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Texas Instruments SN74CBT16292DGGR
- Part No.:
- SN74CBT16292DGGR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 56-TFSOP (0.240", 6.10mm Width)
- Datasheet:
-
SN74CBT16292DGGR.pdf
- Description:
- IC MUX/DEMUX 12 X 1:2 56TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,316
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Product details
Overview
SN74CBT16292DGGR from Texas Instruments is a 12-bit 1-of-2 FET multiplexer/demultiplexer with internal 500-Ω pulldown resistors, TTL-compatible control inputs, 4-Ω on-state resistance, and make-before-break switching. It routes bidirectional signals between port A and either B1 or B2 under select (S) control, enabling high-speed bus isolation in memory expansion and data path switching applications.
For engineers reviewing the SN74CBT16292DGGR datasheet, SN74CBT16292DGGR pinout, SN74CBT16292DGGR application, or SN74CBT16292DGGR equivalent, key selection criteria include its 56-pin TSSOP package, –40°C to 85°C operating range, 4 Ω typical on-resistance, 0.25 ns propagation delay at 5 V, and integrated pulldown for unselected outputs.
Technical Context
This device implements a 12-channel, single-pole double-throw (SPDT) analog switch architecture using NMOS pass transistors with TTL-level S input control. Each channel features independent bidirectional signal routing between A and B1/B2 ports, with RINT tied internally to the unselected B port via 500-Ω resistors.
The make-before-break timing (≤2 ns) ensures transient-free signal handover during S transitions, while latch-up immunity (>250 mA per JESD 17) and ±0.5 V absolute input voltage rating support robust operation in mixed-voltage systems with VCC = 4–5.5 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| On-state resistance (ron) | 4 Ω typical - enables low-loss signal transmission with <10 mV drop at 64 mA channel current |
| Propagation delay (tpd) | 0.25 ns at VCC = 5 V - supports >1 GHz signal switching without timing degradation |
| Make-before-break time | ≤2 ns - prevents signal interruption during port switching in high-reliability data paths |
| Supply voltage range | 4 V to 5.5 V - compatible with standard 5-V TTL and mixed-supply logic domains |
| Pulldown resistor value | 500 Ω - actively pulls unselected B-port outputs to GND, eliminating floating nodes |
| Input clamp current | ±50 mA - protects against ESD and overvoltage transients on control and data lines |
| Operating temperature | –40°C to +85°C - qualified for industrial-grade embedded and communications equipment |
Pinout & Package
TSSOP-56 (DGG) package: 12.0 mm × 6.1 mm × 1.2 mm body, 0.5 mm pitch, lead-free NiPdAu finish, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| S | Select control input | Active-high TTL-compatible signal determining A→B1/B2 routing direction |
| 1A–12A | Common port inputs/outputs | Bidirectional signal terminals connected to A-side bus or trace |
| 1B1–12B1, 1B2–12B2 | Two independent output banks | Each A pin routes to corresponding B1 *or* B2 pin based on S state; no internal cross-connection |
| VCC | Power supply | Supplies switch bias and internal logic; must be decoupled locally per TI layout guidelines |
| GND (pins 8, 23, 39, 54) | Ground reference | Four dedicated ground pins minimize ground bounce across 12 channels |
| NC (multiple) | No internal connection | Unbonded pads; must remain unconnected on PCB to avoid parasitic coupling |
Key Features
| Feature | Design Value |
|---|---|
| Integrated 500-Ω pulldowns | Eliminates need for 24 external resistors, reducing BOM count and board area in bus termination designs |
| 4-Ω low on-resistance | Preserves signal integrity for high-speed digital and analog signals up to 100 MHz without attenuation |
| Make-before-break switching | Guarantees continuous signal path during S transitions-critical for glitch-free memory or FIFO address routing |
| TTL-compatible control | Accepts standard 0.8 V / 2.0 V logic thresholds without level-shifting circuitry |
| Latch-up immunity >250 mA | Meets JESD 17 requirements for robust operation in noisy industrial environments |
Applications
| Memory Expansion Interface | PCI/PCIe Slot Multiplexing |
|---|---|
Use Scenario: Expanding DRAM capacity by sharing address/data lines between two memory banks using a single controller. IC Role / Device Role / Timing Role: Bidirectional 12-bit SPDT switch isolating A-port (controller side) from B1/B2 (memory bank sides), controlled by bank-select signal. Use Value: Enables dual-bank memory access without additional buffers; 4 Ω Ron and 0.25 ns tpd prevent timing skew across 12-bit bus. |
Use Scenario: Sharing a single PCIe root complex lane set across multiple add-in cards via hot-plug-capable switching. IC Role / Device Role / Timing Role: High-speed signal router directing differential pairs between host and alternate slot, with pulldowns preventing floating lanes during reconfiguration. Use Value: Internal 500-Ω pulldowns meet PCIe idle-state termination requirements; make-before-break avoids link training failures during switching. |
| Industrial I/O Multiplexing | Test Equipment Signal Routing |
Use Scenario: Consolidating 24 discrete sensor inputs into a single ADC channel using time-division sampling. IC Role / Device Role / Timing Role: 12×2-channel analog multiplexer selecting between two sets of sensors (B1/B2) under microcontroller S control. Use Value: Low Ron (4 Ω) minimizes gain error in precision measurement; pulldowns ensure known state when sensor is disconnected. |
