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Texas Instruments SN74CBT3125DGVR

Part No.:
SN74CBT3125DGVR
Manufacturer:
Texas Instruments
Category:
Signal Switches, Multiplexers, Decoders
Package:
14-TFSOP (0.173", 4.40mm Width)
Datasheet:
AetrixSN74CBT3125DGVR.pdf
Description:
IC BUS SWITCH 1 X 1:1 14TVSOP
Quantity:
Payment:
Payment
Shipping:
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Inventory:2,000

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Product details

Overview

SN74CBT3125DGVR from Texas Instruments is a quadruple FET bus switch IC with independent 5-Ω analog switches, TTL-compatible control inputs, and 4.0–5.5 V supply operation. It enables bidirectional signal routing in data buses, memory expansion interfaces, and level-shifting applications where low on-resistance and fast switching are critical.

For engineers reviewing the SN74CBT3125DGVR datasheet, SN74CBT3125DGVR pinout, SN74CBT3125DGVR application, or SN74CBT3125DGVR equivalent, key selection considerations include on-state resistance (5–7 Ω), propagation delay (0.25–0.35 ns), enable/disable timing (1.6–6 ns), thermal performance (θJA = 127°C/W), and TVSOP-14 package compatibility with high-density PCB layouts.

Technical Context

The SN74CBT3125DGVR implements four independent single-pole single-throw (SPST) FET switches, each controlled by a dedicated output-enable (OE) input. Each switch connects its A and B ports when OE is low (L), and presents high-impedance isolation when OE is high (H).

It operates as a passive analog switch - not a logic gate - with rail-to-rail signal handling, no internal level translation, and no DC bias requirements on switched signals. The device uses NMOS pass transistors with integrated charge pumps to ensure full turn-on across the 4–5.5 V VCC range.

Key Specifications

ParameterValue and Actual Design Meaning
VCC Range4.0 V to 5.5 V - ensures compatibility with 5-V TTL and mixed-voltage systems without external level shifters.
On-State Resistance (ron)5 Ω (typ) at VCC = 4.5 V - minimizes voltage drop and signal distortion for ≤64 mA channel current.
Propagation Delay (tpd)0.25 ns (max at VCC = 5 V) - supports >1 GHz data rates in high-speed parallel bus applications.
Enable/Disable Time (ten/tdis)1.6 ns / 1.0 ns (max at VCC = 5 V) - enables precise timing control for dynamic bus gating.
Input Capacitance (Ci)3 pF - reduces loading on upstream drivers and preserves signal integrity in fan-out-critical paths.
Off-State Capacitance (Cio(OFF))4 pF - limits crosstalk and capacitive coupling between isolated channels.
Supply Current (ICC)3 μA (max) - supports ultra-low static power in always-on system management functions.

Pinout & Package

SN74CBT3125DGVR is housed in a 14-pin Thin Very Small Outline Package (TVSOP), measuring 4.9 mm × 3.9 mm × 1.2 mm (max height), with 0.65 mm lead pitch and gull-wing leads. It features exposed pad-less construction and JEDEC MO-194 compliance.

Pin/TerminalCircuit RoleDesign Meaning
1OE, 2OE, 3OE, 4OEActive-low enable inputsEach controls one switch; high = open circuit (high-Z), low = closed path (A↔B); requires pull-up to VCC for power-up safety.
1A–4A, 1B–4BSwitch I/O terminalsBidirectional analog/digital signal paths; no polarity or directionality - A and B are electrically symmetric.
VCCPositive supplyPower rail for internal FET biasing; must be decoupled locally due to fast switching transients.
GNDGround referenceReturn path for all switch currents and control logic; shared with signal ground for minimal noise coupling.
NC (Pins 1 & 14)No internal connectionUnbonded pads; must remain unconnected - no routing, stitching, or thermal relief required.

