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Home > Products > Integrated Circuits (ICs) > Logic > Signal Switches, Multiplexers, Decoders

Texas Instruments SN74CBTD16210DL

Name: SN74CBTD16210DL
Brand: Texas Instruments
SKU: SN74CBTD16210DL
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: SN74CBTD16210DL

Manufacturer:: Texas Instruments

Category:: Signal Switches, Multiplexers, Decoders

Package:: 48-BSSOP (0.295", 7.50mm Width)

Datasheet:: SN74CBTD16210DL.pdf

Description:: IC BUS SWITCH 10 X 1:1 48SSOP

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Product details

Overview

SN74CBTD16210DL from Texas Instruments is a 20-bit FET bus switch with integrated level shifting, designed for bidirectional 5-V-to-3.3-V signal translation between mixed-voltage domains. It features dual 10-bit sections with independent OE controls, 5-Ω typical on-state resistance, sub-1-ns propagation delay, and TTL-compatible inputs - enabling use in high-speed memory address/data buses and PCI interface isolation.

For engineers reviewing the SN74CBTD16210DL datasheet, SN74CBTD16210DL pinout, SN74CBTD16210DL application, or SN74CBTD16210DL equivalent, key selection criteria include verified 5-V/3.3-V bidirectional level shifting capability, SSOP-48 package thermal performance (θ_JA = 63°C/W), dual-OE control flexibility, and compliance with TI's Widebus™ family timing and drive specifications.

Technical Context

This device implements two independent 10-bit FET transmission gates with diode-based V_CC-referenced clamping to enable level shifting from 5-V inputs to 3.3-V outputs. Each section operates under separate OE control, supporting either two isolated 10-bit paths or one consolidated 20-bit path.

Switching is governed by CMOS-compatible control logic: OE low enables A↔B conduction with <5 Ω r_on; OE high places both ports in high-impedance state. Propagation delay (t_pd) is specified at 0.25 ns (typ) into 50-pF load, reflecting its optimized RC time constant for high-frequency digital routing.

Key Specifications

Parameter	Value and Actual Design Meaning
On-state resistance (r_on)	5 Ω typical at V_CC = 4.5 V - ensures minimal voltage drop and signal integrity across full 128-mA channel current capability.
Propagation delay (t_pd)	0.25 ns typical - enables reliable operation in >1-GHz digital systems with tight timing budgets.
Level-shifting support	5-V input → 3.3-V output via integrated V_CC-clamp diodes - eliminates external level translators in mixed-supply designs.
Supply voltage range	4.5 V to 5.5 V - compatible with standard 5-V logic rails while maintaining robust noise margin.
Operating temperature	–40°C to +85°C - qualified for industrial-grade embedded and communications equipment.
Input leakage (I_I)	±1 µA max - prevents unintended loading of upstream drivers in high-impedance bus configurations.
Enable/disable time (t_en/t_dis)	1.5 ns to 9.8 ns - supports fast dynamic bus partitioning without metastability risk.

Pinout & Package

SN74CBTD16210DL uses a 48-pin SSOP (DL) package with 0.5-mm pitch, 12.6 mm × 6.2 mm body size, and 1.2-mm maximum height per JEDEC MO-153. Thermal resistance θ_JA is 63°C/W.

Pin/Terminal	Circuit Role	Design Meaning
1A1–1A10, 2A1–2A10	Port A inputs/outputs (Section 1 & 2)	Bidirectional data terminals for first and second 10-bit channels; internally connected to B-side via FET when OE active.
1B1–1B10, 2B1–2B10	Port B inputs/outputs (Section 1 & 2)	Complementary bidirectional terminals; functionally identical to A-side but physically separated for routing flexibility.
1OE, 2OE	Output-enable controls	Active-low enables respective 10-bit switch; independent control allows partial bus activation or staggered enable sequencing.
V_CC	Power supply	5-V rail powering internal clamp diodes and gate drive; sets output high-level reference for level shifting.
GND (Pins 8, 16, 35, 44)	Ground reference	Four dedicated ground pins minimize switching noise and ensure stable return path for all 20 channels.
NC (Pins 1, 48)	No internal connection	Unbonded pads - must remain unconnected; no routing or pull-up/pull-down required.

