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Texas Instruments SN74CBT16212CDGGR

Part No.:
SN74CBT16212CDGGR
Manufacturer:
Texas Instruments
Category:
Signal Switches, Multiplexers, Decoders
Package:
56-TFSOP (0.240", 6.10mm Width)
Datasheet:
AetrixSN74CBT16212CDGGR.pdf
Description:
IC BUS FET EXC SW 12X2:2 56TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,382

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Product details

Overview

SN74CBT16212CDGGR from Texas Instruments is a 24-bit FET bus-exchange switch with bidirectional signal routing, 3 Ω typical ON-state resistance, <0.24 ns propagation delay at 4 V, and −2 V undershoot protection on A/B ports. It enables dynamic bus reconfiguration in PCI interface and memory interleaving systems.

For engineers reviewing the SN74CBT16212CDGGR datasheet, SN74CBT16212CDGGR pinout, SN74CBT16212CDGGR application, or SN74CBT16212CDGGR equivalent, key selection criteria include its 56-pin TSSOP package, Ioff partial-power-down support, 0–5-V data signaling compatibility, and select-input-controlled 12-bit exchange modes (S0/S1/S2).

Technical Context

The SN74CBT16212CDGGR implements a dual 12-bit bus-exchange architecture controlled by three select inputs (S0, S1, S2), enabling eight distinct path configurations including full disconnect, single-port exchange, and dual parallel exchange. Its FET-based switch cells deliver near-zero propagation delay and low capacitive loading (8 pF OFF-state).

Undershoot-protection circuitry actively monitors A/B port voltages and forces switch disablement when input falls below −2 V, preventing false conduction during signal transients. The device supports partial-power-down via Ioff, limiting backflow current to 10 µA when VCC = 0 V while maintaining isolation between powered and unpowered domains.

Key Specifications

Parameter Value and Actual Design Meaning
ON-state resistance (ron) 3 Ω typical - ensures minimal voltage drop and signal attenuation across switched paths at ±64 mA.
Propagation delay (tpd) 0.24 ns max at VCC = 4 V - enables high-speed signal gating without timing budget impact in 100+ MHz buses.
OFF-state capacitance (Cio) 8 pF typical - reduces capacitive loading on driving sources and preserves signal edge integrity.
Supply voltage range 4 V to 5.5 V - compatible with standard 5-V TTL and mixed-voltage 3.3-V/5-V system interfaces.
Data I/O voltage range 0 V to 5.5 V - supports interoperability across 0.8-V to 5-V logic families without level shifters.
Ioff current 10 µA max at VCC = 0 V - guarantees safe hot-insertion and prevents damaging back-current in partial-power-down states.
Undershoot protection limit −2 V on A/B ports - maintains OFF-state integrity during negative transients common in PCI and hot-swap environments.

Pinout & Package

TSSOP-56 (DGG) package: 12.0 mm × 4.4 mm footprint, 1.2 mm max height, 0.5 mm pitch, lead-free NiPdAu finish, MSL Level-1.

Pin/Terminal Circuit Role Design Meaning
S0, S1, S2 Select control inputs Determine 12-bit exchange mode (e.g., A1↔B1, A1↔B2, A1↔B1 + A2↔B2); require pulldown to GND for power-up high-impedance safety.
A1–A12, B1–B12 Signal I/O pairs Bidirectional data paths; each Ax-Bx pair forms one switch channel with 3 Ω ron and −2 V undershoot tolerance.
VCC Power supply Single 4–5.5 V rail powers internal logic and switch bias; supplies clamp diodes for control inputs.
GND (×2) Ground reference Two dedicated ground pins minimize ground bounce and ensure stable switching thresholds across all 24 channels.

Key Features

Feature Design Value
Bus-exchange flexibility Three select inputs configure eight routing states-including dual independent 12-bit exchanges-enabling dynamic bus topology changes without external logic.
Hot-swap robustness Ioff limits back-current to 10 µA during VCC ramp-down, allowing safe insertion into live backplanes or powered subsystems.
Signal fidelity preservation 8 pF OFF-state capacitance and 3 Ω ron minimize rise-time degradation and crosstalk in high-speed digital interconnects.
Mixed-voltage interoperability 0–5.5 V data I/O range accepts 0.8-V to 5-V logic levels natively, eliminating need for discrete level translators in multi-supply systems.
Transient immunity Active undershoot detection disables switches within nanoseconds of −2 V events, preventing latch-up or data corruption during ESD or cable disconnect.

Applications

PCI Interface Memory Interleaving

Use Scenario: Isolating and re-routing address/data lines between multiple PCI slots during configuration or fault recovery.

IC Role / Device Role / Timing Role: Bidirectional bus-exchange switch enabling dynamic slot remapping without CPU intervention.

Use Value: Eliminates need for multiplexer glue logic and reduces PCB layer count by consolidating 24-channel routing into one IC.

Use Scenario: Swapping data lanes between two DDR memory banks to balance access latency and bandwidth utilization.

IC Role / Device Role / Timing Role: Low-latency, low-distortion signal gate synchronizing bank-select handshaking with sub-ns timing margin.

Use Value: Maintains 0.24 ns tpd and 8 pF loading to preserve setup/hold timing across interleaved read/write cycles.

Bus Isolation Low-Distortion Signal Gating

Use Scenario: Electrically isolating legacy ISA peripherals from modern microcontroller buses during firmware updates.

