Texas Instruments SN74CBT162292DGGR

Overview

SN74CBT162292DGGR from Texas Instruments is a 12-bit 1-of-2 FET multiplexer/demultiplexer with internal 500-Ω pulldown resistors, TTL-compatible control inputs, and 25-Ω series resistors on A-port I/Os. It features make-before-break switching, isolation under power-off conditions, and supports high-speed data routing in bus-switching applications at up to 5.5 V supply.

For engineers reviewing the SN74CBT162292DGGR datasheet, SN74CBT162292DGGR pinout, SN74CBT162292DGGR application, or SN74CBT162292DGGR equivalent, key selection criteria include on-state resistance (37–63 Ω), propagation delay (≤1.9 ns), thermal impedance (64°C/W), and TSSOP-56 package compatibility with industrial temperature range (–40°C to 85°C).

Technical Context

This device implements dual-path bidirectional analog/digital signal switching using low-R_on FET architecture. Its select (S) input controls path assignment between A-port and two B-ports (B1/B2), while RINT terminal connects to the unselected B-port-enabling deterministic termination without external components.

The integrated 25-Ω series resistors suppress overshoot/undershoot on A-side signals, and internal 500-Ω pulldowns ensure defined logic states on B-ports during power-down or floating conditions. Latch-up performance exceeds 250 mA per JESD 17, supporting robust operation in mixed-signal environments.

Key Specifications

Pinout & Package

TSSOP-56 package (DGG), 12.0 mm × 4.4 mm footprint, 1.2 mm max height, moisture sensitivity level 1 (260°C peak reflow), RoHS-compliant NiPdAu lead finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FET bus switch applications.

Compared with SN74CBT162292DGGR, SN74CBTD16210DGGR adds 3-state control but removes internal pulldowns, while SN74CBT16210DGGR matches pinout and speed but shifts termination responsibility to external components-making SN74CBT162292DGGR optimal for simplified, space-constrained designs needing guaranteed idle-state behavior.

Availability

SN74CBT162292DGGR is available at Aetrix Electronics and suitable for PCI expansion, memory interleaving, hot-swappable backplane, and FPGA I/O expansion requiring stable component supply and industrial temperature support (–40°C to 85°C).

Supply support for SN74CBT162292DGGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and communications markets.

The SN74CBT162292DGGR belongs to TI's Widebus™ family of high-speed FET bus switches, designed specifically for low-distortion, low-latency signal routing in 5-V digital systems with stringent timing and noise requirements.

FAQ

What is the function of the RINT pin on the SN74CBT162292DGGR?

The RINT pin on the SN74CBT162292DGGR connects internally to the unselected B-port set (B1 or B2) and terminates it via a built-in 500-Ω resistor to GND. When S is low, RINT links to B2; when S is high, RINT links to B1. This eliminates floating nodes and ensures predictable logic-low states without external components-critical for power-down stability and noise immunity in the SN74CBT162292DGGR.

Does the SN74CBT162292DGGR support hot-swap operation?

Yes, the SN74CBT162292DGGR supports hot-swap operation due to its power-off isolation capability: I_off ≤10 µA when VCC = 0, combined with internal 500-Ω pulldowns on B-ports. These features prevent back-driving and undefined states during live insertion/removal-making the SN74CBT162292DGGR suitable for telecom and server backplane applications where uninterrupted system uptime is required.

What is the maximum operating frequency supported by the SN74CBT162292DGGR?

The SN74CBT162292DGGR does not specify a maximum clock frequency directly, but its 1.9 ns maximum propagation delay (tpd) and 2 ns make-before-break time (tmbb) support reliable operation at data rates exceeding 500 MHz in point-to-point routing. System-level bandwidth depends on load capacitance and trace impedance, but the SN74CBT162292DGGR's 37–63 Ω r_on and 8 pF Cio enable clean edge transmission in 33-MHz PCI and similar high-speed digital buses.

Can the SN74CBT162292DGGR be used with 3.3-V logic levels?

The SN74CBT162292DGGR is specified for VCC = 4 V to 5.5 V and TTL-compatible control inputs (VIH ≥ 2 V, VIL ≤ 0.8 V), so it accepts 3.3-V logic-high signals on the S input. However, its A- and B-port I/Os operate at VCC potential-meaning full 3.3-V signaling requires VCC = 3.3 V, which falls outside recommended operating conditions. For mixed-voltage use, the SN74CBT162292DGGR must be powered at ≥4 V; level-shifting may be needed for 3.3-V system interfaces.

How does the SN74CBT162292DGGR differ from standard analog switches?

Unlike general-purpose analog switches, the SN74CBT162292DGGR is optimized for digital bus switching: it features TTL-compatible control, integrated 25-Ω series resistors on A-ports to dampen reflections, internal 500-Ω pulldowns on B-ports, and guaranteed make-before-break timing. Its r_on is specified at digital current levels (15–45 mA), and its leakage (I_off) is characterized for power-off isolation-key distinctions that make the SN74CBT162292DGGR uniquely suited for high-speed digital interconnect rather than analog signal routing.