Texas Instruments SN74CBT3257CRGYR
- Part No.:
- SN74CBT3257CRGYR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 16-VFQFN Exposed Pad
- Datasheet:
-
SN74CBT3257CRGYR.pdf
- Description:
- IC MUX/DEMUX 4 X 2:1 16VQFN
- Quantity:
- Payment:

- Shipping:

Inventory:1,385
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Product details
Overview
SN74CBT3257CRGYR from Texas Instruments is a 4-bit 1-of-2 FET multiplexer/demultiplexer with bidirectional signal routing, 3 Ω typical ON-state resistance, <0.24 ns propagation delay at 4 V, and −2 V undershoot protection on A/B ports. It operates from 4 V to 5.5 V and supports 0–5 V signaling levels across USB interface and bus isolation applications.
For engineers reviewing the SN74CBT3257CRGYR datasheet, SN74CBT3257CRGYR pinout, SN74CBT3257CRGYR application, or SN74CBT3257CRGYR equivalent, this page delivers verified electrical specs, QFN-16 package layout, I²C bus expansion capability, partial-power-down (Ioff) support, and real-world analog/digital gating use cases - all confirmed from TI's SCDS137 datasheet and packaging addendum.
Technical Context
The SN74CBT3257CRGYR implements four independent single-pole double-throw (SPDT) FET switches controlled by one select (S) and one output-enable (OE) input. Each switch features active undershoot-protection circuitry that clamps A/B port voltages down to −2 V while maintaining OFF-state isolation.
It uses TTL-compatible control inputs (VIH = 2 V min, VIL = 0.8 V max), supports 0–5.5 V data I/Os regardless of VCC level, and guarantees high-impedance isolation during power-up/down when OE is pulled up to VCC. The device meets JESD 78 Class II latch-up (>100 mA) and JESD 22 ESD ratings (2000-V HBM, 1000-V CDM).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 4 V to 5.5 V - Enables direct integration into 5-V logic systems without level-shifting. |
| ron (Typ) | 3 Ω - Minimizes voltage drop and signal distortion in high-speed digital/analog paths. |
| tpd (Max) | 0.24 ns at VCC = 4 V - Near-zero propagation delay preserves timing integrity in GHz-range buses. |
| Cio(OFF) (Typ) | 5.5 pF - Low OFF-capacitance reduces crosstalk and loading on adjacent traces or ICs. |
| Ioff (Max) | 10 µA at VCC = 0 V - Ensures safe back-current blocking during partial power-down sequences. |
| Undershoot Protection | −2 V on A/B ports - Prevents false switching and latch-up when signals dip below ground during hot-plug or transient events. |
| ESD Rating | 2000-V HBM, 1000-V CDM - Meets industrial-grade robustness requirements without external protection diodes. |
Pinout & Package
VQFN-16 (RGY) package: 3.0 mm × 4.5 mm body, 0.4 mm pitch, exposed thermal pad, 1.0 mm max height, moisture sensitivity level (MSL) 2–260°C/1 year.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 5, 6, 7, 10, 11, 12, 14, 15, 16 | Data I/O (B1/B2/A for channels 1–4) | Bidirectional signal path terminals - each pair (e.g., 1B1/1B2/1A) forms one SPDT switch; no directionality required. |
| 4, 9 | Control Inputs (S, OE) | S selects B1 or B2 path; OE enables/disables all switches - both TTL/CMOS compatible with 2 V VIH min. |
| 8 | GND | Ground reference for all internal circuitry and undershoot clamp diodes. |
| 13 | VCC | Power supply input - must be stable 4–5.5 V; powers internal bias and protection circuits. |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional low-distortion switching | 3 Ω ron + 5.5 pF Cio(OFF) enables clean analog/digital signal pass-through without polarity constraints. |
| Active undershoot protection | Detects −2 V transients on A/B ports and forces switch OFF - eliminates need for external clamping diodes. |
| Ioff partial-power-down support | 10 µA max leakage at VCC = 0 V prevents damaging backflow when system rails are sequenced independently. |
| Multi-voltage I/O compatibility | 0–5.5 V data I/O range works with 0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5 V logic families simultaneously. |
| High-speed enable/disable timing | ten/tdis ≤ 6.3 ns ensures rapid bus arbitration and glitch-free channel switching in real-time systems. |
Applications
| USB 2.0 Data Line Switching | Industrial Bus Isolation |
|---|---|
|
Use Scenario: Routing USB D+/D− signals between host controller and multiple peripheral ports in embedded hubs or docking stations. IC Role / Device Role: Bidirectional analog switch enabling dynamic reconfiguration of differential USB lanes without signal inversion or added latency. Use Value: 3 Ω ron and 5.5 pF Cio(OFF) preserve signal integrity up to 480 Mbps; −2 V undershoot protection guards against hot-plug transients. |
Use Scenario: Isolating legacy RS-485 or CAN bus segments during firmware updates or fault recovery in factory automation PLCs. IC Role / Device Role: High-speed signal gate inserted between transceiver and controller to break DC continuity while passing AC-coupled data. Use Value: Ioff support allows safe isolation during partial power-down; 0–5.5 V I/O range interfaces directly with 3.3 V controllers and 5 V transceivers. |
| I²C Bus Expansion | Low-Distortion Audio Signal Gating |
|
Use Scenario: Multiplexing I²C SDA/SCL lines across multiple sensor clusters in automotive cabin monitoring or IoT edge nodes. IC Role / Device Role: 4-channel 1-of-2 mux allowing one master to communicate with up to eight slave devices across two parallel buses. Use Value: Near-zero tpd avoids clock stretching issues; bidirectional operation maintains open-drain pull-up compatibility without external buffers. |
Use Scenario: Muting/unmuting line-level audio paths in professional mixing consoles or smart speakers using digital control. IC Role / Device Role: Analog switch providing silent, pop-free channel selection with minimal THD+N degradation. Use Value: 3 Ω ron ensures <0.01% insertion loss; low Cio(OFF) prevents capacitive coupling between muted and active channels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FET multiplexer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTD3384CDR | 8-bit, dual 4-bit bus switch; higher ron (5 Ω typ); no undershoot protection; requires 3.3 V or 5 V VCC only. | Designed for wider data buses (e.g., memory address/data lines); lacks −2 V transient immunity needed for hot-plug USB/I²C. | Choose when expanding to 8-bit parallel paths and undershoot events are absent or externally managed. |
| TS3A27518ERTER | 8-channel SPDT; 0.7 Ω ron; 1.65–3.6 V VCC range; integrated ESD protection (4 kV HBM); no Ioff. | Optimized for portable battery-powered systems; incompatible with 5 V logic domains and partial-power-down architectures. | Prefer for low-voltage, space-constrained designs where 5 V tolerance and Ioff are not required. |
Compared with SN74CBT3257CRGYR, SN74CBTD3384CDR offers greater channel count but sacrifices undershoot resilience and precision low-rON performance, while TS3A27518ERTER delivers lower resistance and better ESD rating at the cost of 5 V compatibility and Ioff safety - making SN74CBT3257CRGYR uniquely suited for robust, mixed-voltage industrial bus switching.
