Texas Instruments SN74CBT16811CDGGR
- Part No.:
- SN74CBT16811CDGGR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 56-TFSOP (0.240", 6.10mm Width)
- Datasheet:
-
SN74CBT16811CDGGR.pdf
- Description:
- IC BUS SWITCH 12 X 1:1 56TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:1,940
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SN74CBT16811CDGGR from Texas Instruments is a 24-channel TTL-compatible FET bus switch organized as two independent 12-bit switches, featuring 3 Ω typical ON-state resistance, −2 V undershoot protection on A/B ports, B-port precharge to user-defined BIASV, and bidirectional signal flow with 0.15 ns typical propagation delay at 5 V. It enables hot-plug–capable PCI interface isolation in live-insertion systems.
For engineers reviewing the SN74CBT16811CDGGR datasheet, SN74CBT16811CDGGR pinout, SN74CBT16811CDGGR application, or SN74CBT16811CDGGR equivalent, key selection criteria include Ioff partial-power-down support, 0–5.5 V data I/O voltage tolerance, 5.5 pF typical OFF-state I/O capacitance, and TSSOP-56 package compatibility with industrial temperature range (−40°C to 85°C).
Technical Context
This device implements dual 12-bit FET-based analog/digital bus switches with independent OE control (1OE/2OE), enabling either two isolated 12-bit paths or one consolidated 24-bit path. Each switch channel uses low-threshold MOSFETs with integrated undershoot-protection circuitry that actively clamps A/B port voltages down to −2 V while maintaining OFF-state integrity.
The B port is internally precharged to BIASV via a 10-kΩ equivalent resistor during high-Z states or power-down (VCC = 0 V), minimizing live-insertion noise by holding B-side signals near receiver input thresholds. Ioff functionality ensures no backflow current when VCC = 0 V, supporting true partial-power-down system architectures.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ON-state resistance (ron) | 3 Ω typical - enables minimal voltage drop and signal distortion under 64 mA load per channel |
| Propagation delay (tpd) | 0.15 ns at VCC = 5 V - supports high-speed bidirectional data transfer without timing penalty |
| I/O capacitance (Cio(OFF)) | 5.5 pF typical - reduces capacitive loading on driven buses and preserves signal edge integrity |
| Undershoot protection | −2 V on A/B ports - prevents false triggering or latch-up during connector mating under negative transients |
| BIASV precharge | User-selectable 0–VCC - allows tuning of B-port bias to match receiver threshold (e.g., 2.4 V for 3.3-V LVTTL) |
| Ioff current | 10 µA max at VCC = 0 V - blocks damaging backflow current during partial power-down sequences |
| VCC operating range | 4 V to 5.5 V - compatible with 5-V legacy systems and tolerant of supply droop |
| Data I/O voltage range | 0 to 5.5 V - supports mixed-voltage signaling across 0.8 V to 5 V logic families without level shifters |
Pinout & Package
TSSOP-56 package (DGG), 1.2 mm maximum height, 0.5 mm pitch, body size 13.9 × 6.0 mm, moisture sensitivity level 1 (260°C peak reflow), RoHS-compliant NIPDAU finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A1–1A12, 2A1–2A12 | A-side data inputs/outputs | First and second 12-bit source/sink channels; bidirectional, 0–5.5 V tolerant |
| 1B1–1B12, 2B1–2B12 | B-side data inputs/outputs | Corresponding B-side terminals; precharged to BIASV when OE high or VCC = 0 |
| 1OE, 2OE | Output-enable controls | Active-low enables; tie to VCC via pullup for power-up high-Z safety |
| BIASV | Bias supply input | Defines precharge voltage for all B ports; must be between 0 and VCC |
| VCC, GND (×8) | Power and ground | Distributed VCC/GND pins minimize switching noise and improve PSRR |
Key Features
| Feature | Design Value |
|---|---|
| Live-insertion noise suppression | B-port precharge to BIASV eliminates glitching during card insertion by holding signals outside receiver threshold region |
| Hot-plug compliance | Integrated undershoot protection (−2 V) and Ioff ensure safe operation during PCI hot-plug events |
| Mixed-voltage interoperability | 0–5.5 V data I/O range allows direct interfacing between 1.2 V, 1.8 V, 2.5 V, 3.3 V, and 5 V logic domains |
