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Texas Instruments SN74CBT16811CDGGR

Part No.:
SN74CBT16811CDGGR
Manufacturer:
Texas Instruments
Category:
Signal Switches, Multiplexers, Decoders
Package:
56-TFSOP (0.240", 6.10mm Width)
Datasheet:
AetrixSN74CBT16811CDGGR.pdf
Description:
IC BUS SWITCH 12 X 1:1 56TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,940

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Product details

Overview

SN74CBT16811CDGGR from Texas Instruments is a 24-channel TTL-compatible FET bus switch organized as two independent 12-bit switches, featuring 3 Ω typical ON-state resistance, −2 V undershoot protection on A/B ports, B-port precharge to user-defined BIASV, and bidirectional signal flow with 0.15 ns typical propagation delay at 5 V. It enables hot-plug–capable PCI interface isolation in live-insertion systems.

For engineers reviewing the SN74CBT16811CDGGR datasheet, SN74CBT16811CDGGR pinout, SN74CBT16811CDGGR application, or SN74CBT16811CDGGR equivalent, key selection criteria include Ioff partial-power-down support, 0–5.5 V data I/O voltage tolerance, 5.5 pF typical OFF-state I/O capacitance, and TSSOP-56 package compatibility with industrial temperature range (−40°C to 85°C).

Technical Context

This device implements dual 12-bit FET-based analog/digital bus switches with independent OE control (1OE/2OE), enabling either two isolated 12-bit paths or one consolidated 24-bit path. Each switch channel uses low-threshold MOSFETs with integrated undershoot-protection circuitry that actively clamps A/B port voltages down to −2 V while maintaining OFF-state integrity.

The B port is internally precharged to BIASV via a 10-kΩ equivalent resistor during high-Z states or power-down (VCC = 0 V), minimizing live-insertion noise by holding B-side signals near receiver input thresholds. Ioff functionality ensures no backflow current when VCC = 0 V, supporting true partial-power-down system architectures.

Key Specifications

Parameter Value and Actual Design Meaning
ON-state resistance (ron) 3 Ω typical - enables minimal voltage drop and signal distortion under 64 mA load per channel
Propagation delay (tpd) 0.15 ns at VCC = 5 V - supports high-speed bidirectional data transfer without timing penalty
I/O capacitance (Cio(OFF)) 5.5 pF typical - reduces capacitive loading on driven buses and preserves signal edge integrity
Undershoot protection −2 V on A/B ports - prevents false triggering or latch-up during connector mating under negative transients
BIASV precharge User-selectable 0–VCC - allows tuning of B-port bias to match receiver threshold (e.g., 2.4 V for 3.3-V LVTTL)
Ioff current 10 µA max at VCC = 0 V - blocks damaging backflow current during partial power-down sequences
VCC operating range 4 V to 5.5 V - compatible with 5-V legacy systems and tolerant of supply droop
Data I/O voltage range 0 to 5.5 V - supports mixed-voltage signaling across 0.8 V to 5 V logic families without level shifters

Pinout & Package

TSSOP-56 package (DGG), 1.2 mm maximum height, 0.5 mm pitch, body size 13.9 × 6.0 mm, moisture sensitivity level 1 (260°C peak reflow), RoHS-compliant NIPDAU finish.

Pin/Terminal Circuit Role Design Meaning
1A1–1A12, 2A1–2A12 A-side data inputs/outputs First and second 12-bit source/sink channels; bidirectional, 0–5.5 V tolerant
1B1–1B12, 2B1–2B12 B-side data inputs/outputs Corresponding B-side terminals; precharged to BIASV when OE high or VCC = 0
1OE, 2OE Output-enable controls Active-low enables; tie to VCC via pullup for power-up high-Z safety
BIASV Bias supply input Defines precharge voltage for all B ports; must be between 0 and VCC
VCC, GND (×8) Power and ground Distributed VCC/GND pins minimize switching noise and improve PSRR

Key Features

Feature Design Value
Live-insertion noise suppression B-port precharge to BIASV eliminates glitching during card insertion by holding signals outside receiver threshold region
Hot-plug compliance Integrated undershoot protection (−2 V) and Ioff ensure safe operation during PCI hot-plug events
Mixed-voltage interoperability 0–5.5 V data I/O range allows direct interfacing between 1.2 V, 1.8 V, 2.5 V, 3.3 V, and 5 V logic domains
Low-distortion signal gating 3 Ω ron and 5.5 pF Cio(OFF) preserve signal rise/fall times and reduce crosstalk in high-speed buses
Partial-power-down robustness Ioff ≤ 10 µA at VCC = 0 V prevents backfeed into powered subsystems during selective shutdown

Applications

PCI Hot-Plug Interface Memory Interleaving Control

Use Scenario: Inserting/removing expansion cards into live PCI backplanes without disrupting active bus traffic.

IC Role / Device Role / Timing Role: Bidirectional bus switch isolating card-side signals from main bus; provides undershoot clamping and B-port precharge.

Use Value: Eliminates insertion glitches by holding B-side signals at BIASV (e.g., 2.4 V), preventing crossing of 3.3-V receiver thresholds during mating.

Use Scenario: Dynamically routing memory address/data lines between interleaved banks in DDR or SRAM subsystems.

IC Role / Device Role / Timing Role: Low-latency, low-capacitance signal gate enabling bank-select isolation with sub-nanosecond propagation.

Use Value: 0.15 ns tpd and 5.5 pF Cio(OFF) maintain timing margins and reduce inter-bank coupling in >100 MHz memory interfaces.

Backplane Bus Isolation Legacy-to-Modern Logic Bridging

Use Scenario: Segmenting shared backplane buses between modules with independent power domains or reset sequences.

