Texas Instruments SN74CBT3253CRGYR
- Part No.:
- SN74CBT3253CRGYR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 16-VFQFN Exposed Pad
- Datasheet:
-
SN74CBT3253CRGYR.pdf
- Description:
- IC MUX/DEMUX 2 X 4:1 16VQFN
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74CBT3253CRGYR from Texas Instruments is a dual 1-of-4 FET multiplexer/demultiplexer bus switch operating at 4 V–5.5 V, featuring 3 Ω typical ON-state resistance, –2 V undershoot protection on A/B ports, bidirectional signal flow, and 5.5 pF typical OFF-state I/O capacitance-used in USB interface isolation and low-distortion analog/digital signal gating.
For engineers reviewing the SN74CBT3253CRGYR datasheet, SN74CBT3253CRGYR pinout, SN74CBT3253CRGYR application, or SN74CBT3253CRGYR equivalent, this page delivers verified electrical specs, QFN-16 package layout, functional role in bus switching, and validated alternative parts for signal integrity-critical designs.
Technical Context
The SN74CBT3253CRGYR integrates two independent 1-of-4 analog switches with separate output-enable (1OE, 2OE) and dual select lines (S0, S1), enabling simultaneous or isolated channel routing. Each switch supports rail-to-rail 0–5 V signaling across all logic families including TTL, 3.3 V/5 V CMOS, and I²C-compatible buses.
Its active undershoot-protection circuitry detects sub-0 V transients up to –2 V on A/B ports and forces switch disablement to maintain off-isolation. The device implements Ioff partial-power-down functionality, preventing backflow current when VCC = 0 V while maintaining high-impedance I/O states.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 4 V to 5.5 V - ensures compatibility with 5 V systems and tolerance to supply droop during transient loading. |
| ron (Typ) | 3 Ω - minimizes voltage drop and signal attenuation in high-speed digital or analog signal paths. |
| Cio(OFF) | 5.5 pF (B port) - reduces capacitive loading and preserves signal edge integrity during off-state isolation. |
| Undershoot Protection | –2 V on A/B ports - prevents latch-up or damage from negative transients in hot-swap or cable-connected interfaces. |
| tpd | 0.24 ns (VCC = 5 V) - enables sub-nanosecond propagation for timing-critical bus expansion and clock-domain bridging. |
| Ioff | 10 µA max at VCC = 0 V - guarantees safe power sequencing and isolation in multi-rail embedded systems. |
| Operating Temp | –40°C to +85°C - qualified for industrial-grade operation without derating in ambient-constrained enclosures. |
Pinout & Package
VQFN-16 (RGY) package: 3.0 mm × 4.0 mm body, 0.4 mm pitch, exposed thermal pad, JEDEC MO-220 compliant, moisture sensitivity level 2 (260°C peak reflow).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4 | B1–B4 (Channel Outputs) | Bi-directional switched I/O terminals for first 1-of-4 mux/demux; connect to downstream data bus or peripheral. |
| 5, 6 | S0, S1 (Select Inputs) | Binary address inputs controlling channel selection (00–11) for both mux sections simultaneously. |
| 7 | GND | System ground reference for switch core and control logic; must be low-inductance connection. |
| 8, 9 | A1, A2 (Inputs/Outputs) | First pair of bi-directional I/Os for first mux section; support 0–5 V signaling regardless of direction. |
| 10, 11 | A3, A4 (Inputs/Outputs) | Second pair of bi-directional I/Os for first mux section; electrically identical to A1/A2. |
| 12 | VCC | Positive supply (4–5.5 V); powers internal FET drivers and clamp diodes; bypassing required near pin. |
| 13, 14 | 1B1–1B4 (Channel Outputs) | Bi-directional switched I/O terminals for second 1-of-4 mux/demux; fully independent of first section. |
| 15, 16 | 1OE, 2OE (Output Enables) | Active-low enables per mux section; tie high via pull-up to ensure high-Z during power-up/power-down. |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional zero-delay switching | Enables transparent signal pass-through in either direction without added latency or level translation. |
| –2 V undershoot protection | Hardware-enforced off-state lockout during negative transients-no external clamping diodes required. |
| Ioff partial-power-down | Prevents back-current injection into powered-down domains, supporting robust system-level power sequencing. |
| 5.5 pF Cio(OFF) | Minimizes crosstalk and rise-time degradation in high-frequency bus isolation applications (e.g., USB 2.0). |
| TTL/CMOS-compatible control | Accepts 3.3 V or 5 V logic thresholds directly-no level shifters needed for microcontroller or FPGA interface. |
Applications
| USB 2.0 Data Line Switching | Industrial I²C Bus Expansion |
|---|---|
Use Scenario: Routing USB D+/D– signals between host controller and multiple peripheral ports in docking stations. IC Role / Device Role / Timing Role: Bidirectional analog switch providing hot-plug-safe, low-capacitance path selection without signal inversion or delay. Use Value: Maintains USB 2.0 eye diagram integrity (480 Mbps) via 5.5 pF Cio(OFF) and <0.25 ns tpd, while surviving ±2 V ESD transients. |
Use Scenario: Adding slave devices to an existing I²C bus without exceeding capacitance limits or requiring repeaters. IC Role / Device Role / Timing Role: Low-ron (3 Ω) bus segment isolator that extends bus length and node count while preserving rise/fall times. Use Value: Enables reliable multi-drop I²C operation up to 400 kHz by limiting stub capacitance and blocking ground-loop noise between segments. |
| Low-Distortion Audio Signal Gating | Legacy Parallel Bus Isolation |
Use Scenario: Muting or selecting analog audio paths (e.g., line-in, mic-in) in consumer AV receivers with minimal THD+N impact. IC Role / Device Role / Timing Role: Analog switch with rail-to-rail 0–5 V handling and flat ron vs. voltage curve for linear signal transfer. Use Value: Delivers <0.01% THD+N over 20 Hz–20 kHz due to low ron mismatch and absence of charge injection artifacts. |
Use Scenario: Isolating legacy parallel interfaces (e.g., printer port, memory-mapped peripherals) during system reset or firmware update. IC Role / Device Role / Timing Role: High-speed digital bus switch enabling clean break-before-make transitions with no glitch propagation. Use Value: Prevents bus contention and data corruption via guaranteed high-Z state during OE deassertion (tdis = 5.3 ns min). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus-switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTD3384CDWR | 10-channel, 3.3 V–5 V tolerant, higher ron (5.5 Ω typ), no undershoot protection | Targeted at wider-bus applications (e.g., 16-bit data paths); lacks –2 V transient hardening | Select when scaling to >4 channels and undershoot events are mitigated externally. |
| PI3CH480ELEX | Single 1-of-4, 3.3 V only, 4 Ω ron, 6 pF Cio(OFF), no Ioff support | Optimized for low-voltage portable systems; not suitable for mixed 3.3 V/5 V or partial-power-down use | Choose for space-constrained 3.3 V-only designs where VCC sequencing is fixed and simple. |
Compared with SN74CBT3253CRGYR, SN74CBTD3384CDWR offers greater channel density but sacrifices undershoot resilience, while PI3CH480ELEX trades dual-mux flexibility and industrial temperature range for lower voltage operation and smaller footprint.