| Low-distortion signal gating | 3 Ω ron and 5.5 pF Cio(OFF) preserve signal rise/fall times and reduce crosstalk in high-speed buses |
| Partial-power-down robustness | Ioff ≤ 10 µA at VCC = 0 V prevents backfeed into powered subsystems during selective shutdown |
Applications
| PCI Hot-Plug Interface | Memory Interleaving Control |
|---|---|
Use Scenario: Inserting/removing expansion cards into live PCI backplanes without disrupting active bus traffic. IC Role / Device Role / Timing Role: Bidirectional bus switch isolating card-side signals from main bus; provides undershoot clamping and B-port precharge. Use Value: Eliminates insertion glitches by holding B-side signals at BIASV (e.g., 2.4 V), preventing crossing of 3.3-V receiver thresholds during mating. |
Use Scenario: Dynamically routing memory address/data lines between interleaved banks in DDR or SRAM subsystems. IC Role / Device Role / Timing Role: Low-latency, low-capacitance signal gate enabling bank-select isolation with sub-nanosecond propagation. Use Value: 0.15 ns tpd and 5.5 pF Cio(OFF) maintain timing margins and reduce inter-bank coupling in >100 MHz memory interfaces. |
| Backplane Bus Isolation | Legacy-to-Modern Logic Bridging |
Use Scenario: Segmenting shared backplane buses between modules with independent power domains or reset sequences. IC Role / Device Role / Timing Role: High-impedance isolation switch activated by module presence detection; supports Ioff during unpowered module slots. Use Value: Ioff ≤ 10 µA prevents current leakage from powered segments into unpowered modules, ensuring clean power sequencing. |
Use Scenario: Connecting 5-V microcontrollers to 1.8-V or 2.5-V peripherals without external level shifters. IC Role / Device Role / Timing Role: Voltage-tolerant bidirectional switch translating logic levels via passive resistive termination and BIASV biasing. Use Value: 0–5.5 V I/O range and 3 Ω ron allow direct connection across voltage domains while preserving signal integrity and drive strength. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FET bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTD16210DGGR | 24-bit, 3-state, with 3.3-V-only VCC (3.0–3.6 V); includes output enable with 3-state, not high-Z switch | Designed for 3.3-V-only systems; lacks BIASV precharge and −2 V undershoot protection | Choose for 3.3-V-only designs requiring 3-state outputs instead of analog switch behavior |
| 74LVC16245ADGG | 24-bit non-inverting transceiver with direction control; CMOS-based, not FET switch; ron ≈ 20 Ω | No BIASV or undershoot protection; higher capacitance (20 pF) and propagation delay (>3 ns) | Prefer for cost-sensitive 3.3-V bidirectional buffering where nanosecond timing and hot-plug are not required |
Compared with SN74CBT16811CDGGR, SN74CBTD16210DGGR offers tighter VCC tolerance but omits live-insertion features, while 74LVC16245ADGG provides direction-controlled buffering at lower speed and higher loading-neither matches the combination of sub-ns delay, −2 V protection, and BIASV precharge in the SN74CBT16811CDGGR.
Availability
SN74CBT16811CDGGR is available at Aetrix Electronics and suitable for PCI hot-plug interfaces, memory interleaving subsystems, and mixed-voltage logic bridging requiring stable component supply across industrial temperature ranges.
Supply support for SN74CBT16811CDGGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on reliability, longevity, and industrial-grade performance.
The SN74CBT16811CDGGR belongs to TI's Widebus™ family of high-speed bus switches, engineered specifically for hot-plug–enabled computing infrastructure, backplane isolation, and voltage-domain translation in mission-critical embedded systems.
FAQ
What is the function of the BIASV pin on the SN74CBT16811CDGGR?
The BIASV pin on the SN74CBT16811CDGGR sets the precharge voltage applied to all B-port terminals when the associated OE is high or VCC = 0 V. This 0–VCC adjustable bias minimizes live-insertion noise by holding B-side signals near the input threshold of downstream receivers-critical for glitch-free PCI hot-plug operation. The internal equivalent resistance is ~10 kΩ, and BIASV must remain within the same supply domain as VCC.