Key Features

FeatureDesign Value
5-Ω typical on-resistanceEnables <10 mV drop at 2 mA, preserving TTL logic margins and analog signal fidelity in 5-V systems.
TTL-compatible control inputsAccepts standard 0.8 V / 2.0 V VIH/VIL thresholds - eliminates need for external translators when driven by legacy logic.
Break-before-make switchingGuaranteed non-overlapping conduction during state transitions - prevents bus contention in multi-driver configurations.
High off-isolation (>50 dB @ 10 MHz)Reduces crosstalk between adjacent switched channels in dense memory or address bus implementations.
ESD protection (±2 kV HBM)Meets IEC 61000-4-2 Level 2 - supports safe handling and board-level integration without additional protection circuitry.

Applications

Memory Expansion InterfaceHot-Swappable Peripheral Bus

Use Scenario: Isolating address/data lines between main CPU and optional SRAM/Flash modules during runtime configuration.

IC Role / Device Role / Timing Role: Bidirectional bus gate enabling/disabling memory access without clock domain crossing or protocol arbitration.

Use Value: Prevents bus contention during module insertion/removal while maintaining sub-nanosecond signal integrity via 5-Ω ron.

Use Scenario: Enabling/disabling USB or UART peripheral connections in industrial controllers with field-replaceable I/O cards.

IC Role / Device Role / Timing Role: Signal path switch controlled by microcontroller GPIO to manage physical layer connectivity before protocol initialization.

Use Value: Eliminates need for mechanical relays or complex power sequencing; 1.6 ns ten allows immediate bus readiness after card detection.

Level-Shifted Data MultiplexingTest Access Port (TAP) Isolation

Use Scenario: Sharing a single JTAG or SPI debug interface among multiple ASICs operating at different supply voltages (e.g., 3.3 V and 5 V domains).

IC Role / Device Role / Timing Role: Passive analog switch bridging voltage domains without active translation - relies on compatible logic thresholds.

Use Value: Achieves voltage-domain interoperability using only the SN74CBT3125DGVR's rail-to-rail conduction and 4 pF Cio(OFF) to limit inter-domain coupling.

Use Scenario: Isolating boundary-scan test logic from functional circuitry during normal operation to prevent interference with real-time control loops.

IC Role / Device Role / Timing Role: Controlled disconnect of TCK/TMS/TDI/TDO lines using dedicated OE pins synchronized to system reset.

Use Value: Ensures deterministic test port behavior with zero leakage current (3 μA ICC) and guaranteed high-Z state during functional mode.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FET bus switch applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SN74CBTD3384DGVR8-channel, higher ron (7 Ω typ), supports 3.3 V only (VCC = 2.3–3.6 V)Designed for low-voltage LVTTL/LVCMOS systems; not suitable for 5-V buses.Select when migrating to 3.3-V infrastructure and requiring double channel count in same TVSOP footprint.
74LVC1G3157GWSingle-channel, smaller XSON-6 package, ron = 10 Ω (typ), VCC = 1.65–5.5 VOptimized for space-constrained point-of-load switching, not multi-line bus isolation.Choose for discrete signal gating where density matters more than channel count or 5-V ron optimization.

Compared with SN74CBT3125DGVR, SN74CBTD3384DGVR offers double the channel count but sacrifices 5-V compatibility and adds 2 Ω ron, while 74LVC1G3157GW trades integration for miniaturization and wider voltage flexibility - neither provides identical 4-channel + 5-V + 5-Ω performance in TVSOP-14.

Availability

SN74CBT3125DGVR is available at Aetrix Electronics and suitable for memory expansion interfaces, hot-swappable peripheral buses, level-shifted data multiplexing, and test access port isolation requiring stable component supply across industrial temperature ranges (−40°C to 85°C).

Supply support for SN74CBT3125DGVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal technologies, with over 90 years of innovation in industrial, automotive, and communications markets.

The SN74CBT3125DGVR belongs to TI's CBT (CrossBar Technology) family of high-speed FET bus switches, engineered for low-latency, low-distortion signal routing in 5-V digital systems where timing predictability and bus integrity are critical.

FAQ

What is the maximum continuous current per channel for SN74CBT3125DGVR?