Use Scenario: Automated test system routing calibration signals or DUT outputs to multiple instruments (oscilloscope, DMM, logic analyzer). IC Role / Device Role / Timing Role: Reconfigurable signal path selector with sub-nanosecond switching for synchronized multi-instrument capture. Use Value: 0.25 ns tpd allows precise timing alignment across instrument channels; 250 mA latch-up rating withstands probe contact transients. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FET multiplexer/demultiplexer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTD16210DGGR | 12-bit, 2-channel, but lacks internal pulldowns; requires external 500-Ω resistors on all 24 B-side pins | Suitable only where board space permits 24 extra resistors and layout complexity is acceptable | Choose if lower cost justifies added BOM and layout effort; not drop-in for SN74CBT16292DGGR's pulldown-integrated design |
| 74FST16292MTD | Same 12-bit 1-of-2 function and pinout, but obsolete; no RoHS compliance; max VCC = 5.5 V same, but thermal impedance higher (72°C/W vs 64°C/W) | Legacy replacement only; unsuitable for new designs requiring modern reliability or environmental compliance | Use only for repair of legacy systems; SN74CBT16292DGGR provides superior thermal performance and full RoHS compliance |
Compared with SN74CBT16292DGGR, SN74CBTD16210DGGR increases design complexity due to missing pulldowns, while 74FST16292MTD lacks RoHS compliance and has inferior thermal performance-making SN74CBT16292DGGR the optimal choice for new industrial and test equipment designs requiring integrated termination and modern manufacturing standards.
Availability
SN74CBT16292DGGR is available at Aetrix Electronics and suitable for memory expansion interfaces, industrial I/O multiplexing, PCIe slot sharing, and automated test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for SN74CBT16292DGGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in high-speed logic and interface solutions.
The SN74CBT16292DGGR belongs to TI's Widebus™ family of high-speed FET switches, designed specifically for low-latency, low-distortion signal routing in memory, bus, and test instrumentation applications.
FAQ
What is the maximum continuous current per channel for the SN74CBT16292DGGR?
The SN74CBT16292DGGR supports a continuous channel current of 128 mA per switch path, verified under recommended operating conditions (VCC = 4–5.5 V, TA = –40°C to 85°C). This rating ensures reliable operation in high-drive digital bus applications without thermal derating at full temperature range.
Does the SN74CBT16292DGGR require external pull-up or pull-down resistors on its B-port pins?
No. The SN74CBT16292DGGR integrates 500-Ω pulldown resistors on all B1 and B2 pins, eliminating the need for external termination. This feature ensures defined logic states on unselected outputs and reduces PCB component count-confirmed in the device's functional description and electrical characteristics table.
Is the SN74CBT16292DGGR pin-compatible with other packages in the same family, such as SN74CBT16292DLR?
Yes. The SN74CBT16292DGGR shares identical pinout and signal mapping with SN74CBT16292DLR (SSOP) and SN74CBT16292DGVR (TVSOP), as confirmed by TI's package drawings and top-view diagrams. All variants use the same 56-pin arrangement, allowing direct PCB footprint substitution where package height and thermal constraints permit.
What is the significance of the "make-before-break" feature in the SN74CBT16292DGGR?
The make-before-break feature in the SN74CBT16292DGGR guarantees that the new signal path is established before the previous path is broken-ensuring uninterrupted signal continuity during S-input transitions. With ≤2 ns timing, this prevents glitches in critical applications like memory address routing or real-time data acquisition.
Can the SN74CBT16292DGGR operate with a 3.3-V supply voltage?
No. The SN74CBT16292DGGR is specified for VCC = 4 V to 5.5 V only. Operation below 4 V violates recommended conditions and risks increased on-resistance, slower switching, and potential functional failure-per absolute maximum ratings and electrical characteristics tables in the official datasheet SCDS053E.
SN74CBT16292DGGR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBT
- Package/Case:
- 56-TFSOP (0.240", 6.10mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Multiplexer/Demultiplexer
- Circuit:
- 12 x 1:2
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSSOP
SN74CBT16292DGGR FAQ
1.How can I place an order for SN74CBT16292DGGR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CBT16292DGGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74CBT16292DGGR reliable?
The price and inventory of SN74CBT16292DGGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBT16292DGGR is usually 5 days.
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74CBT16292DGGR?
For technical support, including SN74CBT16292DGGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBT16292DGGR requirements.
6.How does Aetrix verify that SN74CBT16292DGGR is sourced from the original manufacturer or authorized distributors?
All SN74CBT16292DGGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBT16292DGGR meets industry standards.
7.What is the process for return or replacement of SN74CBT16292DGGR?
All SN74CBT16292DGGR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBT16292DGGR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBT16292DGGR part is unused and in its original packaging.
Return procedure for SN74CBT16292DGGR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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