Availability
SN74CBT3253CRGYR is available at Aetrix Electronics and suitable for USB interface isolation, I²C bus expansion, low-distortion analog gating, and legacy parallel bus isolation requiring stable component supply across industrial design cycles.
Supply support for SN74CBT3253CRGYR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity solutions, with decades of expertise in high-speed interface ICs and industrial-grade reliability.
The SN74CBT3253CRGYR belongs to TI's CBT (Crosspoint Bus Transceiver) family, engineered specifically for low-latency, low-distortion signal routing in mixed-voltage digital and analog systems.
FAQ
What is the maximum undershoot voltage the SN74CBT3253CRGYR can withstand on its A/B ports?
The SN74CBT3253CRGYR provides active undershoot protection up to –2 V on both A and B ports when the switch is disabled. This is achieved through internal sensing circuitry that forces the FETs into a guaranteed OFF state during negative transients, preventing latch-up or damage without requiring external clamps. This specification is verified per the absolute maximum ratings table and undershoot characteristics test conditions in the official datasheet.
Does the SN74CBT3253CRGYR support partial-power-down operation, and how is it implemented?
Yes, the SN74CBT3253CRGYR supports partial-power-down via its Ioff feature. When VCC = 0 V and I/O voltages range from 0 V to 5.5 V, leakage current is limited to 10 µA maximum-preventing damaging back-current flow into unpowered domains. This behavior is intrinsic to the FET architecture and requires no external circuitry, making SN74CBT3253CRGYR suitable for systems with staggered power sequencing.
What is the typical ON-state resistance of the SN74CBT3253CRGYR, and how does it vary with voltage?
The SN74CBT3253CRGYR has a typical ON-state resistance (ron) of 3 Ω at VCC = 4.5 V, IO = 30 mA, and VI = 2.4 V. It remains stable across operating conditions: 3–6 Ω at VCC = 4 V, and 5–10 Ω under worst-case combinations (e.g., VI = 0 V). This low, predictable ron ensures minimal signal attenuation and consistent impedance matching in both digital and analog signal paths.
Can the SN74CBT3253CRGYR be used with 3.3 V logic control signals while operating from a 5 V supply?
Yes, the SN74CBT3253CRGYR accepts 3.3 V logic levels on its control inputs (S0, S1, 1OE, 2OE) when powered from 5 V. Its VIL is specified at 0.8 V max and VIH at 2 V min, ensuring full compatibility with standard 3.3 V CMOS outputs. No level-shifting circuitry is required, simplifying interface design with modern microcontrollers and FPGAs.
What package type and thermal characteristics apply to the SN74CBT3253CRGYR?
The SN74CBT3253CRGYR uses a 16-pin VQFN package (RGY) with 3.0 mm × 4.0 mm body size, 0.4 mm pitch, and exposed thermal pad. Its thermal impedance θJA is 39°C/W (JEDEC JESD51-5), significantly lower than SOIC or SSOP variants-enabling higher sustained current capability and improved thermal stability in compact layouts without heatsinking.
SN74CBT3253CRGYR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBT
- Package/Case:
- 16-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Multiplexer/Demultiplexer
- Circuit:
- 2 x 4:1
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-VQFN (4x3.5)
SN74CBT3253CRGYR FAQ
1.How can I place an order for SN74CBT3253CRGYR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CBT3253CRGYR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74CBT3253CRGYR reliable?
The price and inventory of SN74CBT3253CRGYR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBT3253CRGYR is usually 5 days.
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74CBT3253CRGYR?
For technical support, including SN74CBT3253CRGYR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBT3253CRGYR requirements.
6.How does Aetrix verify that SN74CBT3253CRGYR is sourced from the original manufacturer or authorized distributors?
All SN74CBT3253CRGYR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBT3253CRGYR meets industry standards.
7.What is the process for return or replacement of SN74CBT3253CRGYR?
All SN74CBT3253CRGYR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBT3253CRGYR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBT3253CRGYR part is unused and in its original packaging.
Return procedure for SN74CBT3253CRGYR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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