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Texas Instruments SN74CBT3383DW
- Part No.:
- SN74CBT3383DW
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 24-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
SN74CBT3383DW.pdf
- Description:
- IC BUS FET EXCHG SW 5X2:2 24SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:1,425
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Product details
Overview
SN74CBT3383DW from Texas Instruments is a 10-bit TTL-compatible bus-exchange switch in SOIC-24 package, operating from 4.5 V to 5.5 V, with typical on-resistance of 5 Ω, propagation delay under 1 ns, and bidirectional signal flow for high-speed data routing in enterprise servers and networking equipment.
For engineers reviewing the SN74CBT3383DW datasheet, SN74CBT3383DW pinout, SN74CBT3383DW application, or SN74CBT3383DW equivalent, this page delivers verified electrical specs, functional modes (bus switch vs. nibble-swap exchange), thermal resistance (RθJA = 46.0°C/W), ESD ratings (±3000 V HBM), and real-world layout guidance for 200 MHz operation.
Technical Context
The SN74CBT3383DW implements a dual-mode 10-bit CMOS bus switch: when BX = low and BE = low, it operates as five independent 2×1 bidirectional switches (1A1↔1B1, 1A2↔1B2, etc.); when BX = high and BE = low, it performs nibble-swapped exchange (1A1↔1B2, 1A2↔1B1, etc.). All ten channels share a single VCC (4.5–5.5 V) and GND, with no level-shifting capability.
Its architecture relies on low-rON pass transistors enabling near-zero propagation delay (tpd ≤ 1 ns at CL = 50 pF), minimal capacitive loading (Cio(OFF) = 6 pF), and TTL/CMOS-compatible control inputs (VIH = 2.0 V min, VIL = 0.8 V max). It does not support hot-swap, power sequencing, or I²C/SPI interface control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 4.5 V to 5.5 V - Must be supplied within this window; operation outside invalidates all timing and rON specs. |
| rON (Typical) | 5 Ω - Enables <1 ns propagation delay with 50 pF load; critical for maintaining signal integrity up to 200 MHz. |
| tpd (Max) | 1 ns - Measured A↔B or B↔A with CL = 50 pF; defines maximum usable clock/data rate in synchronous systems. |
| Cio(OFF) | 6 pF - Low off-state capacitance minimizes crosstalk and signal distortion between inactive channels. |
| ICC (Max) | 50 µA - Ultra-low quiescent current supports energy-efficient backplane and server management subsystems. |
| ESD (HBM) | ±3000 V - Confirmed human-body model rating; requires standard ESD handling but no special protection circuitry. |
| RθJA | 46.0°C/W - SOIC-24 thermal resistance determines maximum allowable power dissipation (≈110 mW at 70°C ambient). |
Pinout & Package
SN74CBT3383DW uses a 24-pin SOIC (DW) package measuring 15.40 mm × 7.50 mm, with standard gull-wing leads, RoHS-compliant NiPdAu finish, and MSL Level-1 (unlimited floor life).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | BE | Active-low bus enable - Pull low to activate all ten switch channels; high-Z state disables all paths. |
| 2–5, 6–9, 10–11, 14–15, 16–19, 20–23 | 1B1–1B2, 2B1–2B2, 3B1–3B2, 4B1–4B2, 5B1–5B2 / 1A1–1A2, 2A1–2A2, 3A1–3A2, 4A1–4A2, 5A1–5A2 | Bidirectional I/O pairs - Each A/B pair forms one switch channel; direction determined by external signal flow, not internal logic. |
| 12 | GND | Ground reference - Single ground pin serves entire device; must be low-impedance connection to system plane. |
| 13 | BX | Bus exchange select - High enables nibble-swapped mode (1A1↔1B2, 1A2↔1B1, etc.); low enables straight-through mode. |
| 24 | VCC | Power supply - Requires local 0.1-μF ceramic decoupling capacitor placed within 3 mm of pin. |
Key Features
| Feature | Design Value |
|---|---|
| 10-bit bus exchange | Enables byte-level data reordering (e.g., little-endian ↔ big-endian) without external logic or FPGA resources. |
| Sub-ns propagation delay | tpd ≤ 1 ns ensures timing-critical paths (e.g., memory address multiplexing, PCIe sideband routing) remain uncompromised. |
| TTL/3.3-V/5-V compatible control | BE and BX accept 2.0 V min VIH and 0.8 V max VIL - interoperable with legacy TTL, modern 3.3-V LVTTL, and 5-V CMOS controllers. |
| Low off-capacitance (6 pF) | Reduces signal attenuation and reflection in high-frequency traces, supporting clean 200 MHz data transmission. |
| Single-supply 4.5–5.5 V operation | Eliminates need for dual-rail supplies or level translators in 5-V industrial and telecom backplanes. |
Applications
| Enterprise Server Backplanes | Ethernet Switch Fabric |
|---|---|
Use Scenario: Dynamic routing of control signals between CPU, BMC, and hot-swap controller across shared bus segments. IC Role / Device Role / Timing Role: Bidirectional bus switch enabling runtime reconfiguration of JTAG, SMBus, or GPIO lines without interrupting main data paths. Use Value: Eliminates mechanical jumpers and reduces BOM count while preserving sub-ns timing margins required for out-of-band management. |
Use Scenario: Selecting between two PHY interfaces (e.g., 10GBase-KR and SFP+) on a common MAC-side bus in modular line cards. IC Role / Device Role / Timing Role: 5-bit 2:1 multiplexer with simultaneous channel switching, controlled via FPGA GPIO pins. Use Value: Achieves <1 ns skew across all five lanes, preventing packet misalignment during interface failover. |
| Industrial PC I/O Expansion | Rack-Mount Router Control Plane |
Use Scenario: Sharing a single RS-485 transceiver between multiple microcontrollers in a deterministic real-time control network. IC Role / Device Role / Timing Role: Bus-exchange switch configured as 2:1 selector, isolating active MCU from idle bus stubs to reduce noise coupling. Use Value: Maintains signal integrity over 15 m cable runs at 1 Mbps by minimizing off-state capacitance and ground bounce. |
Use Scenario: Swapping address/data nibbles between two ASICs during firmware update sequences to maintain backward compatibility. IC Role / Device Role / Timing Role: Nibble-swap function activated via dedicated control line to invert byte ordering in boot ROM access path. Use Value: Enables field-upgradable legacy hardware without PCB redesign or ASIC respin. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus-switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBT3384DW | 5-bit non-exchange bus switch (no BX pin); identical rON, tpd, and package. | Lacks nibble-swap functionality; suitable only for fixed-path 2:1 selection, not dynamic byte reordering. | Select when bus exchange is unnecessary and board space allows separate 5-bit devices. |
| SN74LVC1G3157DCKR | Single-channel SPDT analog switch; 3.3-V only (1.65–5.5 V), higher rON (6 Ω typ), smaller SC70-6 package. | Requires five discrete units to match 10-bit capacity; lacks synchronized multi-channel enable (BE) or exchange (BX) control. | Choose for low-pin-count, low-power 3.3-V designs where per-channel flexibility outweighs integration loss. |
Compared with SN74CBT3383DW, SN74CBT3384DW removes exchange capability but simplifies control logic, while SN74LVC1G3157DCKR trades integration and speed for voltage flexibility and footprint reduction-neither is pin-compatible or drop-in.
