Texas Instruments SN74CBT16212ADGVR
- Part No.:
- SN74CBT16212ADGVR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 56-TFSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74CBT16212ADGVR.pdf
- Description:
- IC BUS FET EXC SW 12X2:2 56TVSOP
- Quantity:
- Payment:

- Shipping:

Inventory:7,699
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Product details
Overview
SN74CBT16212ADGVR from Texas Instruments is a 24-bit high-speed TTL-compatible bus switch with 5-Ω on-state resistance, operating at 4 V to 5.5 V supply voltage and supporting −40°C to 85°C industrial temperature range. It functions as either a 24-bit bus switch or a 12-bit bus exchanger via S0/S1/S2 select inputs, enabling low-latency data routing in memory expansion and FPGA I/O bridging applications.
For engineers reviewing the SN74CBT16212ADGVR datasheet, SN74CBT16212ADGVR pinout, SN74CBT16212ADGVR application, or SN74CBT16212ADGVR equivalent, key selection criteria include its 0.25 ns typical propagation delay (VCC = 5 V), 128 mA continuous channel current rating, TVSOP-56 package footprint, and bidirectional signal path capability without level translation.
Technical Context
The SN74CBT16212ADGVR implements a passive FET-based analog switch architecture with no internal logic latching-signal paths are purely resistive and bidirectional. Its control logic uses three select inputs (S0, S1, S2) to configure 8 distinct switching modes, including full disconnect, port-to-port pass-through, and cross-exchange between A/B banks.
All 24 channels feature matched on-resistance (4–7 Ω typical at VCC = 4.5 V), low off-capacitance (7.5 pF), and TTL-compatible input thresholds (VIH = 2 V, VIL = 0.8 V), ensuring compatibility with legacy 5-V logic families while maintaining sub-nanosecond timing integrity under 50-pF load conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 4 V to 5.5 V - supports standard 5-V TTL systems with margin for rail tolerance |
| On-State Resistance | 4–7 Ω typical - enables minimal voltage drop (<320 mV at 64 mA) and preserves signal integrity |
| Propagation Delay | 0.25 ns typical (VCC = 5 V, CL = 50 pF) - suitable for >1 GHz data rate interfaces |
| Operating Temperature | −40°C to +85°C - qualified for industrial-grade embedded and communications equipment |
| Channel Count | 24 independent bidirectional switches - configurable as 24-bit switch or 12-bit exchanger |
| Input Compatibility | TTL-level (VIH = 2 V, VIL = 0.8 V) - interoperable with 74LS, 74ALS, and microcontroller GPIOs |
| ESD Rating | 200-V Machine Model - exceeds JESD22-A115A for robust handling in assembly environments |
Pinout & Package
SN74CBT16212ADGVR is housed in a 56-pin Thin Very Small Outline Package (TVSOP-DGV), 6.1 mm × 13.9 mm body size, 1.2 mm max height, 0.5 mm lead pitch, with exposed thermal pad (non-electrical). Pin 1 marked by beveled corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| S0, S1, S2 | Mode select inputs | Determine switching configuration (e.g., A1↔B1, A1↔B2, or disconnect); TTL-compatible |
| 1A1–12A2, 1B1–12B2 | Signal I/O terminals | 24 bidirectional ports grouped into A and B banks; no direction pin required |
| VCC | Power supply | Single 4–5.5 V rail powers all switches; no separate I/O voltage needed |
| GND (×4) | Ground reference | Four dedicated ground pins minimize ground bounce across high-speed switching |
Key Features
| Feature | Design Value |
|---|---|
| 5-Ω switch resistance | Ensures <0.32 V drop at 64 mA, preserving logic margins in dense backplane routing |
| Bidirectional signal flow | Eliminates need for direction control logic-simplifies PCB layout and firmware |
| 0.25 ns propagation delay | Supports sub-ns timing closure in high-speed memory buffers and FPGA interconnects |
| Latch-up immunity >250 mA | Meets JESD17 - prevents destructive latch-up during hot-swap or ESD transients |
| TVSOP-56 compact footprint | 6.1 × 13.9 mm area saves >35% board space vs. SSOP-56; compatible with fine-pitch reflow |
Applications
| Memory Expansion Interface | FPGA I/O Bridging |
|---|---|
|
Use Scenario: Expanding DRAM address/data bus between controller and multiple memory modules using shared lines. IC Role / Device Role / Timing Role: Bidirectional bus switch enabling time-multiplexed access to parallel memory banks without direction control overhead. Use Value: 5-Ω Ron and 0.25 ns tpd maintain signal fidelity across 16-bit data paths up to 200 MHz clock domains. |
Use Scenario: Isolating and routing I/O signals between FPGA banks operating at different voltage levels or timing domains. IC Role / Device Role / Timing Role: Level-agnostic signal gate that passes TTL-compatible logic without translation delay or voltage shift. Use Value: TTL input thresholds and bidirectional operation allow seamless integration with 3.3 V/5 V FPGA I/O banks and legacy peripherals. |
| PCI/ISA Bus Arbitration | Test Access Multiplexer |
|
Use Scenario: Sharing a single PCI or ISA bus among multiple host controllers or diagnostic tools in modular test systems. IC Role / Device Role / Timing Role: High-speed bus exchanger configured via S0–S2 to route master/slave signals between competing bus agents. Use Value: 8 selectable modes-including full crossbar exchange-enable dynamic bus ownership transfer with <1 ns timing uncertainty. |
Use Scenario: Routing JTAG, UART, or debug signals from multiple DUTs to a single test controller in automated production testing. IC Role / Device Role / Timing Role: Low-capacitance (7.5 pF) analog switch minimizing signal degradation during multiplexed probe access. Use Value: 128 mA per-channel rating supports sustained current for boundary-scan drivers and serial debug interfaces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBT16210DGVR | 20-bit version (10 A/B pairs), same TVSOP-48 package, identical Ron and timing specs | Lower channel count reduces routing complexity in space-constrained 16-bit systems | Select when 20-bit width suffices and board area must be minimized |
| SN74CBTD16211DGVR | Includes power-down control (OE#), higher Ron (6–10 Ω), same pinout but added functionality | Enables active isolation during sleep mode; requires OE# signal routing | Choose when system-level power management mandates controlled shutdown of signal paths |
Compared with SN74CBT16212ADGVR, the SN74CBT16210DGVR offers identical performance in a smaller 48-pin TVSOP for reduced layout area, while the SN74CBTD16211DGVR adds power-down capability at the cost of slightly higher on-resistance and design complexity-neither is pin-compatible, but both share the same functional family architecture and thermal profile.
