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Texas Instruments SN74CBT16211AGQLR
- Part No.:
- SN74CBT16211AGQLR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 56-VFBGA
- Datasheet:
-
SN74CBT16211AGQLR.pdf
- Description:
- IC BUS SWITCH 12 X 1:1 56BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,386
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Product details
Overview
SN74CBT16211AGQLR from Texas Instruments is a 24-bit high-speed TTL-compatible bus switch IC with dual 12-bit configurable operation, 5-Ω typical on-state resistance, <0.25 ns propagation delay at 5 V, and operation across −40°C to 85°C. It enables low-latency signal routing in memory expansion, FPGA I/O bridging, and hot-swap backplane interfaces.
For engineers reviewing the SN74CBT16211AGQLR datasheet, SN74CBT16211AGQLR pinout, SN74CBT16211AGQLR application, or SN74CBT16211AGQLR equivalent, key selection criteria include its VFBGA-56 (GQL) package, bidirectional 24-bit switching architecture, TTL-level control compatibility, and thermal performance (θJA = 42°C/W).
Technical Context
The SN74CBT16211AGQLR implements two independent 12-bit bus switches controlled by separate OE inputs (1OE and 2OE), supporting either dual 12-bit or single 24-bit configurations. Each switch path exhibits symmetrical bidirectional conduction with no direction pin required.
It operates from 4 V to 5.5 V supply, accepts TTL-compatible input levels (VIL ≤ 0.8 V, VVIH ≥ 2 V), and maintains low off-state capacitance (5.5 pF) and leakage (<±1 µA). The device uses NMOS pass-gate topology without level-shifting circuitry.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| On-state resistance (ron) | 5 Ω typical at VCC = 4.5 V - ensures minimal voltage drop and signal distortion under 64 mA load |
| Propagation delay (tpd) | 0.25 ns max at VCC = 5 V - enables sub-nanosecond timing-critical interconnects |
| Supply voltage range | 4 V to 5.5 V - compatible with standard 5-V logic systems and tolerant of rail variation |
| Operating temperature | −40°C to +85°C - qualified for industrial-grade embedded and communications equipment |
| Off-state capacitance (Cio(off)) | 5.5 pF - minimizes capacitive loading and crosstalk when switch is disabled |
| Control input leakage | ±1 µA max - allows direct connection to FPGA I/O or microcontroller GPIO without pull-up/down burden |
| Thermal resistance (θJA) | 42°C/W - supports higher power density in compact VFBGA layouts versus TSSOP/SSOP variants |
Pinout & Package
VFBGA-56 package (GQL), 5.5 mm × 3.5 mm, 0.5 mm pitch, bottom-side ball array with Pin 1 located in Quadrant Q1 per JEDEC MO-194. Exposed die pad enhances thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A1–1A12, 2A1–2A12 | Input/Output port A (two 12-bit banks) | Bidirectional signal terminals for first and second 12-bit data paths; no direction control needed |
| 1B1–1B12, 2B1–2B12 | Input/Output port B (two 12-bit banks) | Corresponding switched endpoints; electrically identical to A-side pins |
| 1OE, 2OE | Enable inputs (active-low) | Independent control of each 12-bit switch bank; OE high disables path, OE low enables conduction |
| VCC | Power supply | Single 4–5.5 V supply powers all switch channels and control logic |
| GND (×4) | Ground reference | Four dedicated ground balls improve return path integrity and reduce ground bounce in high-speed switching |
| NC (×2) | No internal connection | Unbonded pads; must be left unconnected on PCB |
Key Features
| Feature | Design Value |
|---|---|
| 5-Ω low on-resistance | Preserves signal edge rate and reduces insertion loss in 5-V digital interconnects up to 200 MHz |
| TTL-compatible control inputs | Eliminates need for level shifters when driven by legacy 5-V microcontrollers or CPLDs |
| Dual independent 12-bit configuration | Enables flexible partitioning-e.g., one bank for address lines, another for data-without external logic |
| 0.25 ns propagation delay | Supports timing-critical applications such as DDR memory buffer isolation and FPGA configuration bus routing |
| VFBGA-56 thermal performance | 42°C/W θJA enables higher sustained switching rates than SSOP/TSSOP packages under same layout conditions |
Applications
| Memory Expansion Interface | FPGA I/O Bridging |
|---|---|
|
Use Scenario: Isolating and extending parallel address/data buses between microcontroller and external SRAM or Flash memory. IC Role / Device Role / Timing Role: Bidirectional 24-bit bus switch enabling dynamic memory mapping while preventing contention during access arbitration. Use Value: 5-Ω ron and 0.25 ns tpd maintain setup/hold timing margins across 5-V memory cycles up to 25 MHz. |
Use Scenario: Routing configurable I/O signals between FPGA banks and legacy peripheral controllers operating at different voltage domains. IC Role / Device Role / Timing Role: Level-transparent signal conduit that preserves TTL logic thresholds without adding propagation skew. Use Value: Dual 12-bit enable control allows independent gating of address vs. control lines, simplifying partial reconfiguration sequences. |
| Hot-Swap Backplane Interface | Test Access Multiplexer |
|
Use Scenario: Enabling safe insertion/removal of line cards in telecom chassis by isolating live backplane data lanes during connect/disconnect events. IC Role / Device Role / Timing Role: Fail-safe signal gate activated only after power stabilization and firmware validation via 1OE/2OE sequencing. Use Value: Low off-capacitance (5.5 pF) prevents signal reflection and EMI during hot-plug transients; GQL package supports dense backplane layout. |
Use Scenario: Sharing JTAG or boundary-scan test signals among multiple ASICs on a production test board. IC Role / Device Role / Timing Role: Low-latency multiplexer selecting one DUT's TDI/TDO/TCK/TMS lines onto shared tester interface. Use Value: Sub-ns delay and <±1 µA leakage ensure deterministic scan chain behavior and eliminate false fault detection during high-volume testing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBT16211ADGVR | TVSOP-56 package (1.2 mm height), θJA = 48°C/W, same electrical specs | Preferred for prototyping or lower-volume boards where hand-soldering or optical inspection is required | Select when thermal budget allows +6°C/W rise or when VFBGA assembly infrastructure is unavailable |
| SN74CBT16211ADLR | SSOP-56 package, θJA = 56°C/W, tube/reel packaging, identical switching parameters | Suitable for legacy manufacturing lines with SSOP placement capability and less stringent board area constraints | Choose for cost-sensitive industrial designs where 56-pin SSOP footprint and tooling compatibility outweigh size/thermal advantages |
Compared with SN74CBT16211ADGVR and SN74CBT16211ADLR, the SN74CBT16211AGQLR delivers superior thermal performance (42°C/W) and smallest PCB footprint (5.5 × 3.5 mm), making it optimal for space-constrained, thermally demanding applications like 5G small-cell baseband modules and high-density compute accelerators.