Availability
SN74CBT3383DW is available at Aetrix Electronics and suitable for enterprise servers, Ethernet switches, and industrial PCs requiring stable component supply with long-lifecycle support and traceable sourcing.
Supply support for SN74CBT3383DW includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 50 years of innovation in high-reliability logic and interface solutions.
The SN74CBT3383DW belongs to TI's CBT (Crossbar Bus Technology) family, engineered for ultra-low-latency, high-bandwidth digital signal routing in mission-critical infrastructure equipment where timing predictability and signal fidelity are non-negotiable.
FAQ
What is the maximum operating frequency supported by the SN74CBT3383DW?
The SN74CBT3383DW is characterized for operation up to 200 MHz, based on its 1 ns typical propagation delay and 6 pF off-capacitance. Real-world performance depends on PCB layout, trace impedance, and load capacitance; TI recommends limiting total node capacitance to ≤50 pF to sustain full bandwidth. The SN74CBT3383DW datasheet confirms this limit under switching characteristics testing conditions.
Does the SN74CBT3383DW support level shifting between 3.3-V and 5-V domains?
No, the SN74CBT3383DW does not provide voltage level shifting. It operates strictly from a single 4.5–5.5 V supply and passes signals bi-directionally only within that rail. Input and output voltage swings are constrained to GND and VCC; connecting 3.3-V logic directly may violate absolute maximum ratings if VCC = 5.5 V. The SN74CBT3383DW is designed for same-supply-domain signal routing, not inter-rail translation.
How does the BX pin affect signal routing in the SN74CBT3383DW?
When BX = low, the SN74CBT3383DW routes signals straight through: 1A1↔1B1, 1A2↔1B2, ..., 5A2↔5B2. When BX = high (and BE = low), it swaps nibbles: 1A1↔1B2, 1A2↔1B1, ..., 5A1↔5B2. This exchange mode enables byte reordering without external logic. The SN74CBT3383DW function table explicitly defines these two operational states, with all channels disabled when BE = high.
What thermal considerations apply to the SN74CBT3383DW in continuous operation?
The SN74CBT3383DW has a junction-to-ambient thermal resistance (RθJA) of 46.0°C/W in SOIC-24 package. At maximum ICC = 50 µA and worst-case rON × I² heating, power dissipation remains below 10 mW - well within safe limits even in sealed enclosures. No heatsink is required; however, the SN74CBT3383DW demands a solid ground plane and localized 0.1-μF VCC decoupling to manage transient currents and prevent thermal runaway under heavy capacitive loads.
Can the SN74CBT3383DW be used in hot-swap applications?
No, the SN74CBT3383DW is not designed for hot-swap operation. Its absolute maximum ratings do not include live-insertion stress conditions, and it lacks built-in current limiting, slew-rate control, or undervoltage lockout. Applying VCC or signals before power stabilization may exceed VI or IO limits. For hot-swap systems, TI recommends dedicated hot-swap controllers paired with discrete FETs - the SN74CBT3383DW functions only as a passive signal router within fully powered subsystems.
SN74CBT3383DW Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBT
- Package/Case:
- 24-SOIC (0.295", 7.50mm Width)
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
- Bus FET Exchange Switch
- Circuit:
- 5 x 2:2
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-SOIC
SN74CBT3383DW FAQ
1.How can I place an order for SN74CBT3383DW through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CBT3383DW on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74CBT3383DW reliable?
The price and inventory of SN74CBT3383DW are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBT3383DW is usually 5 days.
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4.How is shipping managed for SN74CBT3383DW?
SN74CBT3383DW orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74CBT3383DW order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74CBT3383DW?
For technical support, including SN74CBT3383DW datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBT3383DW requirements.
6.How does Aetrix verify that SN74CBT3383DW is sourced from the original manufacturer or authorized distributors?
All SN74CBT3383DW products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBT3383DW meets industry standards.
7.What is the process for return or replacement of SN74CBT3383DW?
All SN74CBT3383DW units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBT3383DW, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBT3383DW part is unused and in its original packaging.
Return procedure for SN74CBT3383DW:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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