Availability
SN74CBT16212ADGVR is available at Aetrix Electronics and suitable for memory expansion interfaces, FPGA I/O bridging, PCI bus arbitration, and test access multiplexing requiring stable component supply across industrial temperature ranges and long-lifecycle programs.
Supply support for SN74CBT16212ADGVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with over 50 years of innovation in high-reliability interface and signal-path components.
The SN74CBT16212ADGVR belongs to TI's Widebus™ family of high-speed bus switches, engineered specifically for low-latency, bidirectional signal routing in memory subsystems and programmable logic interconnects where timing predictability and signal integrity are critical.
FAQ
What is the maximum continuous current rating per channel for the SN74CBT16212ADGVR?
The SN74CBT16212ADGVR supports a continuous channel current of 128 mA per switch, verified per absolute maximum ratings in the official datasheet. This rating applies across the full −40°C to +85°C operating range and ensures reliable conduction without thermal derating under typical PCB copper weight and airflow conditions. Exceeding this value risks permanent on-resistance drift or bond-wire failure.
Does the SN74CBT16212ADGVR require external pull-up or pull-down resistors on its S0, S1, and S2 control inputs?
No, the SN74CBT16212ADGVR does not require external biasing on S0, S1, or S2-its TTL-compatible inputs have defined VIH (2 V) and VIL (0.8 V) thresholds, and TI explicitly states in the recommended operating conditions that unused control inputs must be held at VCC or GND. Floating control lines may cause undefined switching states or increased ICC, so direct connection is preferred over resistor termination.
Can the SN74CBT16212ADGVR be used in 3.3-V systems?
The SN74CBT16212ADGVR is not rated for 3.3-V operation: its minimum supply voltage is 4 V, and its TTL input thresholds (VIH = 2 V, VIL = 0.8 V) assume a 5-V reference. Using it with 3.3-V logic may result in marginal or non-functional control signaling and undefined switch behavior. For 3.3-V systems, TI recommends the SN74CB3Q16212 or similar LVT logic-family alternatives.
What is the thermal resistance (θJA) of the SN74CBT16212ADGVR in its TVSOP package?
The SN74CBT16212ADGVR in the TVSOP-DGV (DGVR) package has a specified junction-to-ambient thermal resistance (θJA) of 48°C/W, measured per JESD51-7 standards. This value assumes standard JEDEC 2-layer board layout with 1-in² copper pour; actual thermal performance improves with internal layers, thermal vias, or heatsinking, but derating is required above 70°C ambient for sustained 128 mA per channel operation.
Is the SN74CBT16212ADGVR pin-compatible with other members of the CBT16212A family?
Yes-the SN74CBT16212ADGVR shares identical pinout and function mapping with SN74CBT16212ADL, SN74CBT16212ADLR, and SN74CBT16212ADGGR, as confirmed by TI's package drawings and logic diagrams. All variants use the same 56-pin arrangement, terminal assignments, and signal naming (e.g., 1A1, S0, VCC, GND), enabling direct substitution across SSOP, TSSOP, and TVSOP packages when board layout accommodates footprint differences.
SN74CBT16212ADGVR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBT
- Package/Case:
- 56-TFSOP (0.173", 4.40mm Width)
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Type:
- Bus FET Exchange Switch
- Circuit:
- 12 x 2:2
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TVSOP
SN74CBT16212ADGVR FAQ
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6.How does Aetrix verify that SN74CBT16212ADGVR is sourced from the original manufacturer or authorized distributors?
All SN74CBT16212ADGVR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBT16212ADGVR meets industry standards.
7.What is the process for return or replacement of SN74CBT16212ADGVR?
All SN74CBT16212ADGVR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBT16212ADGVR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBT16212ADGVR part is unused and in its original packaging.
Return procedure for SN74CBT16212ADGVR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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