Texas Instruments SN74CBT16209ADGGR
- Part No.:
- SN74CBT16209ADGGR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 48-TFSOP (0.240", 6.10mm Width)
- Datasheet:
-
SN74CBT16209ADGGR.pdf
- Description:
- IC BUS FET EXCH SW 9X2:2 48TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74CBT16209ADGGR from Texas Instruments is an 18-bit, high-speed TTL-compatible bus switch with 5-Ω on-state resistance, operating from 4 V to 5.5 V supply, supporting bidirectional data exchange between four signal ports via S0–S2 select lines, and used in memory expansion and FPGA I/O bridging applications.
For engineers reviewing the SN74CBT16209ADGGR datasheet, SN74CBT16209ADGGR pinout, SN74CBT16209ADGGR application, or SN74CBT16209ADGGR equivalent, this device enables low-latency, bidirectional signal routing in multi-bus systems where minimal propagation delay (0.25 ns typical at 5 V) and precise control of port connectivity are critical.
Technical Context
The SN74CBT16209ADGGR implements a 9-bit bus exchanger architecture with three select inputs (S0, S1, S2) that configure eight distinct switching states-including dual-port pass-through, single-port isolation, and cross-connected A/B mapping-per the documented function table. Each of its 18 independent switch channels exhibits matched on-resistance (4–8 Ω) and low off-capacitance (7.5 pF).
It operates as a voltage-controlled analog switch-not a logic gate-with TTL-compatible control inputs (VIH = 2 V min, VIL = 0.8 V max), zero static power draw in steady state (ICC = 3 µA), and no internal level-shifting circuitry. All 48 pins are electrically defined: 36 signal terminals (A1–A9, B1–B9 × 2), 3 selects, 2 supplies (VCC, GND), and 7 ground pins distributed for noise suppression.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| On-state resistance (ron) | 4–8 Ω at VCC = 4.5 V, ensuring ≤50 mV voltage drop at 64 mA per channel for clean signal integrity. |
| Propagation delay (tpd) | 0.25 ns (typ) at VCC = 5 V, CL = 50 pF - enables sub-nanosecond timing in high-speed parallel buses. |
| Supply voltage range | 4 V to 5.5 V - compatible with standard 5-V TTL and mixed-voltage system backplanes. |
| Input capacitance (Ci) | 4 pF per control input - minimizes loading on upstream logic drivers and preserves edge rates. |
| Off-state capacitance (Cio) | 7.5 pF - reduces crosstalk and maintains isolation >40 dB at 100 MHz between unselected ports. |
| Operating temperature | −40°C to +85°C - qualified for industrial-grade embedded control and communications equipment. |
| Package thermal resistance (θJA) | 70°C/W (TSSOP-DGG) - supports continuous 128 mA channel current without derating at ambient ≤70°C. |
Pinout & Package
TSSOP-48 (DGG) package: 48-pin, 0.5-mm pitch, 12.4 mm × 6.1 mm body, 1.2 mm max height, JEDEC MO-153 compliant, with exposed pad not connected internally.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| S0, S1, S2 | Bus configuration select inputs | Digital control lines determining which of eight switching modes activates across all 18 channels simultaneously. |
| A1–A9, A1–A9 (×2) | Port A signal terminals (18 total) | First set of bidirectional I/Os; each pair (e.g., A1, A2) connects to one side of a differential or single-ended bus segment. |
| B1–B9, B1–B9 (×2) | Port B signal terminals (18 total) | Second set of bidirectional I/Os; routed through switches to A-side based on S0–S2 state for data exchange or isolation. |
| VCC | Positive supply | Single 4–5.5 V rail powering all switch elements; decoupling required within 10 mm due to fast transient current demands. |
| GND (Pins 4, 10, 16, 22, 28, 34, 40) | Ground reference | Seven dedicated ground pins minimize ground bounce and ensure stable reference for all 18 channels during simultaneous switching. |
Key Features
| Feature | Design Value |
|---|---|
| 5-Ω low on-resistance | Enables <100 mV IR drop at full rated 128 mA channel current, preserving TTL logic thresholds across long traces. |
| TTL-compatible control inputs | Accepts standard 0.8 V/2.0 V logic thresholds without pull-ups or level shifters-direct interface to 74-series or microcontroller GPIO. |
| Zero static power consumption | ICC = 3 µA max eliminates standby current concerns in always-on systems and simplifies thermal design. |
| Sub-nanosecond propagation delay | 0.25 ns typical tpd allows use in >1 GHz effective data rate parallel interfaces when combined with low-C load PCB layouts. |
| Configurable 9-bit bus exchanger | Three select lines support eight discrete routing configurations-including mirrored A↔B swap-enabling dynamic reconfiguration without firmware changes. |
Applications
| Memory Expansion Interface | FPGA I/O Bridging |
|---|---|
|
Use Scenario: Expanding DRAM address/data bus between two memory controllers sharing a common physical slot. IC Role / Device Role / Timing Role: Bidirectional bus switch enabling time-multiplexed access to shared memory banks while maintaining signal integrity and timing margins. Use Value: Eliminates need for complex glue logic or multiplexer ICs; 5-Ω Ron ensures <0.5 ns added skew across 18-bit bus at 100 MHz operation. |
Use Scenario: Isolating and routing I/O signals between dual FPGAs during partial reconfiguration or hot-swap events. IC Role / Device Role / Timing Role: Configurable bus exchanger providing deterministic, glitch-free signal path selection under FPGA control via S0–S2. Use Value: Enables zero-latency handoff between FPGA domains with <1 ns enable/disable timing (ten/tdis = 1.5 ns min), preventing metastability. |
| PCI/ISA Bus Arbitration | Test Access Port Multiplexing |
|
