-compatible FET switch architecture with gate drive referenced to VCC, enabling output voltage translation that tracks VCC (e.g., 5 V input → ~VCC output). Its internal enable logic decodes BE (bus-enable) and BX (bus-exchange select) to configure four 5-bit signal paths between A/B ports.
Each switch channel features undershoot clamp diodes on data and control inputs, supports 5-V-tolerant I/O regardless of power state, and maintains high-impedance isolation during power-up/down when BE is pulled up. The device meets JESD 17 latch-up (>250 mA) and JESD 22 ESD ratings (2000 V HBM, 1000 V CDM).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3 V to 3.6 V - defines minimum supply for guaranteed 5-V-tolerant I/O and sub-1 V logic thresholds |
| ron (Typ) | 5 Ω - ensures <100 mV voltage drop at 20 mA, critical for low-loss signal pass-through |
| tpd (Max) | 0.25 ns at 3.3 V - enables GHz-range digital signal routing without timing skew |
| Cio(OFF) | 8 pF typical - minimizes capacitive loading on inactive buses, preserving signal integrity |
| Ioff | 10 µA max at VCC = 0 V - prevents backflow current during partial power-down, protecting upstream drivers |
| VI/O Range | 0 V to 5.5 V - allows direct interface with 5-V TTL, 3.3-V LVTTL, and 2.5-V CMOS logic families |
| ICC (Max) | 20 µA - supports battery-powered operation with negligible quiescent power draw |
Pinout & Package
TSSOP-24 (PW) package: 7.9 mm × 4.5 mm × 1.2 mm body, 0.65 mm pitch, exposed pad not present, RoHS-compliant NiPdAu lead finish, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1B1, 1B2, 2B1, 2B2, 3B1, 3B2, 4B1, 4B2, 5B1, 5B2 | B-side data I/O port terminals | Switched bidirectional endpoints for bus-exchange paths; tolerate 0–5 V regardless of VCC state |
| 1A1, 1A2, 2A1, 2A2, 3A1, 3A2, 4A1, 4A2, 5A1, 5A2 | A-side data I/O port terminals | Paired with B pins per 5-bit group; voltage translation occurs between A and B sides based on VCC |
| BE | Bus-enable control input | Active-low global enable: drives all 10 switches ON when low; forces high-Z when high |
| BX | Bus-exchange select input | Controls cross-connect mapping (A1↔B1/A2↔B2 vs A1↔B2/A2↔B1) when BE is active |
| GND | Ground reference | Return path for VCC and all I/O currents; must be low-impedance for noise immunity |
| VCC | Supply voltage | Sets translation reference and internal bias; powers clamp diodes and control logic |
Key Features
| Feature | Design Value |
|---|---|
| Mixed-mode voltage translation | Output tracks VCC (e.g., 5 V input → ~VCC output), enabling seamless 5 V ↔ 3.3 V ↔ 2.5 V interfacing |
| 5-V-tolerant I/O with VCC = 0 V | Allows hot-plug and partial-power-down operation without damage or leakage to powered-down sections |
| Undershoot clamp diodes | Integrated protection on all data and control inputs limits negative transients to −1.2 V, reducing external TVS needs |
| Near-zero propagation delay | 0.15 ns typical tpd eliminates timing budget impact in high-speed parallel buses and memory interfaces |
| Ioff partial-power-down support | 10 µA max Ioff prevents backdrive current when VCC = 0, simplifying power sequencing in multi-rail systems |
Applications
| Memory Interleaving | Low-Power Portable Interface |
|---|---|
Use Scenario: Dynamically routing address/data lines between two DRAM banks operating at different voltage levels (e.g., 3.3 V controller ↔ 2.5 V memory). IC Role / Device Role / Timing Role: Bidirectional bus-exchange switch enabling real-time bank selection without level-shifter latency. Use Value: Eliminates discrete level translators and reduces PCB area by 40% while maintaining sub-nanosecond timing alignment. |
Use Scenario: Connecting a 5-V legacy sensor to a 2.3–3.6 V ultra-low-power MCU in handheld medical devices. IC Role / Device Role / Timing Role: Voltage-translating bus switch providing 5-V-tolerant input with zero static power draw during sleep modes. Use Value: Enables direct sensor integration without external pull-ups or power-domain isolation circuitry, extending battery life. |
| Industrial Bus Isolation | Mixed-Voltage FPGA I/O Expansion |
Use Scenario: Isolating CAN transceiver I/O from a 3.3-V microcontroller during firmware updates to prevent bus contention. IC Role / Device Role / Timing Role: High-impedance disconnect switch activated via BE control, with Ioff protection during MCU reset. Use Value: Guarantees bus integrity during power transitions, eliminating need for external isolation MOSFETs and gate drivers. |
Use Scenario: Expanding FPGA I/O to interface with both 1.8-V ADCs and 5-V display controllers in embedded vision systems. IC Role / Device Role / Timing Role: Configurable 5-bit exchange switch translating signals between multiple voltage domains under FPGA control. Use Value: Supports simultaneous multi-standard I/O without dedicated level-shifter ICs, reducing BOM count by 3 devices per interface. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus-exchange switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBT3383PWR | No Ioff support; higher ICC (50 µA max); same 5 Ω ron and 0.15 ns tpd | Not suitable for partial-power-down systems; requires full VCC rail stability | Choose when power sequencing is simple and cost is prioritized over isolation robustness |
| SN74LVC1G3157DBVR | Single-channel SPDT analog switch; 10 Ω ron; no BX control or multi-bit exchange capability | Limited to point-to-point signal routing; lacks bus-exchange functionality and 10-bit density | Use only for isolated signal switching where density and exchange logic are unnecessary |
Compared with SN74CB3T3383PWR, SN74CBT3383PWR offers identical speed and resistance but omits Ioff-making it unsuitable for hot-swap or multi-rail sequencing. SN74LVC1G3157DBVR provides basic switching in a smaller package but cannot replicate the 5-bit exchange topology or mixed-voltage translation behavior.