Key Features

Feature	Design Value
Dual independent 10-bit bus switches	Enables flexible system partitioning - e.g., isolate memory address vs. data lines or separate peripheral clusters without shared enable timing.
Integrated 5-V-to-3.3-V level shifting	Eliminates need for discrete translator ICs or resistor-divider networks, reducing BOM count and PCB area in mixed-voltage SoC interfaces.
5-Ω typical on-resistance	Preserves signal edge rate and reduces insertion loss in high-speed parallel buses up to 200 MHz.
TTL-compatible input thresholds	Accepts standard 5-V logic levels (V_IL ≤ 0.8 V, V_IH ≥ 2 V) while driving 3.3-V compatible loads - simplifies integration with legacy controllers.
Low 1.5 mA ICC supply current	Minimizes power delivery network burden in dense multi-switch configurations, critical for thermally constrained industrial modules.

Applications

PCI Bus Isolation	Memory Address Translation
Use Scenario: Isolating 5-V PCI slot signals from 3.3-V host bridge logic while preserving timing-critical control lines. IC Role / Device Role / Timing Role: Bidirectional level-shifting bus switch handling AD[31:0], C/BE[3:0]#, and PAR signals with sub-nanosecond delay. Use Value: Enables direct interconnection without external translators, meeting PCI v2.2 setup/hold timing margins under worst-case r_on and load conditions.	Use Scenario: Translating 5-V microcontroller address bus to 3.3-V SRAM or Flash memory in embedded instrumentation. IC Role / Device Role / Timing Role: High-speed address path switch with independent OE control per 10-bit segment for bank-select granularity. Use Value: Maintains <1 ns t_pd across full 20-bit width, preventing address skew that would limit maximum memory access frequency.
Backplane Signal Routing	FPGA I/O Expansion
Use Scenario: Routing multiplexed 5-V control signals across a 3.3-V backplane to distributed I/O modules. IC Role / Device Role / Timing Role: Level-shifting bus switch providing galvanic isolation between voltage domains while preserving signal integrity. Use Value: Diode-clamped architecture prevents latch-up during hot-swap events and ensures safe 5-V transient tolerance on 3.3-V side.	Use Scenario: Expanding FPGA I/O count by interfacing 5-V peripheral buses (e.g., LCD controllers, ADCs) to 3.3-V FPGA banks. IC Role / Device Role / Timing Role: Configurable 10-/20-bit switch enabling dynamic reassignment of FPGA pins between multiple peripherals. Use Value: Dual-OE architecture allows time-multiplexed sharing of FPGA resources without signal contention or bus contention hazards.

PCI Bus Isolation

Memory Address Translation

Use Scenario: Isolating 5-V PCI slot signals from 3.3-V host bridge logic while preserving timing-critical control lines.

IC Role / Device Role / Timing Role: Bidirectional level-shifting bus switch handling AD[31:0], C/BE[3:0]#, and PAR signals with sub-nanosecond delay.

Use Value: Enables direct interconnection without external translators, meeting PCI v2.2 setup/hold timing margins under worst-case r_on and load conditions.

Use Scenario: Translating 5-V microcontroller address bus to 3.3-V SRAM or Flash memory in embedded instrumentation.

IC Role / Device Role / Timing Role: High-speed address path switch with independent OE control per 10-bit segment for bank-select granularity.

Use Value: Maintains <1 ns t_pd across full 20-bit width, preventing address skew that would limit maximum memory access frequency.

Backplane Signal Routing

FPGA I/O Expansion

Use Scenario: Routing multiplexed 5-V control signals across a 3.3-V backplane to distributed I/O modules.

IC Role / Device Role / Timing Role: Level-shifting bus switch providing galvanic isolation between voltage domains while preserving signal integrity.

Use Value: Diode-clamped architecture prevents latch-up during hot-swap events and ensures safe 5-V transient tolerance on 3.3-V side.

Use Scenario: Expanding FPGA I/O count by interfacing 5-V peripheral buses (e.g., LCD controllers, ADCs) to 3.3-V FPGA banks.

IC Role / Device Role / Timing Role: Configurable 10-/20-bit switch enabling dynamic reassignment of FPGA pins between multiple peripherals.

Use Value: Dual-OE architecture allows time-multiplexed sharing of FPGA resources without signal contention or bus contention hazards.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switching applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74CBT16210DGGR	TSSOP-48 package (θ_JA = 70°C/W); identical electrical specs and pinout.	Higher thermal resistance requires more careful layout in high-power-density applications.	Select when board space constraints favor TSSOP or tape-and-reel procurement is preferred over tube packaging.
SN74CBTD3306PWR	6-bit version in TSSOP-16; lacks dual-OE and level-shifting diodes - requires external biasing for 5-V-to-3.3-V translation.	Not suitable for 20-bit wide or level-shifting–critical applications; limited to narrow-bus or same-voltage-domain use.	Choose only for cost-sensitive, low-channel-count designs where external level shifters are acceptable and thermal budget permits.

