Texas Instruments SN74CBT3245AGQNR
- Part No.:
- SN74CBT3245AGQNR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 20-VFBGA
- Datasheet:
-
SN74CBT3245AGQNR.pdf
- Description:
- IC BUS SWITCH 8 X 1:1 20BGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74CBT3245AGQNR from Texas Instruments is an octal FET bus switch IC designed for high-speed TTL-compatible bidirectional signal routing between two 8-bit ports (A and B). It features 5-Ω typical on-state resistance, 0.25 ns propagation delay at 5 V, and operates from −40°C to 85°C with supply voltage range 4 V to 5.5 V. It is used in memory address/data bus isolation and hot-swap interface control.
For engineers reviewing the SN74CBT3245AGQNR datasheet, SN74CBT3245AGQNR pinout, SN74CBT3245AGQNR application, or SN74CBT3245AGQNR equivalent, key selection criteria include low on-resistance for minimal signal degradation, fast enable/disable timing (1.9 ns ten / 2.1 ns tdis), TTL-compatible control inputs, VFBGA package footprint compatibility, and high-impedance isolation during power sequencing.
Technical Context
The SN74CBT3245AGQNR implements eight independent bilateral analog switches controlled by a single active-low output-enable (OE) input. When OE is low, A1–A8 are electrically connected to B1–B8 with near-zero DC offset and minimal RC delay; when OE is high, both ports present >10⁹ Ω isolation.
Its FET-based architecture eliminates DC path current and supports rail-to-rail analog/digital signal switching up to 5.5 V. The device requires no external biasing and uses standard '245-type pinout mapping - critical for drop-in replacement in legacy SOIC/SSOP designs while enabling space-constrained layouts via its 3.5 mm × 4.5 mm VFBGA (GQN) package.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| On-state resistance (ron) | 5 Ω typical at VCC = 4.5 V - ensures <50 mV voltage drop under 10 mA load, preserving logic margins. |
| Propagation delay (tpd) | 0.25 ns at VCC = 5 V - enables sub-nanosecond signal handoff in high-speed bus arbitration. |
| Enable time (ten) | 1.9 ns max at VCC = 5 V - guarantees rapid port connection after OE assertion, critical for dynamic bus sharing. |
| Disable time (tdis) | 2.1 ns max at VCC = 5 V - ensures fast isolation to prevent data contention during state transitions. |
| Supply voltage (VCC) | 4 V to 5.5 V - compatible with 5-V TTL and mixed-voltage systems without level-shifting. |
| Input voltage thresholds | VIH = 2 V min, VIL = 0.8 V max - fully compatible with standard TTL logic drive capability. |
| Operating temperature | −40°C to 85°C - qualified for industrial-grade embedded and communications equipment. |
Pinout & Package
VFBGA-20 (GQN) package: 3.5 mm × 4.5 mm, 0.5 mm pitch, 21-terminal layout including 20 signal/Power/Ground pins and 1 exposed thermal pad (pin 21). Pin 1 marked by corner chamfer; top-side marking "CU245A".
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1–A8 | Port A input/output terminals | Bidirectional signal path - electrically identical to B1–B8 when switch is enabled; high-Z when disabled. |
| B1–B8 | Port B input/output terminals | Matched impedance and timing to A-port; supports true bidirectional data flow without direction control. |
| OE | Active-low output-enable | Assert low to connect A↔B; tie to VCC via pullup for power-up high-Z safety - prevents bus contention. |
| VCC | Positive supply | Must be decoupled locally; powers internal FET gates and level translators - no separate logic supply required. |
| GND | Ground reference | Common return for all signals and supply; connects to exposed thermal pad for thermal and EMI performance. |
| NC | No internal connection | Two unconnected pads (pins 1 and 20) - must remain floating; not for grounding or routing. |
Key Features
| Feature | Design Value |
|---|---|
| Standard '245 pinout compatibility | Enables direct PCB footprint reuse across DW, DB, PW, RGY, and GQN packages - reduces redesign effort. |
| 5-Ω typical on-resistance | Minimizes insertion loss and timing skew across all 8 channels - preserves signal integrity in parallel bus applications. |
| TTL-compatible control inputs | Accepts standard 5-V TTL logic levels without external level shifters - simplifies interface with legacy microcontrollers and FPGAs. |
| Sub-2.5 ns enable/disable timing | Supports burst-mode bus arbitration and hot-plug detection with deterministic latency - essential for real-time I/O control. |
| VFBGA thermal pad | Exposed die paddle (pin 21) provides low-θJA path - improves power dissipation margin and long-term reliability at 128 mA max channel current. |
Applications
| Memory Bus Isolation | Hot-Swap Interface Control |
|---|---|
|
Use Scenario: Isolating DRAM address/data lines from CPU during memory reconfiguration or partial power-down. IC Role / Device Role / Timing Role: Bidirectional analog switch enabling/disabling full 8-bit parallel paths with nanosecond timing precision. Use Value: Prevents bus contention and data corruption during dynamic memory management without adding direction-control logic. |
Use Scenario: Safely connecting peripheral cards to live backplanes in telecom line cards or modular test equipment. IC Role / Device Role / Timing Role: High-speed isolation gate that asserts high-Z before physical insertion/removal detected by system controller. Use Value: Eliminates need for complex sequenced power rails - OE can be driven directly from hot-swap controller GPIO. |
| Level Translation Bridge | Test Access Multiplexer |
|
Use Scenario: Interfacing 3.3-V FPGA I/O banks to 5-V legacy peripherals where voltage translation is required. IC Role / Device Role / Timing Role: Passive FET switch operating within VCC range - passes signals without level shifting but maintains logic compatibility. Use Value: Avoids propagation delay and power consumption penalties of active translators while supporting mixed-voltage signaling. |
Use Scenario: Routing JTAG or boundary-scan signals between multiple ASICs on a dense PCB during production test. IC Role / Device Role / Timing Role: Low-capacitance (4 pF Cio(OFF)) multiplexer enabling clean signal routing with minimal crosstalk. Use Value: Reduces test fixture complexity - one SN74CBT3245AGQNR replaces discrete mux + buffer combinations in scan chain routing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar octal bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBT3245APWR | TSSOP-20 package (4.4 mm × 6.5 mm); 83°C/W θJA vs. GQN's 78°C/W; same electrical specs and pinout. | Preferred for prototyping or low-volume assembly using standard pick-and-place; larger footprint eases manual rework. | Select when board space allows and thermal budget permits higher junction rise; identical functionality and timing. |
| SN74CBT3245ADBQR | SSOP-20 package (7.2 mm × 5.3 mm); 68°C/W θJA; same logic behavior but 0.5 mm lead pitch requires finer trace routing. | Used in cost-sensitive industrial controllers where TSSOP/SOIC footprints dominate existing BOMs. | Choose for legacy design refreshes needing pin-compatible upgrade from older '245 switches - no schematic change needed. |
Compared with SN74CBT3245AGQNR, the TSSOP (PWR) variant offers easier handling and soldering at the expense of 2.5× larger area, while the SSOP (DBQR) delivers superior thermal performance in established layouts but demands tighter PCB fabrication tolerances.