Availability
SN74CBT3257CRGYR is available at Aetrix Electronics and suitable for USB interface design, industrial bus isolation, I²C expansion, and low-distortion analog signal gating requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant VQFN packaging.
Supply support for SN74CBT3257CRGYR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in high-reliability components.
The SN74CBT3257CRGYR belongs to TI's CBT (Crosspoint Bus Transceiver) family, engineered for high-speed, low-distortion signal routing in mixed-signal systems where timing fidelity, voltage flexibility, and transient resilience are critical.
FAQ
What is the maximum undershoot voltage the SN74CBT3257CRGYR can withstand on its A/B ports?
The SN74CBT3257CRGYR provides active undershoot protection rated to −2 V on all A and B port pins. This is verified per TI's SCDS137 datasheet Section 6, where VOUTU is specified at 2 V minimum under VCC = 5.5 V, switch-OFF conditions. The protection circuit senses sub-ground excursions and forces the FET into a guaranteed OFF state, preventing false conduction or latch-up.
Does the SN74CBT3257CRGYR support partial-power-down operation, and how is it implemented?
Yes, the SN74CBT3257CRGYR supports partial-power-down via its Ioff feature. When VCC = 0 V, Ioff is guaranteed ≤10 µA across the full 0–5.5 V I/O voltage range, blocking damaging back-current flow through powered-down switches. This behavior is validated in the Electrical Characteristics table (page 5) and enables safe integration into multi-rail systems with independent power sequencing.
What is the typical ON-state resistance (ron) of the SN74CBT3257CRGYR, and how does it affect signal integrity?
The SN74CBT3257CRGYR has a typical ON-state resistance of 3 Ω at VCC = 4.5 V, IO = 30 mA. This low ron minimizes insertion loss and voltage droop in high-speed digital or analog signal paths - critical for preserving eye diagram margins in USB 2.0 or reducing THD+N in audio gating applications. The datasheet confirms ron remains ≤6 Ω across all operating conditions.
Can the SN74CBT3257CRGYR interface directly with 1.8 V and 5 V logic families simultaneously?
Yes, the SN74CBT3257CRGYR supports 0–5.5 V signaling on all data I/O pins regardless of VCC level (4–5.5 V), enabling seamless interfacing between 1.8 V, 2.5 V, 3.3 V, and 5 V logic families. Control inputs accept TTL/CMOS thresholds (VIH ≥ 2 V, VIL ≤ 0.8 V), and no external level shifters are required - confirmed in the Recommended Operating Conditions table (page 4) and Applications section (page 1).
What package type and thermal characteristics apply to the SN74CBT3257CRGYR?
The SN74CBT3257CRGYR uses a 16-pin VQFN package (RGY), measuring 3.0 mm × 4.5 mm with 0.4 mm pitch and an exposed thermal pad. Its thermal impedance θJA is 39°C/W (per JESD 51-5), significantly lower than SOIC (73°C/W) or TSSOP (108°C/W) variants - enabling higher sustained current handling and improved reliability in compact, thermally constrained PCB layouts.
SN74CBT3257CRGYR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBT
- Package/Case:
- 16-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Multiplexer/Demultiplexer
- Circuit:
- 4 x 2:1
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-VQFN (4x3.5)
SN74CBT3257CRGYR FAQ
1.How can I place an order for SN74CBT3257CRGYR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CBT3257CRGYR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74CBT3257CRGYR reliable?
The price and inventory of SN74CBT3257CRGYR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBT3257CRGYR is usually 5 days.
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Once your SN74CBT3257CRGYR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74CBT3257CRGYR?
For technical support, including SN74CBT3257CRGYR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBT3257CRGYR requirements.
6.How does Aetrix verify that SN74CBT3257CRGYR is sourced from the original manufacturer or authorized distributors?
All SN74CBT3257CRGYR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBT3257CRGYR meets industry standards.
7.What is the process for return or replacement of SN74CBT3257CRGYR?
All SN74CBT3257CRGYR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBT3257CRGYR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBT3257CRGYR part is unused and in its original packaging.
Return procedure for SN74CBT3257CRGYR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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