IC Role / Device Role / Timing Role: High-impedance isolation switch activated by module presence detection; supports Ioff during unpowered module slots.

Use Value: Ioff ≤ 10 µA prevents current leakage from powered segments into unpowered modules, ensuring clean power sequencing.

Use Scenario: Connecting 5-V microcontrollers to 1.8-V or 2.5-V peripherals without external level shifters.

IC Role / Device Role / Timing Role: Voltage-tolerant bidirectional switch translating logic levels via passive resistive termination and BIASV biasing.

Use Value: 0–5.5 V I/O range and 3 Ω ron allow direct connection across voltage domains while preserving signal integrity and drive strength.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FET bus switch applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74CBTD16210DGGR 24-bit, 3-state, with 3.3-V-only VCC (3.0–3.6 V); includes output enable with 3-state, not high-Z switch Designed for 3.3-V-only systems; lacks BIASV precharge and −2 V undershoot protection Choose for 3.3-V-only designs requiring 3-state outputs instead of analog switch behavior
74LVC16245ADGG 24-bit non-inverting transceiver with direction control; CMOS-based, not FET switch; ron ≈ 20 Ω No BIASV or undershoot protection; higher capacitance (20 pF) and propagation delay (>3 ns) Prefer for cost-sensitive 3.3-V bidirectional buffering where nanosecond timing and hot-plug are not required

Compared with SN74CBT16811CDGGR, SN74CBTD16210DGGR offers tighter VCC tolerance but omits live-insertion features, while 74LVC16245ADGG provides direction-controlled buffering at lower speed and higher loading-neither matches the combination of sub-ns delay, −2 V protection, and BIASV precharge in the SN74CBT16811CDGGR.

Availability

SN74CBT16811CDGGR is available at Aetrix Electronics and suitable for PCI hot-plug interfaces, memory interleaving subsystems, and mixed-voltage logic bridging requiring stable component supply across industrial temperature ranges.

Supply support for SN74CBT16811CDGGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on reliability, longevity, and industrial-grade performance.

The SN74CBT16811CDGGR belongs to TI's Widebus™ family of high-speed bus switches, engineered specifically for hot-plug–enabled computing infrastructure, backplane isolation, and voltage-domain translation in mission-critical embedded systems.

FAQ

What is the function of the BIASV pin on the SN74CBT16811CDGGR?

The BIASV pin on the SN74CBT16811CDGGR sets the precharge voltage applied to all B-port terminals when the associated OE is high or VCC = 0 V. This 0–VCC adjustable bias minimizes live-insertion noise by holding B-side signals near the input threshold of downstream receivers-critical for glitch-free PCI hot-plug operation. The internal equivalent resistance is ~10 kΩ, and BIASV must remain within the same supply domain as VCC.

Does the SN74CBT16811CDGGR support partial-power-down operation?

Yes, the SN74CBT16811CDGGR supports partial-power-down via its Ioff feature: when VCC = 0 V, Ioff is guaranteed ≤10 µA across the full VI/O range (0–5.5 V), preventing damaging backflow current from powered buses into unpowered sections. This capability is validated per JESD 78 Class II latch-up testing and is essential for modular systems with independent power domains.

Can the SN74CBT16811CDGGR interface 1.8-V and 5-V logic domains?

Yes, the SN74CBT16811CDGGR supports 0–5.5 V signaling on all data I/O pins (A and B ports), enabling direct bidirectional interfacing between 1.8-V, 2.5-V, 3.3-V, and 5-V logic families without external level shifters. Its 3 Ω typical ron and 5.5 pF Cio(OFF) preserve signal fidelity across voltage domains, and BIASV can be set to match receiver thresholds (e.g., 1.8 V for 1.8-V inputs).

What is the maximum undershoot voltage the SN74CBT16811CDGGR protects against?

The SN74CBT16811CDGGR provides active undershoot protection up to −2 V on both A and B ports, verified under test conditions with VCC = 5 V and II ≥ −50 mA. This protection is implemented via integrated clamp circuitry that maintains switch OFF-state integrity during transient negative excursions-key for ruggedness in hot-plug and connector-mating scenarios.

Is the SN74CBT16811CDGGR pin-compatible with other Widebus™ bus switches?

No, the SN74CBT16811CDGGR is not pin-compatible with other Widebus™ devices such as SN74CBT16210 or SN74CBT16212 due to its unique 56-pin TSSOP layout, dual-OE architecture, and dedicated BIASV pin. Pin mapping, terminal count, and functional grouping differ across the family; PCB layout must be designed specifically for SN74CBT16811CDGGR's DGG package footprint and signal routing requirements.

SN74CBT16811CDGGR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74CBT
Package/Case:
56-TFSOP (0.240", 6.10mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Bus Switch
Circuit:
12 x 1:1
Independent Circuits:
2
Current - Output High, Low:
-
Voltage Supply Source:
Single Supply
Voltage - Supply:
4V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
56-TSSOP

SN74CBT16811CDGGR FAQ

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Please submit a Request for Quotation (RFQ) for SN74CBT16811CDGGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of SN74CBT16811CDGGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBT16811CDGGR is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74CBT16811CDGGR?

For technical support, including SN74CBT16811CDGGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBT16811CDGGR requirements.

6.How does Aetrix verify that SN74CBT16811CDGGR is sourced from the original manufacturer or authorized distributors?

All SN74CBT16811CDGGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBT16811CDGGR meets industry standards.

7.What is the process for return or replacement of SN74CBT16811CDGGR?

All SN74CBT16811CDGGR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBT16811CDGGR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74CBT16811CDGGR part is unused and in its original packaging.

Return procedure for SN74CBT16811CDGGR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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