Compared with SN74CBTD16210DL, SN74CBT16210DGGR offers identical functionality in a different package with higher thermal resistance, while SN74CBTD3306PWR provides reduced channel count and no integrated level shifting - making it unsuitable as a drop-in replacement but viable for simplified, non-level-shifting roles.

Availability

SN74CBTD16210DL is available at Aetrix Electronics and suitable for industrial backplane interfaces, embedded memory subsystems, and FPGA peripheral expansion requiring stable component supply and long-term lifecycle continuity.

Supply support for SN74CBTD16210DL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of experience in high-reliability logic and interface solutions.

The SN74CBTD16210DL belongs to TI's Widebus™ family of high-speed bus switches, engineered specifically for low-latency, mixed-voltage digital signal routing in industrial, communications, and computing infrastructure.

FAQ

What is the maximum continuous current rating per channel for SN74CBTD16210DL?

The SN74CBTD16210DL supports a continuous channel current of 128 mA per switch path. This rating is validated across the full operating temperature range (–40°C to +85°C) and ensures reliable conduction without thermal derating under typical 5-V supply conditions. Exceeding this current may increase r_on and affect timing margins in high-frequency applications.

Does SN74CBTD16210DL support true bidirectional level shifting between 5-V and 3.3-V domains?

Yes, SN74CBTD16210DL provides verified bidirectional level shifting: 5-V signals applied to Port A are translated to ~3.3-V levels at Port B, and vice versa, using integrated V_CC-referenced clamping diodes. This behavior is explicitly characterized in the datasheet and confirmed across all 20 channels under recommended operating conditions.

Can SN74CBTD16210DL be used with a 3.3-V-only supply voltage?

No - SN74CBTD16210DL requires a 4.5-V to 5.5-V V_CC supply to enable its level-shifting function. The internal diode clamps rely on V_CC as the reference; operating below 4.5 V violates recommended conditions and disables guaranteed level translation, potentially causing signal integrity failures or increased leakage.

How many ground pins does SN74CBTD16210DL have, and why are they distributed?

SN74CBTD16210DL has four dedicated ground pins (Pins 8, 16, 35, and 44) placed across the SSOP-48 footprint. This distribution minimizes ground loop inductance and provides low-impedance return paths for all 20 switched channels, directly supporting its sub-nanosecond timing performance and reducing simultaneous switching noise in high-speed parallel buses.

Is SN74CBTD16210DL pin-compatible with other members of the Widebus™ 20-bit switch family?

Yes - SN74CBTD16210DL shares identical pinout and functional mapping with SN74CBT16210DGGR and SN74CBTD16210DGVR, including matching Port A/B assignments, OE locations, V_CC, and GND placements. This allows direct PCB reuse across DL, DGG, and DGV packages when thermal or assembly requirements change.

SN74CBTD16210DL Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: 74CBTD

Package/Case:: 48-BSSOP (0.295", 7.50mm Width)

Packaging:: Bulk

Product Status:: Active

Type:: Bus Switch

Circuit:: 10 x 1:1

Independent Circuits:: 2

Current - Output High, Low:: -

Voltage Supply Source:: Single Supply

Voltage - Supply:: 4.5V ~ 5.5V

Operating Temperature:: -40°C ~ 85°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 48-SSOP

SN74CBTD16210DL FAQ

1.How can I place an order for SN74CBTD16210DL through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74CBTD16210DL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74CBTD16210DL reliable?

The price and inventory of SN74CBTD16210DL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBTD16210DL is usually 5 days.

3.What payment methods are accepted for SN74CBTD16210DL?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74CBTD16210DL transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SN74CBTD16210DL?

SN74CBTD16210DL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SN74CBTD16210DL order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74CBTD16210DL?

For technical support, including SN74CBTD16210DL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBTD16210DL requirements.

6.How does Aetrix verify that SN74CBTD16210DL is sourced from the original manufacturer or authorized distributors?

All SN74CBTD16210DL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBTD16210DL meets industry standards.

7.What is the process for return or replacement of SN74CBTD16210DL?

All SN74CBTD16210DL units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTD16210DL, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74CBTD16210DL part is unused and in its original packaging.

Return procedure for SN74CBTD16210DL:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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