Texas Instruments SN74CBT16212CDGVR

Overview

SN74CBT16212CDGVR from Texas Instruments is a 24-bit, 12-channel bidirectional bus-exchange switch with TTL-compatible control inputs, 3 Ω typical ON-state resistance (ron), near-zero propagation delay (0.15 ns at VCC = 5 V), and −2 V undershoot protection on A/B ports. It enables dynamic signal routing in PCI interface and memory interleaving applications.

For engineers reviewing the SN74CBT16212CDGVR datasheet, SN74CBT16212CDGVR pinout, SN74CBT16212CDGVR application, or SN74CBT16212CDGVR equivalent, key selection criteria include its 56-pin TVSOP package, Ioff partial-power-down support, 0–5-V data signaling compatibility, and select-input-controlled bus-exchange topology for high-speed isolation.

Technical Context

The SN74CBT16212CDGVR implements a FET-based bus-exchange architecture with three select inputs (S0–S2) that configure twelve independent 2-bit bidirectional paths between A and B ports. Each path supports true bidirectional signal flow with no direction pin or internal buffering.

Its undershoot-protection circuitry actively monitors A/B port voltages and forces switch disable when −2 V undershoot is detected, preventing false turn-on during signal transients. The device operates across 4 V to 5.5 V VCC and supports mixed-voltage I/O (0.8 V to 5 V) while maintaining CMOS/TTL-compatible control thresholds.

Key Specifications

Pinout & Package

SN74CBT16212CDGVR uses a 56-pin Thin Very Small Outline Package (TVSOP, DGV), 11.4 mm × 4.4 mm footprint, 1.2 mm max height, JEDEC MO-194 compliant, with exposed pad not electrically connected.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus-exchange switch applications.

Compared with SN74CBT16212CDGVR, the DGG variant offers slightly lower density and higher thermal resistance, while the DL variant trades compactness for tube-based logistics-both retain full functional equivalence but differ in mechanical integration and supply chain handling.

Availability

SN74CBT16212CDGVR is available at Aetrix Electronics and suitable for PCI interface design, memory interleaving systems, and bus isolation architectures requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant TVSOP packaging.

Supply support for SN74CBT16212CDGVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of expertise in high-speed interface ICs and bus infrastructure components.

The SN74CBT16212CDGVR belongs to TI's Widebus™ family of FET bus switches, engineered specifically for low-distortion, zero-delay signal routing in high-speed digital systems including computing, communications, and industrial control.

FAQ

What is the maximum undershoot voltage the SN74CBT16212CDGVR can tolerate on its A and B ports?

The SN74CBT16212CDGVR tolerates up to −2 V undershoot on both A and B ports, enforced by active undershoot-protection circuitry that forces the switch into a guaranteed OFF state during such events. This specification is verified per the datasheet's undershoot characteristics table and applies across the full operating temperature range (−40°C to 85°C). No external clamping components are required to meet this rating for the SN74CBT16212CDGVR.

Does the SN74CBT16212CDGVR support partial-power-down operation, and how is it implemented?

Yes, the SN74CBT16212CDGVR supports partial-power-down via its Ioff feature, which limits leakage current to ≤10 µA when VCC = 0 V and data I/O voltages range from 0 V to 5.5 V. This prevents damaging back-current flow from live buses into unpowered sections of a system. The SN74CBT16212CDGVR achieves this through internal FET cutoff logic that isolates the switch matrix during VCC ramp-down or removal.

What is the ON-state resistance (ron) specification for the SN74CBT16212CDGVR, and how does it affect signal integrity?

The SN74CBT16212CDGVR has a typical ON-state resistance of 3 Ω at VCC = 4.5 V and IO = 30 mA, with a maximum of 6 Ω across temperature and voltage extremes. This low ron minimizes voltage drop and resistive heating during signal transmission, preserving logic margins and reducing timing skew. For example, at 64 mA drive current, the worst-case drop remains under 384 mV - well within noise margins for 5-V and 3.3-V systems using the SN74CBT16212CDGVR.

Can the SN74CBT16212CDGVR be used with mixed-voltage logic families, and which voltage levels are supported?

Yes, the SN74CBT16212CDGVR supports 0–5-V signaling on all data I/O pins (A and B ports), enabling interoperability with 0.8-V, 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V logic families. Control inputs (S0–S2) accept TTL or 3.3/5-V CMOS levels. The SN74CBT16212CDGVR requires only a single 4–5.5 V VCC supply regardless of I/O voltage combinations, simplifying mixed-signal board design.

What package type and dimensions does the SN74CBT16212CDGVR use, and what are its PCB layout implications?

The SN74CBT16212CDGVR uses a 56-pin TVSOP (DGV) package measuring 11.4 mm × 4.4 mm with 0.4-mm lead pitch and 1.2-mm max height. Its small footprint and fine pitch require adherence to IPC-7351 land patterns, 0.125-mm stencil thickness for solder paste, and symmetric pad geometry. The SN74CBT16212CDGVR's two GND pins (28 and 49) must be thermally and electrically tied to a solid ground plane to ensure stable undershoot detection and low-noise operation.