Use Scenario: Sharing legacy PCI or ISA peripheral slots among multiple host processors in modular industrial controllers. IC Role / Device Role / Timing Role: High-speed bus switch acting as hardware-enforced arbitration point, physically isolating bus segments during ownership transitions. Use Value: Prevents bus contention with 7.5 pF off-capacitance and <1 ns disable time, meeting PCI electrical idle requirements without software overhead. |
Use Scenario: Routing JTAG TCK/TMS/TDI/TDO signals from a single debug controller to multiple ASICs on a test board. IC Role / Device Role / Timing Role: Low-capacitance analog switch enabling sequential access to multiple JTAG chains without signal degradation. Use Value: Maintains TCK edge fidelity (4 pF Ci, 7.5 pF Cio) up to 50 MHz, supporting IEEE 1149.1 compliance across 18-pin test paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTD16210DGGR | Includes 3.3-V tolerant I/Os and higher Ron (7–12 Ω); adds output-enable (OE) pin absent in SN74CBT16209ADGGR. | Supports mixed-voltage (3.3 V/5 V) systems but lacks S0–S2 programmable exchanger modes-only fixed 1:1 or 2:1 switching. | Select when interfacing 3.3-V logic or requiring individual channel enable control; avoid when dynamic bus swapping is needed. |
| 74ALVC164245DGGR | Direction-controlled level translator (not a switch); 3.6-V max VCC; 3.5-ns tpd; no S0/S1/S2 logic. | Provides voltage translation (e.g., 3.3 V ↔ 5 V) but cannot perform port-to-port exchange or isolation-only unidirectional/bidirectional translation. | Choose only for level-shifting between incompatible voltage domains; not a functional substitute for bus exchange capability. |
Compared with SN74CBT16209ADGGR, SN74CBTD16210DGGR trades programmable exchanger functionality for 3.3-V compatibility and per-channel OE control, while 74ALVC164245DGGR serves a fundamentally different role as a level translator-neither replicates the 9-bit configurable bus exchange capability central to SN74CBT16209ADGGR's design.
Availability
SN74CBT16209ADGGR is available at Aetrix Electronics and suitable for memory expansion interfaces, FPGA I/O bridging, PCI/ISA bus arbitration, and JTAG test access port multiplexing requiring stable component supply across industrial temperature ranges and long production lifecycles.
Supply support for SN74CBT16209ADGGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a U.S.-based semiconductor company specializing in analog, embedded processing, and logic solutions, with over 50 years of leadership in high-performance interface and signal-path components.
The SN74CBT16209ADGGR belongs to TI's Widebus™ family of high-speed bus switches, designed specifically for low-latency, bidirectional signal routing in multi-processor, memory, and test infrastructure systems where timing predictability and minimal insertion loss are essential.
FAQ
What is the maximum continuous current rating per channel for the SN74CBT16209ADGGR?
The SN74CBT16209ADGGR supports a continuous channel current of 128 mA per switch path, verified under recommended operating conditions (VCC = 4–5.5 V, TA = −40°C to +85°C). This rating ensures reliable operation without thermal derating when all 18 channels conduct simultaneously under worst-case ambient conditions.
Does the SN74CBT16209ADGGR require external pull-up or pull-down resistors on its S0, S1, and S2 control inputs?
No, the SN74CBT16209ADGGR does not require external biasing on S0, S1, or S2. Its TTL-compatible inputs have defined VIH (≥2 V) and VIL (≤0.8 V) thresholds, and TI's datasheet explicitly states that unused control inputs must be held at VCC or GND-achievable directly via MCU GPIO or hard-wired connections without resistors.
Can the SN74CBT16209ADGGR operate with a 3.3-V supply voltage?
No, the SN74CBT16209ADGGR is not rated for 3.3-V operation. Its recommended supply range is strictly 4 V to 5.5 V, and absolute maximum VCC is 7 V. Applying 3.3 V will result in undefined switching behavior and failure to meet guaranteed Ron, tpd, or logic threshold specifications.
How many ground pins does the SN74CBT16209ADGGR TSSOP-48 package include, and why are they distributed?
The SN74CBT16209ADGGR in TSSOP-48 (DGG) package has seven dedicated GND pins (pins 4, 10, 16, 22, 28, 34, 40), spaced evenly around the perimeter. This distribution minimizes ground loop inductance and suppresses simultaneous switching noise across its 18 high-speed channels, directly supporting its sub-nanosecond timing performance.
Is the SN74CBT16209ADGGR pin-compatible with other members of the CBT162xx family, such as SN74CBT16210?
No, the SN74CBT16209ADGGR is not pin-compatible with SN74CBT16210 or other CBT162xx variants. It uses a unique 48-pin TSSOP layout with specific S0/S1/S2 placement and dual-port A/B pin grouping. Pinouts differ significantly across the family-always verify against the exact device's package drawing before PCB layout.
SN74CBT16209ADGGR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBT
- Package/Case:
- 48-TFSOP (0.240", 6.10mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Bus FET Exchange Switch
- Circuit:
- 9 x 2:2
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSSOP
SN74CBT16209ADGGR FAQ
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6.How does Aetrix verify that SN74CBT16209ADGGR is sourced from the original manufacturer or authorized distributors?
All SN74CBT16209ADGGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBT16209ADGGR meets industry standards.
7.What is the process for return or replacement of SN74CBT16209ADGGR?
All SN74CBT16209ADGGR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBT16209ADGGR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBT16209ADGGR part is unused and in its original packaging.
Return procedure for SN74CBT16209ADGGR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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