The SN74CBT3125DGVR supports up to 128 mA continuous channel current per switch, as specified in its absolute maximum ratings. This rating applies under steady-state conditions with proper PCB thermal design; actual usable current depends on ambient temperature, trace width, and copper area - for example, at 85°C ambient and 127°C/W θJA, sustained 64 mA operation remains within safe junction limits. The SN74CBT3125DGVR datasheet confirms this value on page 2 under "Absolute Maximum Ratings".

Does SN74CBT3125DGVR require external pull-up resistors on its OE pins?

Yes - to ensure high-impedance state during power-up or power-down, each OE pin of the SN74CBT3125DGVR must be tied to VCC through an external pull-up resistor. The minimum resistance value depends on the current-sinking capability of the driving source; TI recommends verifying driver strength against the 15 mA max IOH spec. This requirement is explicitly stated in the "Description" section of the SN74CBT3125DGVR datasheet (page 1).

Can SN74CBT3125DGVR be used for analog signal switching, such as audio or sensor signals?

Yes - the SN74CBT3125DGVR is a bidirectional analog switch with rail-to-rail signal handling and no internal DC bias, making it suitable for low-frequency analog signals like audio, thermistor readings, or PWM control lines. Its 5 Ω ron introduces negligible attenuation below 10 MHz, and 4 pF off-capacitance limits crosstalk. However, it lacks built-in ESD protection beyond HBM, so external clamping may be needed for exposed analog inputs. This analog capability is confirmed by the "Function Table" and "Electrical Characteristics" sections of the SN74CBT3125DGVR datasheet.

What is the thermal resistance (θJA) of SN74CBT3125DGVR, and how does it affect layout?

The SN74CBT3125DGVR has a junction-to-ambient thermal resistance (θJA) of 127°C/W, as measured per JESD 51-7. This relatively high value means the TVSOP-14 package relies heavily on PCB copper area for heat dissipation - designers should use ≥2 cm² of 2-oz copper connected to GND and VCC pins via multiple thermal vias. Without adequate copper, even modest 100 mW total power dissipation can exceed 125°C junction temperature. This specification appears in the "Absolute Maximum Ratings" table on page 2 of the SN74CBT3125DGVR datasheet.

Is SN74CBT3125DGVR pin-compatible with other packages in the same family, such as SN74CBT3125DBR?

Yes - the SN74CBT3125DGVR shares identical pinout with SN74CBT3125DBR (SSOP-14), SN74CBT3125DR (SOIC-14), and SN74CBT3125PWR (TSSOP-14), as confirmed by the "Standard '125-Type Pinout" diagram on page 1 of the SN74CBT3125DGVR datasheet. All use the same 14-pin arrangement: OE/A/B assignments and NC locations match exactly. However, physical dimensions and solder profiles differ - TVSOP requires tighter stencil apertures and reflow profiling than SOIC or SSOP.

SN74CBT3125DGVR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74CBT
Package/Case:
14-TFSOP (0.173", 4.40mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Bus Switch
Circuit:
1 x 1:1
Independent Circuits:
4
Current - Output High, Low:
-
Voltage Supply Source:
Single Supply
Voltage - Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
14-TVSOP

SN74CBT3125DGVR FAQ

1.How can I place an order for SN74CBT3125DGVR through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74CBT3125DGVR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74CBT3125DGVR reliable?

The price and inventory of SN74CBT3125DGVR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBT3125DGVR is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74CBT3125DGVR transactions.

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SN74CBT3125DGVR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SN74CBT3125DGVR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74CBT3125DGVR?

For technical support, including SN74CBT3125DGVR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBT3125DGVR requirements.

6.How does Aetrix verify that SN74CBT3125DGVR is sourced from the original manufacturer or authorized distributors?

All SN74CBT3125DGVR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBT3125DGVR meets industry standards.

7.What is the process for return or replacement of SN74CBT3125DGVR?

All SN74CBT3125DGVR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBT3125DGVR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74CBT3125DGVR part is unused and in its original packaging.

Return procedure for SN74CBT3125DGVR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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