Availability
SN74CBT16211AGQLR is available at Aetrix Electronics and suitable for memory expansion interfaces, FPGA I/O bridging, hot-swap backplane systems, and test access multiplexing requiring stable component supply and long-term industrial lifecycle support.
Supply support for SN74CBT16211AGQLR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in industrial, automotive, and communications markets.
The SN74CBT16211AGQLR belongs to TI's Widebus™ family of high-speed bus switches, designed specifically for low-latency, bidirectional signal routing in 5-V digital systems where timing integrity and interoperability with legacy logic are critical.
FAQ
What is the maximum continuous current rating per channel for the SN74CBT16211AGQLR?
The SN74CBT16211AGQLR supports a continuous channel current of 128 mA per switch path, verified per absolute maximum ratings in the official datasheet. This rating applies across the full −40°C to +85°C operating range and ensures reliable conduction without thermal runaway when used within recommended VCC (4–5.5 V) and ambient conditions. Exceeding this current may degrade ron stability or accelerate electromigration.
Does the SN74CBT16211AGQLR require external pull-up or pull-down resistors on its OE inputs?
No, the SN74CBT16211AGQLR does not require external pull-up or pull-down resistors on 1OE or 2OE inputs. Its control inputs exhibit ±1 µA max leakage current and are TTL-compatible (VIL ≤ 0.8 V, VVIH ≥ 2 V), allowing direct connection to microcontroller GPIO or FPGA outputs. However, TI recommends tying unused OE inputs to VCC or GND to prevent floating states that could cause unintended switching.
Can the SN74CBT16211AGQLR operate with a 3.3-V supply?
No, the SN74CBT16211AGQLR is not rated for 3.3-V operation. Its recommended operating supply range is strictly 4 V to 5.5 V, and absolute maximum VCC is 7 V. At 3.3 V, the device fails to meet guaranteed ron, propagation delay, and noise margin specifications. For 3.3-V bus switching, TI recommends the SN74CBTD16211 or SN74LVC16245 families instead.
How many ground connections does the SN74CBT16211AGQLR VFBGA package provide?
The SN74CBT16211AGQLR in VFBGA-56 (GQL) package provides four dedicated ground balls (GND), positioned across the array to minimize ground loop inductance and improve high-frequency return path integrity. These are explicitly assigned in the pinout diagram and must be connected to a solid ground plane using multiple vias per ball to achieve the specified 42°C/W thermal resistance.
Is the SN74CBT16211AGQLR pin-compatible with other members of the CBT16211 family?
Yes, the SN74CBT16211AGQLR shares identical pin functionality and signal assignment with SN74CBT16211ADGVR (TVSOP) and SN74CBT16211ADLR (SSOP), including matching 1A/1B/2A/2B port mappings, dual OE controls, VCC, GND, and NC locations. However, mechanical pinout differs due to package type (ball grid vs. gull-wing leads), so PCB layout is not interchangeable-only logical connectivity and timing behavior are consistent across variants.
SN74CBT16211AGQLR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBT
- Package/Case:
- 56-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Bus Switch
- Circuit:
- 12 x 1:1
- Independent Circuits:
- 2
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-BGA Microstar Junior (7x4.5)
SN74CBT16211AGQLR FAQ
1.How can I place an order for SN74CBT16211AGQLR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CBT16211AGQLR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74CBT16211AGQLR reliable?
The price and inventory of SN74CBT16211AGQLR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBT16211AGQLR is usually 5 days.
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Once your SN74CBT16211AGQLR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74CBT16211AGQLR?
For technical support, including SN74CBT16211AGQLR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBT16211AGQLR requirements.
6.How does Aetrix verify that SN74CBT16211AGQLR is sourced from the original manufacturer or authorized distributors?
All SN74CBT16211AGQLR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBT16211AGQLR meets industry standards.
7.What is the process for return or replacement of SN74CBT16211AGQLR?
All SN74CBT16211AGQLR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBT16211AGQLR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBT16211AGQLR part is unused and in its original packaging.
Return procedure for SN74CBT16211AGQLR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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