Texas Instruments SN74CBTD16211DGVR

Overview

SN74CBTD16211DGVR from Texas Instruments is a 24-bit FET bus switch with integrated level-shifting capability, designed for bidirectional 5-V-to-3.3-V signal translation between TTL-compatible buses. It features dual 12-bit independent channels, 5 Ω typical on-state resistance, sub-nanosecond propagation delay (0.25 ns), and operates across –40°C to 85°C. It is used in mixed-voltage system interconnects such as memory expansion interfaces and FPGA-to-ASIC data paths.

For engineers reviewing the SN74CBTD16211DGVR datasheet, SN74CBTD16211DGVR pinout, SN74CBTD16211DGVR application, or SN74CBTD16211DGVR equivalent, key selection criteria include its dual-channel OE control, guaranteed 5 Ω r_on at 4.5 V V_CC, 50 pF load switching performance, and TVSOP-56 package compatibility with high-density PCB layouts.

Technical Context

The SN74CBTD16211DGVR implements a passive FET-based bus switch architecture with no internal logic or latching-signal path conduction is purely analog and bidirectional. Each 12-bit channel uses separate OE inputs to enable/disable A↔B connectivity, supporting flexible partitioning as two independent 12-bit switches or one unified 24-bit path.

Level shifting is achieved via integrated diode-to-V_CC clamping on input pins, enabling safe translation of 5-V inputs to 3.3-V outputs without external components. The device requires no biasing or clocking and exhibits minimal capacitive loading (C_io(OFF) = 5.5 pF) when disabled.

Key Specifications

Pinout & Package

SN74CBTD16211DGVR is housed in a 56-pin Thin Very Small Outline Package (TVSOP, DGV), measuring 4.4 mm × 9.7 mm × 1.2 mm max height, JEDEC MO-194 compliant, with exposed pad not electrically connected.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switch applications.

Compared with SN74CBT16211DGVR and SN74LVC16245ADGVR, the SN74CBTD16211DGVR uniquely combines bidirectional transparency, integrated 5-V-to-3.3-V translation, and sub-nanosecond timing-making it irreplaceable in mixed-voltage parallel bus isolation where zero-latency analog pass-through is mandatory.

Availability

SN74CBTD16211DGVR is available at Aetrix Electronics and suitable for industrial backplane interconnects, FPGA-to-ASIC bridging, and automotive diagnostic multiplexing requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for SN74CBTD16211DGVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in high-speed interface solutions and industrial-grade reliability.

The SN74CBTD16211DGVR belongs to TI's Widebus™ family of FET bus switches, engineered specifically for low-latency, level-shifting interconnects in mixed-voltage digital systems-from communications infrastructure to automotive control units.

FAQ

What is the maximum continuous current rating per switch in SN74CBTD16211DGVR?

The SN74CBTD16211DGVR supports 128 mA continuous channel current per switch path, verified across the full operating temperature range. This rating ensures reliable operation when driving terminated transmission lines or multiple CMOS loads without thermal derating at 85°C ambient. Exceeding this limit risks parametric shift or long-term reliability degradation.

Does SN74CBTD16211DGVR support true bidirectional signal flow without direction control pins?

Yes, SN74CBTD16211DGVR provides fully bidirectional analog pass-through-data flows equally well from A-to-B or B-to-A when enabled. Unlike transceivers, it has no DIR pin; conduction is symmetric and voltage-agnostic, making it ideal for legacy bus architectures where direction is determined externally.

Can SN74CBTD16211DGVR translate 3.3-V inputs to 5-V outputs?

No, SN74CBTD16211DGVR is designed exclusively for 5-V-to-3.3-V level shifting via internal diode-to-V_CC clamping. Driving 3.3-V signals into A or B ports while V_CC = 5 V does not produce boosted outputs; the device lacks active up-translation circuitry and will pass 3.3-V signals unchanged.

What is the thermal resistance (θ_JA) of SN74CBTD16211DGVR in its TVSOP package?

The SN74CBTD16211DGVR in TVSOP-56 (DGV) package has a specified junction-to-ambient thermal resistance (θ_JA) of 48°C/W under JEDEC JESD51-7 conditions. This value assumes standard 2-layer PCB layout with 1-in² copper pour; actual performance improves with enhanced thermal vias and inner-layer copper planes.

Are unused OE inputs required to be tied high or low for proper SN74CBTD16211DGVR operation?

Yes-per TI's SCBA004 guidance, all unused OE inputs on SN74CBTD16211DGVR must be held statically at either V_CC or GND. Floating OE pins cause undefined channel states, increased ICC, and potential bus contention; tie-off resistors (≤10 kΩ) are recommended for robustness in noisy environments.