Does the SN74CBT16811CDGGR support partial-power-down operation?
Yes, the SN74CBT16811CDGGR supports partial-power-down via its Ioff feature: when VCC = 0 V, Ioff is guaranteed ≤10 µA across the full VI/O range (0–5.5 V), preventing damaging backflow current from powered buses into unpowered sections. This capability is validated per JESD 78 Class II latch-up testing and is essential for modular systems with independent power domains.
Can the SN74CBT16811CDGGR interface 1.8-V and 5-V logic domains?
Yes, the SN74CBT16811CDGGR supports 0–5.5 V signaling on all data I/O pins (A and B ports), enabling direct bidirectional interfacing between 1.8-V, 2.5-V, 3.3-V, and 5-V logic families without external level shifters. Its 3 Ω typical ron and 5.5 pF Cio(OFF) preserve signal fidelity across voltage domains, and BIASV can be set to match receiver thresholds (e.g., 1.8 V for 1.8-V inputs).
What is the maximum undershoot voltage the SN74CBT16811CDGGR protects against?
The SN74CBT16811CDGGR provides active undershoot protection up to −2 V on both A and B ports, verified under test conditions with VCC = 5 V and II ≥ −50 mA. This protection is implemented via integrated clamp circuitry that maintains switch OFF-state integrity during transient negative excursions-key for ruggedness in hot-plug and connector-mating scenarios.
Is the SN74CBT16811CDGGR pin-compatible with other Widebus™ bus switches?
No, the SN74CBT16811CDGGR is not pin-compatible with other Widebus™ devices such as SN74CBT16210 or SN74CBT16212 due to its unique 56-pin TSSOP layout, dual-OE architecture, and dedicated BIASV pin. Pin mapping, terminal count, and functional grouping differ across the family; PCB layout must be designed specifically for SN74CBT16811CDGGR's DGG package footprint and signal routing requirements.
SN74CBT16811CDGGR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBT
- Package/Case:
- 56-TFSOP (0.240", 6.10mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Bus Switch
- Circuit:
- 12 x 1:1
- Independent Circuits:
- 2
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 4V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSSOP
SN74CBT16811CDGGR FAQ
1.How can I place an order for SN74CBT16811CDGGR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CBT16811CDGGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74CBT16811CDGGR reliable?
The price and inventory of SN74CBT16811CDGGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBT16811CDGGR is usually 5 days.
3.What payment methods are accepted for SN74CBT16811CDGGR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74CBT16811CDGGR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74CBT16811CDGGR?
SN74CBT16811CDGGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74CBT16811CDGGR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74CBT16811CDGGR?
For technical support, including SN74CBT16811CDGGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBT16811CDGGR requirements.
6.How does Aetrix verify that SN74CBT16811CDGGR is sourced from the original manufacturer or authorized distributors?
All SN74CBT16811CDGGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBT16811CDGGR meets industry standards.
7.What is the process for return or replacement of SN74CBT16811CDGGR?
All SN74CBT16811CDGGR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBT16811CDGGR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBT16811CDGGR part is unused and in its original packaging.
Return procedure for SN74CBT16811CDGGR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SN74CBT16811CDGGR Tags
-
SN74HC138DR
Texas Instruments

-
TC7SB3157CFU,LF(CT
Toshiba Semiconductor and Storage

-
74CBTLV3257PW,118
Nexperia USA Inc.
-
SN74CBTLV3257PWR
Texas Instruments

-
74CBTLV3257GUX
Nexperia USA Inc.

-
74HC154BQ,118
Nexperia USA Inc.

-
P3S0200GMX
NXP USA Inc.

-
SN74CB3Q3245PWR
Texas Instruments
-
SN74CB3Q3257RGYR
Texas Instruments

-
TCA9543APWR
Texas Instruments
-
TCA9546APWR
Texas Instruments

-
SN74HC138N
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