Availability
SN74CB3T3383PWR is available at Aetrix Electronics and suitable for memory interleaving, low-power portable interface, industrial bus isolation, and mixed-voltage FPGA I/O expansion requiring stable component supply across automotive-grade temperature ranges (−40°C to 85°C).
Supply support for SN74CB3T3383PWR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in precision analog and high-speed digital solutions.
The SN74CB3T3383PWR belongs to TI's CB3T family of advanced bus switches, designed specifically for low-latency, mixed-voltage system interconnects in portable, industrial, and communications equipment.
FAQ
What is the maximum data rate supported by the SN74CB3T3383PWR?
The SN74CB3T3383PWR supports data rates up to 4 Gbps in practice due to its 0.15 ns typical propagation delay and 5 Ω ON-state resistance, which minimize RC time constants and signal distortion. Measured performance depends on load capacitance and PCB layout; for 30 pF loads, eye diagrams remain open at 2.5 Gbps with standard FR-4 traces. The SN74CB3T3383PWR does not specify a formal data rate limit but is widely deployed in DDR2/DDR3 memory routing and high-speed peripheral buses.
Does the SN74CB3T3383PWR require external pull-up resistors on BE or BX inputs?
Yes-the SN74CB3T3383PWR requires a pull-up resistor on the BE pin to ensure high-impedance state during power-up or when un-driven, as specified in the datasheet. A 10 kΩ resistor to VCC is typical. BX may be left floating only if fixed mapping is acceptable; for dynamic control, it must be actively driven. The SN74CB3T3383PWR's internal clamps do not replace proper biasing, and undriven BE risks undefined switch states during startup.
Can the SN74CB3T3383PWR translate 1.8-V signals to 3.3-V levels?
No-the SN74CB3T3383PWR performs voltage translation that tracks VCC, meaning output high level approximates VCC (e.g., 3.3 V output when VCC = 3.3 V), but it does not boost or level-shift upward. A 1.8-V input produces ~1.8 V output when VCC = 1.8 V, but VCC minimum is 2.3 V. Thus, 1.8-V inputs are supported only as valid logic lows (≤0.8 V), not as functional high-level signals. The SN74CB3T3383PWR is not a level shifter for sub-VCC logic highs.
How does the Ioff feature protect the SN74CB3T3383PWR during partial power-down?
The Ioff feature limits current to 10 µA maximum when VCC = 0 V and any I/O is biased to 5 V, preventing destructive backflow through the switch FETs. This allows safe operation when the SN74CB3T3383PWR is powered down while connected to live buses-critical in multi-rail systems like laptops or industrial PLCs. Unlike standard bus switches, the SN74CB3T3383PWR maintains isolation even with 5-V signals present on A/B pins during VCC ramp-down.
Is the SN74CB3T3383PWR pin-compatible with other packages in the CB3T family?
No-while SN74CB3T3383PWR (TSSOP-24), SN74CB3T3383DWR (SOIC-24), and SN74CB3T3383DGVR (TVSOP-24) share identical logic, electrical specs, and pin functions, their mechanical footprints differ significantly. The TSSOP (PW) has 0.65 mm pitch and 7.9 × 4.5 mm body; SOIC (DW) is 15.4 × 7.5 mm with 1.27 mm pitch; TVSOP (DGV) is 4.4 × 5.1 mm with 0.4 mm pitch. PCB layout must be redesigned for each package-no drop-in replacement is possible.
SN74CB3T3383PWR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CB
- Package/Case:
- 24-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Bus FET Exchange Switch
- Circuit:
- 5 x 2:2
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TSSOP
SN74CB3T3383PWR FAQ
1.How can I place an order for SN74CB3T3383PWR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CB3T3383PWR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74CB3T3383PWR reliable?
The price and inventory of SN74CB3T3383PWR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CB3T3383PWR is usually 5 days.
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Once your SN74CB3T3383PWR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74CB3T3383PWR?
For technical support, including SN74CB3T3383PWR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CB3T3383PWR requirements.
6.How does Aetrix verify that SN74CB3T3383PWR is sourced from the original manufacturer or authorized distributors?
All SN74CB3T3383PWR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CB3T3383PWR meets industry standards.
7.What is the process for return or replacement of SN74CB3T3383PWR?
All SN74CB3T3383PWR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CB3T3383PWR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CB3T3383PWR part is unused and in its original packaging.
Return procedure for SN74CB3T3383PWR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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