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Texas Instruments SN74CBT16292DGVR
- Part No.:
- SN74CBT16292DGVR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 56-TFSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74CBT16292DGVR.pdf
- Description:
- IC MUX/DEMUX 12 X 1:2 56TVSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,206
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Product details
Overview
SN74CBT16292DGVR from Texas Instruments is a 12-bit 1-of-2 FET multiplexer/demultiplexer with internal 500-Ω pulldown resistors, TTL-compatible control inputs, 4-Ω on-state resistance, and make-before-break switching. It operates from 4 V to 5.5 V across –40°C to 85°C and is used in high-speed bus switching, memory address routing, and hot-swap I/O isolation.
For engineers reviewing the SN74CBT16292DGVR datasheet, SN74CBT16292DGVR pinout, SN74CBT16292DGVR application, or SN74CBT16292DGVR equivalent, key selection criteria include its 56-pin TVSOP package, 0.25 ns typical propagation delay at 5 V, 128 mA continuous channel current rating, and integrated pulldown resistors eliminating external bias components.
Technical Context
This device implements a dual-path bidirectional analog switch architecture using NMOS pass transistors with complementary gate drive, enabling low-distortion signal routing for digital and mixed-signal buses. Its select (S) input controls simultaneous connection of all 12 A-port signals to either B1 or B2 ports while routing RINT to the opposite port.
The internal 500-Ω pulldown resistors ensure defined logic states on unconnected B1/B2 outputs during switching transitions, supporting robust operation in systems with floating nodes or partial bus enablement. Latch-up immunity exceeds 250 mA per JESD 17, confirming suitability for industrial backplane and telecom interface applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| On-state resistance | 3–7 Ω typical - enables minimal voltage drop and signal degradation in 3.3 V/5 V digital bus paths |
| Propagation delay | 0.25 ns typical at 5 V - supports >1 GHz data rate routing without timing budget penalty |
| Supply voltage range | 4 V to 5.5 V - compatible with standard 5 V TTL and mixed-voltage 3.3 V/5 V system interfaces |
| Pulldown resistor | 500 Ω internal - eliminates need for external pull-downs, reducing BOM count and PCB area |
| Make-before-break time | 0–2 ns - prevents momentary open-circuit glitches during port switching in critical control lines |
| Channel current rating | 128 mA continuous - sustains full-drive capability for multiple CMOS loads without thermal derating |
| Input clamp current | ±50 mA - protects against transient overvoltage events on control or data lines |
Pinout & Package
SN74CBT16292DGVR is housed in a 56-pin TVSOP (DGV) package measuring 11.4 mm × 4.5 mm × 1.2 mm max height, compliant with JEDEC MO-194, with pin 1 located in quadrant Q1 of the tape reel.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| S | Select control input | Active-high TTL-compatible signal determining A→B1/B2 routing path and RINT assignment |
| 1A–12A | Common input/output port | Bidirectional data path connected to either B1 or B2 group based on S state |
| 1B1–12B1, 1B2–12B2 | Two independent output ports | Each B1/B2 pin pair corresponds to one A-channel; only one group is active per S state |
| RINT | Internal pulldown reference node | Connected internally to 500-Ω resistor to GND; routed to inactive B-port group to define idle state |
| VCC, GND | Power supply terminals | Single 4–5.5 V supply with dedicated ground pins distributed across package for low-noise switching |
| NC | No internal connection | 24 pins marked NC - must be left unconnected; no internal circuitry or parasitic coupling |
Key Features
| Feature | Design Value |
|---|---|
| Low on-resistance switch | 3–7 Ω ensures <10 mV drop at 30 mA, preserving logic margins in dense bus environments |
| TTL-compatible control | VIH = 2 V / VIL = 0.8 V allows direct interfacing with legacy 5 V microcontrollers and FPGAs |
| Integrated pulldown network | 500-Ω resistors on all B1/B2 pins eliminate external biasing, reducing layout complexity and EMI risk |
| Make-before-break switching | 0–2 ns overlap guarantees uninterrupted signal continuity during port reconfiguration |
| Latch-up immunity | >250 mA per JESD 17 enables reliable operation in noisy industrial power domains |
Applications
| High-Speed Memory Address Multiplexing | Hot-Swap I/O Bus Isolation |
|---|---|
Use Scenario: Routing address lines between two memory banks sharing a common controller in DDR2/DDR3 subsystems. IC Role / Device Role / Timing Role: Bidirectional 12-bit multiplexer selecting active memory bank while maintaining signal integrity across 200+ MHz clock domains. Use Value: 4-Ω Ron and 0.25 ns tpd prevent address skew and setup/hold violations during bank switching. | Use Scenario: Isolating peripheral modules (e.g., USB, PCIe add-in cards) during live insertion/removal in server backplanes. IC Role / Device Role / Timing Role: Fault-tolerant bus switch that maintains defined logic states via internal pulldowns when modules are disconnected. Use Value: 500-Ω internal pulldowns eliminate floating nodes and prevent false triggering of downstream logic during hot-swap transitions. |
| Legacy-to-Modern Interface Bridging | Dual-Port FPGA I/O Expansion |
Use Scenario: Interfacing 5 V TTL peripherals (e.g., industrial sensors, legacy displays) with 3.3 V FPGA I/O banks. IC Role / Device Role / Timing Role: Level-shifting multiplexer providing bidirectional signal translation without external level shifters. Use Value: TTL-compatible VIH/VIL thresholds and 4 V minimum VCC support seamless integration into mixed-voltage systems. | Use Scenario: Expanding I/O count on Xilinx Artix-7 or Intel Cyclone V FPGAs by dynamically assigning GPIO banks to alternate peripheral sets. IC Role / Device Role / Timing Role: Reconfigurable 12-bit I/O crosspoint switch controlled by FPGA configuration registers. Use Value: Make-before-break operation prevents metastability in synchronous control paths during I/O remapping sequences. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FET multiplexer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBT16292DGGR | Same silicon die in TSSOP-56 (DGG) package; 64°C/W θJA vs. 48°C/W for DGV | Higher thermal resistance limits sustained 128 mA operation in compact layouts | Prefer DGVR for space-constrained designs requiring lower junction temperature rise |
| SN74CBT16292DLR | Same functionality in SSOP-56 (DL) package; 56°C/W θJA and larger footprint (11.35 mm × 18.67 mm) | Less suitable for high-density PCBs but offers higher mechanical robustness in vibration-prone environments | Choose DLR for industrial control panels where board-level shock resistance outweighs size constraints |
Compared with SN74CBT16292DGGR and SN74CBT16292DLR, the SN74CBT16292DGVR delivers optimal thermal performance in minimal area due to its 48°C/W θJA and 11.4 mm × 4.5 mm TVSOP footprint-critical for portable test equipment and modular instrumentation where thermal headroom and board real estate are tightly constrained.
