Texas Instruments SN74CBT3383CDGVR

Overview

SN74CBT3383CDGVR from Texas Instruments is a 10-bit high-speed FET bus-exchange switch with bidirectional data flow, 3 Ω typical ON-state resistance (ron), −2 V undershoot protection on A/B ports, and 8 pF typical OFF-state I/O capacitance. It enables low-distortion signal gating in PCI interfaces and memory interleaving applications.

For engineers reviewing the SN74CBT3383CDGVR datasheet, SN74CBT3383CDGVR pinout, SN74CBT3383CDGVR application, or SN74CBT3383CDGVR equivalent, key selection criteria include its 0.15 ns propagation delay at 5 V, Ioff partial-power-down support, 4–5.5 V VCC range, and TVSOP-24 (DGV) package compatibility with 5-V/3.3-V CMOS and TTL control inputs.

Technical Context

The SN74CBT3383CDGVR implements a dual 5-bit bus-exchange architecture controlled by BE (bus-enable) and BX (exchange-select) inputs. When BE is low, it establishes bidirectional paths between A and B ports; when high, it forces high-impedance isolation. The internal FET switches feature active undershoot-protection circuitry that maintains OFF-state integrity during −2 V transients.

It supports mixed-voltage signaling (0–5 V) across data I/Os while accepting TTL- or CMOS-level control signals. Its Ioff specification ensures no backflow current during partial power-down, and latch-up immunity exceeds 100 mA per JESD78 Class II - critical for robust bus isolation in industrial and computing systems.

Key Specifications

Pinout & Package

SN74CBT3383CDGVR is housed in a 24-pin Thin Very Small Outline Package (TVSOP) with 0.4 mm lead pitch, optimized for high-density PCB layouts and automated assembly. Its thermal impedance is 86°C/W (θJA), consistent with JEDEC-standard DGV footprint.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus-exchange switch applications.

Compared with SN74CBT3383CDGVR, the DBQ variant offers better thermal performance in space-constrained industrial modules, while the PW variant provides broader manufacturing compatibility - neither is pin-compatible due to differing package outlines and land patterns, requiring PCB redesign.

Availability

SN74CBT3383CDGVR is available at Aetrix Electronics and suitable for PCI interface design, memory interleaving architectures, and bus isolation circuits requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for SN74CBT3383CDGVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions for industrial, automotive, and communications markets.

The SN74CBT3383CDGVR belongs to TI's CBT (Crosspoint Bus Transceiver) family, engineered for high-fidelity, low-latency digital signal routing in computing and data infrastructure applications.

FAQ

What is the maximum undershoot voltage the SN74CBT3383CDGVR can tolerate on its A and B ports?

The SN74CBT3383CDGVR tolerates up to −2 V undershoot on both A and B ports thanks to integrated active undershoot-protection circuitry. This feature ensures the switch remains reliably OFF during negative transients, preventing unintended conduction and protecting downstream logic. The specification is verified per test conditions in the official datasheet (SCDS175), with VIKU = −2 V measured at VCC = 5 V and switch OFF. SN74CBT3383CDGVR does not require external clamping components for this level of protection.

Does the SN74CBT3383CDGVR support partial-power-down operation, and how is it implemented?

Yes, the SN74CBT3383CDGVR supports partial-power-down operation via its Ioff feature. When VCC = 0 V, leakage current is limited to 10 µA maximum, preventing damaging backflow current from live I/O lines into the unpowered device. This behavior is intrinsic to the FET switch architecture and requires no external circuitry. The Ioff specification ensures safe hot-plug capability in modular systems - a key requirement for SN74CBT3383CDGVR in backplane and field-upgradeable equipment.

What is the propagation delay of the SN74CBT3383CDGVR, and under what conditions is it specified?

The SN74CBT3383CDGVR has a maximum propagation delay (tpd) of 0.24 ns at VCC = 4 V and 0.15 ns at VCC = 5 V, measured between A and B ports under loaded conditions. These values reflect the RC time constant formed by the typical 3 Ω ON-state resistance and a defined load capacitance, assuming an ideal zero-impedance driver. The delay is bidirectional and independent of signal direction - a core advantage of its FET-based topology. SN74CBT3383CDGVR delivers this performance across its full operating temperature range (−40°C to 85°C).

Can the SN74CBT3383CDGVR interface directly with 1.8-V or 2.5-V logic families?

Yes, the SN74CBT3383CDGVR supports direct interfacing with 0.8-V, 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V logic families on its data I/O ports (A and B sides). Its VI/O range extends from 0 to 5.5 V, and its control inputs accept TTL or 5-V/3.3-V CMOS levels - eliminating the need for external level translators. This multi-voltage capability is built into the silicon design and confirmed across all recommended operating conditions. SN74CBT3383CDGVR maintains specified ron and tpd performance regardless of I/O voltage level.

What package type and footprint does the SN74CBT3383CDGVR use, and what are its key mechanical attributes?

The SN74CBT3383CDGVR uses a 24-pin Thin Very Small Outline Package (TVSOP) with drawing code DGV, featuring a 0.4 mm lead pitch and body dimensions of 4.4 mm × 5.0 mm × 1.2 mm. It is supplied in tape-and-reel format (2000 units per reel) with Q1 pin-1 quadrant orientation. The package is RoHS-compliant, green (low-halogen), and rated MSL Level-2 (260°C peak reflow). Its θJA is 86°C/W - a value validated per JESD51-7 - making SN74CBT3383CDGVR suitable for thermally dense compute and networking PCBs.