Texas Instruments SN74CBT16213DGGR

Overview

SN74CBT16213DGGR from Texas Instruments is a 24-bit FET bus-exchange switch in the Widebus™ family, operating as either a 24-bit bidirectional bus switch or a 12-bit data-exchange switch with three select inputs (S0–S2). It features 5-Ω typical on-state resistance, TTL-compatible control inputs, and supports –40°C to 85°C operation in a 56-pin TSSOP package. It enables low-delay signal routing in high-speed digital backplanes and memory interface multiplexing.

For engineers reviewing the SN74CBT16213DGGR datasheet, SN74CBT16213DGGR pinout, SN74CBT16213DGGR application, or SN74CBT16213DGGR equivalent, key selection considerations include its 5-Ω r_on, 0.25 ns typical propagation delay (V_CC = 5 V), dual-mode switching (bus switch vs. exchange), 56-pin TSSOP thermal performance (θ_JA = 64°C/W), and TTL-level control compatibility without level-shifting.

Technical Context

The SN74CBT16213DGGR implements a CMOS-based FET switch matrix controlled by three binary-select inputs (S0–S2), enabling eight distinct connection configurations between twelve A/B port pairs. Its architecture supports both transparent bus-switching (A↔B) and crossbar-style data exchange (e.g., A1↔B2, A2↔B1).

Each of the 24 switch channels operates independently with no internal latching or clocking-functionality is purely combinatorial and stateless. The device requires all unused control inputs tied to V_CC or GND per TI SCBA004 guidance to prevent floating-node-induced current leakage or erratic switching.

Key Specifications

Pinout & Package

TSSOP-56 (DGG) package: 13.9 mm × 6.1 mm × 1.2 mm max height, lead pitch 0.5 mm, NIPDAU finish, MSL Level-1 (260°C peak reflow, unlimited floor life).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus-switching applications.

Compared with SN74CBTD16213DGGR and 74LVC16245ADGG, the SN74CBT16213DGGR provides the lowest propagation delay and zero-direction-control overhead for pure bidirectional switching, making it optimal for timing-critical 5-V bus multiplexing where bus-hold is not required.

Availability

SN74CBT16213DGGR is available at Aetrix Electronics and suitable for memory interface multiplexing, FPGA I/O expansion, legacy bus isolation, and automated test equipment requiring stable component supply and long-term industrial availability.

Supply support for SN74CBT16213DGGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in industrial, automotive, and communications markets.

The SN74CBT16213DGGR belongs to TI's Widebus™ family of high-speed bus switches, designed specifically for low-latency, low-distortion signal routing in 5-V digital systems where timing predictability and minimal loading are critical.

FAQ

What is the maximum operating voltage for the SN74CBT16213DGGR?

The SN74CBT16213DGGR has an absolute maximum V_CC rating of 7 V, but its recommended operating range is strictly 4 V to 5.5 V. Operation outside this range may cause excessive leakage, timing skew, or permanent damage. The SN74CBT16213DGGR is not specified for 3.3-V operation and lacks guaranteed functionality below 4 V.

Does the SN74CBT16213DGGR support hot-swap or live-insertion?

The SN74CBT16213DGGR supports limited hot-swap capability due to its I_OFF leakage of ±1 µA and robust input clamp current (–50 mA), but it lacks integrated power sequencing or slew-rate control. For reliable hot-swap, external current-limiting resistors and staggered V_CC/GND ramping are recommended. The SN74CBT16213DGGR does not include built-in fault protection.

Can unused S0, S1, or S2 pins be left floating on the SN74CBT16213DGGR?

No-TI explicitly requires all unused control inputs on the SN74CBT16213DGGR to be tied to either V_CC or GND to prevent undefined switching states and increased ICC. Floating S0–S2 pins can cause partial turn-on of FETs, leading to signal corruption or elevated power consumption. This requirement is documented in TI application report SCBA004.

What is the thermal performance of the SN74CBT16213DGGR in its TSSOP package?

The SN74CBT16213DGGR in the DGG (TSSOP-56) package has a junction-to-ambient thermal resistance (θ_JA) of 64°C/W under JEDEC-standard conditions. With a maximum ambient temperature of 85°C and 128 mA per channel, proper PCB copper pour on V_CC/GND layers is essential to maintain junction temperature below 125°C. No heatsink is required for typical intermittent use.

How does the SN74CBT16213DGGR differ from standard logic buffers like the 74LS244?

The SN74CBT16213DGGR is a passive FET switch-not a logic buffer-so it has no propagation delay added by internal gates, no output drive strength specification, and no logic inversion. Unlike the 74LS244, the SN74CBT16213DGGR provides true bidirectional, low-r_on signal pass-through with sub-0.35 ns delay, making it suitable for high-fidelity analog/digital signal routing where signal integrity and timing determinism are paramount.