Availability
SN74CBT16292DGVR is available at Aetrix Electronics and suitable for high-speed bus switching, memory address routing, and hot-swap I/O isolation requiring stable component supply across industrial, test & measurement, and communications equipment lifecycles.
Supply support for SN74CBT16292DGVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in precision analog design and high-reliability manufacturing.
The SN74CBT16292DGVR belongs to TI's Widebus™ family of high-speed FET bus switches, engineered specifically for low-latency, low-distortion signal routing in memory subsystems, FPGA interconnects, and industrial backplane architectures.
FAQ
What is the maximum operating temperature range for the SN74CBT16292DGVR?
The SN74CBT16292DGVR is rated for operation from –40°C to +85°C ambient temperature, validated per TI's recommended operating conditions. This range supports deployment in industrial control cabinets, outdoor telecom enclosures, and automotive under-hood test fixtures where thermal extremes are encountered. The device's 48°C/W thermal impedance in the TVSOP package ensures junction temperatures remain within safe limits under full 128 mA channel loading at 85°C ambient.
Does the SN74CBT16292DGVR require external pull-up or pull-down resistors?
No, the SN74CBT16292DGVR integrates 500-Ω pulldown resistors on all B1 and B2 port pins, eliminating the need for external bias components. This feature ensures defined logic-low states on unconnected outputs during switching transitions or module removal-critical for hot-swap reliability. Control inputs (S) still require proper termination to VCC or GND per TI application report SCBA004 to prevent floating-node oscillation.
Can the SN74CBT16292DGVR be used for bidirectional analog signal switching?
The SN74CBT16292DGVR supports bidirectional digital signal routing with minimal distortion, but it is not characterized for analog signal fidelity. Its 4-Ω on-resistance and 8 pF off-isolation capacitance are optimized for TTL/CMOS logic levels-not for preserving analog waveform integrity. For analog multiplexing, TI recommends dedicated analog switches like the TMUX6219 or TS5A23157, which specify THD, bandwidth, and leakage current parameters absent in the SN74CBT16292DGVR datasheet.
What is the pin 1 location and orientation for the SN74CBT16292DGVR in tape-and-reel packaging?
The SN74CBT16292DGVR uses a 56-pin TVSOP (DGV) package with pin 1 located in quadrant Q1 of the tape reel, as confirmed in TI's PACKAGE OPTION ADDENDUM. The device is supplied in 2000-unit reels with 24.4 mm reel width and 12.0 mm pitch; the top-side marking "CY292" appears adjacent to pin 1, and the notch or dot indicator aligns with the Q1 corner per JEDEC MO-194 standards.
How does the make-before-break feature function in the SN74CBT16292DGVR?
The SN74CBT16292DGVR implements a controlled 0–2 ns make-before-break window during select (S) input transitions, ensuring the new B-port connection is established before the previous path opens. This prevents momentary open-circuit conditions that could cause glitches in clock distribution, address latching, or control signaling. The feature is inherent to the internal FET gate drive timing and requires no external timing components or configuration.
SN74CBT16292DGVR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBT
- Package/Case:
- 56-TFSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Multiplexer/Demultiplexer
- Circuit:
- 12 x 1:2
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TVSOP
SN74CBT16292DGVR FAQ
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For technical support, including SN74CBT16292DGVR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBT16292DGVR requirements.
6.How does Aetrix verify that SN74CBT16292DGVR is sourced from the original manufacturer or authorized distributors?
All SN74CBT16292DGVR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBT16292DGVR meets industry standards.
7.What is the process for return or replacement of SN74CBT16292DGVR?
All SN74CBT16292DGVR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBT16292DGVR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBT16292DGVR part is unused and in its original packaging.
Return procedure for SN74CBT16292DGVR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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