IC Role / Device Role / Timing Role: High-impedance barrier activated by control signals to prevent bus contention during reset sequences.

Use Value: Ioff ensures zero back-current flow when main MCU is powered down, protecting peripheral ICs from latch-up.

Use Scenario: Enabling/disabling analog sensor outputs (e.g., precision ADC references) using digital control without adding harmonic distortion.

IC Role / Device Role / Timing Role: Analog-capable FET switch with flat ron vs. voltage curve and minimal charge injection.

Use Value: 3 Ω ron and 8 pF Cio preserve THD and SNR in DC-coupled analog paths up to 10 MHz bandwidth.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus-exchange switch applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74CBTD16212DGGR Includes bus-hold circuitry and higher ICC (20 µA), but same pinout and ron (3 Ω). Required where unused inputs must retain last state without external pull resistors. Choose SN74CBTD16212DGGR only if bus-hold functionality is explicitly needed; otherwise SN74CBT16212CDGGR offers lower static power.
PI74CBT16212AE Compatible 56-pin TSSOP, 3.5 Ω ron, 0.3 ns tpd, but lacks undershoot protection below −1.5 V. Acceptable in non-PCI, non-hot-swap systems where transient immunity is less critical. Use PI74CBT16212AE only in cost-sensitive designs where −2 V undershoot tolerance is not required.

Compared with SN74CBT16212CDGGR, SN74CBTD16212DGGR adds bus-hold at the cost of 3× higher ICC, while PI74CBT16212AE trades −2 V undershoot protection for marginal cost reduction-making SN74CBT16212CDGGR optimal for PCI-compliant and hot-plug applications demanding robust transient immunity and ultra-low static power.

Availability

SN74CBT16212CDGGR is available at Aetrix Electronics and suitable for PCI interface design, memory interleaving architectures, and bus isolation systems requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for SN74CBT16212CDGGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in high-reliability electronic components.

The SN74CBT16212CDGGR belongs to TI's Widebus™ family of high-speed bus switches, engineered specifically for low-distortion, low-latency signal routing in computing, communications, and industrial control backplanes.

FAQ

What is the maximum undershoot voltage the SN74CBT16212CDGGR can withstand on its A and B ports?

The SN74CBT16212CDGGR provides active undershoot protection up to −2 V on both A and B ports. When voltage drops below this threshold, internal circuitry forces the switch into a guaranteed OFF state to prevent unintended conduction or latch-up. This specification is verified per test conditions in the official datasheet (SCDS146A, Section 6), with VOUTU measured at VOH−0.3 V under −2 V transient events.

Does the SN74CBT16212CDGGR support partial-power-down operation, and how is it implemented?

Yes, the SN74CBT16212CDGGR supports partial-power-down via its Ioff feature. When VCC = 0 V, Ioff limits current flow through the switch to ≤10 µA even with up to 5.5 V applied to I/O pins. This prevents damaging back-current from powered downstream circuits into the unpowered SN74CBT16212CDGGR, ensuring safe hot-swap capability in modular systems.

What is the ON-state resistance (ron) of the SN74CBT16212CDGGR, and how does it affect signal integrity?

The SN74CBT16212CDGGR has a typical ON-state resistance of 3 Ω, with a maximum of 6 Ω across the operating range. This low ron minimizes voltage drop and power loss across switched paths, preserving signal amplitude and reducing timing skew-critical for maintaining eye diagram margins in high-speed 24-bit parallel buses such as PCI-X or proprietary memory interfaces.

Can the SN74CBT16212CDGGR interface directly with 1.8-V or 2.5-V logic families without level shifters?

Yes, the SN74CBT16212CDGGR supports 0–5.5 V signaling on all data I/O pins, making it fully compatible with 0.8-V, 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V logic families. Control inputs accept TTL or 5-V/3.3-V CMOS levels, and no external level translation is required-enabling seamless integration into mixed-voltage SoC and FPGA interconnects.

What package type and thermal characteristics apply to the SN74CBT16212CDGGR?

The SN74CBT16212CDGGR uses a 56-pin TSSOP (DGG) package measuring 12.0 mm × 4.4 mm with 0.5 mm pitch and 1.2 mm max height. Its thermal impedance is θJA = 64°C/W, and it is rated for operation from −40°C to +85°C. The package features NiPdAu lead finish and complies with JEDEC MO-153 standards.

SN74CBT16212CDGGR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74CBT
Package/Case:
56-TFSOP (0.240", 6.10mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Bus FET Exchange Switch
Circuit:
12 x 2:2
Independent Circuits:
1
Current - Output High, Low:
-
Voltage Supply Source:
Single Supply
Voltage - Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
56-TSSOP

SN74CBT16212CDGGR FAQ

1.How can I place an order for SN74CBT16212CDGGR through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74CBT16212CDGGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74CBT16212CDGGR reliable?

The price and inventory of SN74CBT16212CDGGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBT16212CDGGR is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74CBT16212CDGGR?

For technical support, including SN74CBT16212CDGGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBT16212CDGGR requirements.

6.How does Aetrix verify that SN74CBT16212CDGGR is sourced from the original manufacturer or authorized distributors?

All SN74CBT16212CDGGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBT16212CDGGR meets industry standards.

7.What is the process for return or replacement of SN74CBT16212CDGGR?

All SN74CBT16212CDGGR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBT16212CDGGR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74CBT16212CDGGR part is unused and in its original packaging.

Return procedure for SN74CBT16212CDGGR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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