Availability
SN74CBT3245AGQNR is available at Aetrix Electronics and suitable for industrial automation interfaces, telecom backplane interconnects, and embedded memory subsystems requiring stable component supply across extended product lifecycles.
Supply support for SN74CBT3245AGQNR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in high-reliability components.
The SN74CBT3245AGQNR belongs to TI's CBT (Crossbar Bus Transceiver) family, engineered specifically for low-latency, low-distortion digital bus switching in space-constrained, high-density systems.
FAQ
What is the maximum continuous current per channel for the SN74CBT3245AGQNR?
The SN74CBT3245AGQNR supports a maximum continuous channel current of 128 mA, as specified in its absolute maximum ratings. This rating applies under recommended operating conditions (VCC = 4 V to 5.5 V, TA = −40°C to 85°C) and ensures reliable conduction without thermal runaway. Exceeding this current may degrade on-resistance stability or accelerate wear-out mechanisms in the integrated FETs. Always verify actual load current in the target application against this limit.
Does the SN74CBT3245AGQNR require external pull-up resistors on the OE pin?
Yes - to ensure high-impedance state during power-up or power-down, OE must be tied to VCC through a pull-up resistor. The minimum value depends on the current-sinking capability of the driving source; TI recommends calculating based on worst-case IIH (input high current) and desired noise margin. For robust operation in noisy environments, a 10-kΩ resistor is commonly used. Leaving OE floating risks undefined switching states and potential bus contention.
Can the SN74CBT3245AGQNR be used for analog signal switching?
Yes - the SN74CBT3245AGQNR is a bidirectional FET switch with rail-to-rail analog capability. It supports analog signals up to VCC (5.5 V max) with minimal distortion, thanks to its low 5-Ω on-resistance and 4-pF off-capacitance. However, it lacks built-in ESD protection beyond standard HBM ratings, so external TVS diodes are recommended for analog paths exposed to connectors or cables. Its TTL-compatible control interface remains digital-only.
What is the thermal pad (pin 21) connection requirement for the SN74CBT3245AGQNR?
Pin 21 is the exposed thermal pad of the GQN package and must be soldered to a dedicated PCB copper pour connected to GND. TI specifies this connection as mandatory for both thermal performance (reducing θJA from 78°C/W to ~45°C/W in optimized layouts) and mechanical reliability. The pad should be stencil-printed with 78% solder paste coverage and include ≥4 thermal vias (0.3-mm diameter, filled/plugged) to inner ground planes. Failure to connect pin 21 compromises long-term power handling and may cause early failure under sustained 100+ mA loads.
Is the SN74CBT3245AGQNR pin-compatible with older SN74CBT3245A variants in different packages?
Yes - the SN74CBT3245AGQNR shares identical pin functions and '245-type signal ordering with DW, DB, PW, and RGY variants. Signal pins A1–A8, B1–B8, OE, VCC, and GND occupy matching relative positions across all packages. However, physical pin numbering differs due to GQN's ball-grid layout (e.g., OE is pin 11 in GQN but pin 19 in DW), so PCB layout is not interchangeable. Schematic symbol and netlist remain identical - only footprint and assembly process change.
SN74CBT3245AGQNR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBT
- Package/Case:
- 20-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Bus Switch
- Circuit:
- 8 x 1:1
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 4V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-BGA MICROSTAR JUNIOR (4x3)
SN74CBT3245AGQNR FAQ
1.How can I place an order for SN74CBT3245AGQNR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CBT3245AGQNR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74CBT3245AGQNR reliable?
The price and inventory of SN74CBT3245AGQNR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBT3245AGQNR is usually 5 days.
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Once your SN74CBT3245AGQNR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74CBT3245AGQNR?
For technical support, including SN74CBT3245AGQNR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBT3245AGQNR requirements.
6.How does Aetrix verify that SN74CBT3245AGQNR is sourced from the original manufacturer or authorized distributors?
All SN74CBT3245AGQNR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBT3245AGQNR meets industry standards.
7.What is the process for return or replacement of SN74CBT3245AGQNR?
All SN74CBT3245AGQNR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBT3245AGQNR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBT3245AGQNR part is unused and in its original packaging.
Return procedure for SN74CBT3245AGQNR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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