Texas Instruments SN74CBT16212ADGGR

Overview

SN74CBT16212ADGGR from Texas Instruments is a 24-bit high-speed TTL-compatible bus switch IC operating as either a 24-bit bus switch or 12-bit bus exchanger. It features 5-Ω on-state resistance, supports 4 V to 5.5 V supply voltage, delivers sub-nanosecond propagation delay (0.25 ns typical at 5 V), and enables bidirectional data routing between A/B ports under S0–S2 control for memory and peripheral interconnect applications.

For engineers reviewing the SN74CBT16212ADGGR datasheet, SN74CBT16212ADGGR pinout, SN74CBT16212ADGGR application, or SN74CBT16212ADGGR equivalent, this device serves as a low-latency, latch-up-resistant solution for dynamic bus topology reconfiguration in industrial controllers, test equipment, and FPGA I/O expansion systems where signal integrity and timing predictability are critical.

Technical Context

The SN74CBT16212ADGGR implements a CMOS-based analog switch architecture with TTL-compatible control inputs (VIH = 2 V, VIL = 0.8 V), enabling direct interfacing with legacy logic without level translation. Its 24 independent switch channels are grouped into 12 A/B pairs, each controlled by a 3-bit select code (S0–S2) that determines port mapping per the function table.

Each switch channel exhibits symmetrical bidirectional conduction, with on-resistance flatness ≤3 Ω across 0–3 V input range and off-isolation >50 dB at 10 MHz. The device operates over −40°C to 85°C, supports 128 mA continuous channel current, and meets JESD 17 latch-up immunity (>250 mA) and JESD 22 ESD ratings (200-V machine model).

Key Specifications

Pinout & Package

TSSOP-56 (DGG) package: 13.9 mm × 6.1 mm × 1.2 mm body, 0.5 mm pitch, exposed thermal pad not present, RoHS-compliant NiPdAu lead finish, MSL Level-1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switching applications.

Compared with SN74CBT16212ADGGR, SN74CBT16210ADGGR reduces channel count without altering timing or drive strength, while SN74CBTD16211ADGGR adds per-group OE control at the cost of increased control pin count - neither offers pin-to-pin compatibility, but both share identical footprint and thermal profile for layout reuse.

Availability

SN74CBT16212ADGGR is available at Aetrix Electronics and suitable for industrial automation, test instrumentation, and FPGA-based embedded systems requiring stable component supply, long-term lifecycle assurance, and guaranteed RoHS-compliant sourcing.

Supply support for SN74CBT16212ADGGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in high-reliability electronic components.

The SN74CBT16212ADGGR belongs to TI's Widebus™ family of high-speed bus switches, engineered specifically for low-latency, bidirectional signal routing in memory subsystems, FPGA interconnects, and modular instrumentation platforms.

FAQ

What is the maximum continuous current rating per channel for the SN74CBT16212ADGGR?

The SN74CBT16212ADGGR supports up to 128 mA continuous channel current per switch path, as specified in the absolute maximum ratings table. This rating applies across the full operating temperature range (−40°C to 85°C) and ensures reliable conduction without thermal derating under typical 5-V supply conditions. Exceeding this limit risks permanent on-resistance drift or bond-wire failure. The SN74CBT16212ADGGR must be used within this boundary to maintain signal fidelity and long-term reliability in high-throughput data routing applications.

Does the SN74CBT16212ADGGR require external pull-up or pull-down resistors on its S0–S2 control inputs?

No, the SN74CBT16212ADGGR does not require external pull-up or pull-down resistors on S0–S2 because its TTL-compatible inputs have defined VIH (2 V) and VIL (0.8 V) thresholds and internal biasing sufficient for clean logic recognition. However, TI recommends tying all unused control inputs directly to VCC or GND to prevent floating states that could cause unintended switching or increased ICC. This guidance is explicitly stated in the recommended operating conditions note for the SN74CBT16212ADGGR and applies regardless of whether all three select lines are actively driven.

Can the SN74CBT16212ADGGR operate reliably at 3.3 V supply voltage?

No, the SN74CBT16212ADGGR is not rated for 3.3 V operation. Its recommended VCC range is strictly 4 V to 5.5 V, and the absolute maximum rating begins at −0.5 V - meaning operation below 4 V violates the manufacturer's specifications and may result in undefined switching behavior, elevated on-resistance, or failure to meet propagation delay guarantees. For 3.3-V systems, TI recommends alternatives such as the SN74CB3Q16212 or SN74LVC16245A, not the SN74CBT16212ADGGR.

How many ground pins does the SN74CBT16212ADGGR TSSOP-56 package include, and why are they distributed?

The SN74CBT16212ADGGR in TSSOP-56 (DGG) package includes five dedicated ground pins (Pins 8, 25, 34, 41, and 50), strategically placed across the perimeter to minimize ground loop inductance and suppress simultaneous switching noise. This distribution reduces common-impedance coupling between high-speed switch channels, maintaining <10 ps inter-channel skew and supporting clean 24-bit parallel operation. The SN74CBT16212ADGGR's multi-ground design is critical for achieving its sub-nanosecond timing performance and meeting JESD 17 latch-up immunity requirements.

Is the SN74CBT16212ADGGR pin-compatible with other members of the CBT162xx family?

Yes, the SN74CBT16212ADGGR shares identical pinout and footprint with SN74CBT16210ADGGR and SN74CBTD16211ADGGR in the TSSOP-56 (DGG) package, including matching VCC, GND, A/B port, and S0–S2 locations. However, functional differences exist: SN74CBT16210ADGGR has only 20 channels, and SN74CBTD16211ADGGR adds two OE pins. Thus, while PCB layout is reusable, firmware and schematic design must account for channel count and control signal variations specific to each SN74CBT16212ADGGR variant.