Texas Instruments SN74CBTD16211DL
- Part No.:
- SN74CBTD16211DL
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 56-BSSOP (0.295", 7.50mm Width)
- Datasheet:
-
SN74CBTD16211DL.pdf
- Description:
- IC BUS SWITCH 12 X 1:1 56SSOP
- Quantity:
- Payment:

- Shipping:

Inventory:2,575
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Product details
Overview
SN74CBTD16211DL from Texas Instruments is a 24-bit FET bus switch with integrated level shifting, designed for bidirectional 5-V-to-3.3-V signal translation between TTL-compatible buses. It features dual 12-bit independent channels, 5-Ω on-state resistance, sub-nanosecond propagation delay (0.25 ns), and operates over –40°C to 85°C. It is used in high-speed memory expansion interfaces requiring voltage domain isolation.
For engineers reviewing the SN74CBTD16211DL datasheet, SN74CBTD16211DL pinout, SN74CBTD16211DL application, or SN74CBTD16211DL equivalent, key selection criteria include verified 5-Ω Ron, dual OE control for channel independence, level-shifting capability without external biasing, and SSOP-56 package compatibility with legacy board layouts.
Technical Context
The SN74CBTD16211DL implements a passive FET-based bus switch architecture with no internal logic or latching-signal path is purely analog and bidirectional. Each 12-bit section uses separate OE inputs to enable/disable A↔B connectivity, with high-impedance isolation when OE is high. The integrated diode-to-VCC structure enables automatic 5-V-to-3.3-V level translation on outputs without external components.
It operates strictly within 4.5 V–5.5 V VCC range and supports TTL-compatible input thresholds (VIH ≥ 2 V, VIL ≤ 0.8 V). Input and output pins tolerate up to 7 V, but continuous operation above VCC requires current limiting per absolute maximum ratings. Propagation delay is dominated by RC time constant of Ron and load capacitance (CL = 50 pF typical).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 4.5 V to 5.5 V - ensures stable operation with standard 5-V supply rails and tolerance for ripple or droop. |
| On-State Resistance (Ron) | 5 Ω typical - minimizes voltage drop and signal distortion during high-speed switching (e.g., <10 mV drop at 20 mA). |
| Propagation Delay (tpd) | 0.25 ns max - enables sub-GHz data rates in parallel bus applications like memory expansion or FPGA I/O bridging. |
| Level-Shifting Capability | 5-V inputs → 3.3-V outputs - achieved via internal diode clamp to VCC; no external resistors or bias required. |
| Input Voltage Range (VI) | –0.5 V to 7 V - supports hot-swap and overvoltage transient tolerance on bus lines. |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade embedded systems including communications backplanes and test equipment. |
Pinout & Package
SN74CBTD16211DL is housed in a 56-pin Plastic Small-Outline Package (SSOP-DL), 11.4 mm × 7.5 mm body size, 0.635 mm pitch, JEDEC MO-118 compliant, with 1.2 mm max height and gull-wing leads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A1–1A12, 2A1–2A12 | Input/Output Port A (Channel 1 & 2) | Bidirectional data terminals for first and second 12-bit bus segments; connected to B-side when OE active. |
| 1B1–1B12, 2B1–2B12 | Input/Output Port B (Channel 1 & 2) | Bidirectional data terminals mirroring A-side; supports level-shifted output when VCC = 5 V and A-side driven at 5 V. |
| 1OE, 2OE | Output Enable (Active-Low) | Independent control for each 12-bit channel; low = conductive path, high = high-Z isolation. |
| VCC | Positive Supply | 5-V power rail; also serves as reference for internal level-shifting diode clamp network. |
| GND (Pins 8, 17, 34, 43) | Ground Reference | Four dedicated ground pins reduce ground bounce and improve noise immunity in high-speed switching. |
| NC (Pins 1, 56) | No Internal Connection | Unbonded pads; must remain unconnected to avoid mechanical stress or unintended coupling. |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent 12-bit channels | Enables flexible partitioning-e.g., one channel for address bus, another for data bus-without cross-talk or shared timing constraints. |
| 5-Ω low on-state resistance | Preserves signal integrity in 50-Ω–100-Ω transmission environments; reduces rise/fall time degradation in parallel buses. |
| Integrated level-shifting diode | Eliminates need for external pull-downs or level translators when interfacing 5-V microcontrollers to 3.3-V peripherals. |
| TTL-compatible control inputs | Direct drive from legacy 5-V logic families (e.g., 74LS, 74F) without interface buffers or voltage dividers. |
| High-impedance off-state | Isolates bus segments during power sequencing or fault conditions, preventing back-driving and contention. |
Applications
| Memory Expansion Interface | FPGA I/O Bridging |
|---|---|
Use Scenario: Connecting a 5-V microcontroller's parallel address/data bus to a 3.3-V SRAM or Flash memory module. IC Role / Device Role / Timing Role: Bidirectional level-shifting bus switch enabling clean signal transfer without timing skew or voltage mismatch. Use Value: Eliminates discrete resistor networks or dedicated level translators, reducing BOM count and PCB area while maintaining <1 ns timing margin. | Use Scenario: Interfacing legacy 5-V peripheral controllers (e.g., UART, SPI masters) to 3.3-V FPGA I/O banks. IC Role / Device Role / Timing Role: Passive signal conduit with sub-ns delay, preserving setup/hold timing across voltage domains. Use Value: Avoids clock-domain crossing logic overhead and simplifies timing closure in mixed-voltage system-on-module designs. |
| Industrial Backplane Isolation | Test Equipment Signal Routing |
Use Scenario: Isolating hot-swappable 5-V I/O modules from a central 3.3-V controller bus in programmable logic controllers. IC Role / Device Role / Timing Role: High-Z disconnect under OE control prevents bus contention during insertion/removal events. Use Value: Enables true hot-swap capability without sequenced power-up or software coordination, improving system uptime. | Use Scenario: Reconfigurable signal routing between 5-V DUT interfaces and 3.3-V measurement ASICs in automated test equipment. IC Role / Device Role / Timing Role: Low-capacitance (5.5 pF OFF), low-Ron switch supporting multi-GHz edge rates in probe card interconnects. Use Value: Maintains signal fidelity for high-resolution timing measurements (e.g., jitter analysis) without added skew or attenuation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBT16211DGGR | TSSOP-56 package; identical electrical specs; lower thermal resistance (64°C/W vs. DL's 56°C/W). | Better suited for high-density, reflow-soldered PCBs where footprint area is constrained. | Preferred for new designs requiring RoHS-compliant tape-and-reel delivery and improved thermal performance. |
| SN74CBTD16210DL | 20-bit version (vs. 24-bit); same SSOP-56 package; identical Ron, tpd, and level-shifting behavior. | Applicable where fewer data lines are needed-e.g., narrow-memory or partial-bus configurations. | Select when BOM rationalization or reduced pin count aligns with system architecture; not a drop-in replacement. |
Compared with SN74CBTD16211DL, SN74CBT16211DGGR offers superior thermal management in compact layouts, while SN74CBTD16210DL provides functional equivalence at reduced width-both require layout review due to differing pin assignments and bit-width constraints.
Availability
SN74CBTD16211DL is available at Aetrix Electronics and suitable for memory expansion interfaces, FPGA I/O bridging, industrial backplane isolation, and test equipment signal routing requiring stable component supply across extended temperature ranges.
Supply support for SN74CBTD16211DL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal technologies with over 90 years of innovation in industrial, automotive, and communications markets.
The SN74CBTD16211DL belongs to TI's Widebus™ family of high-speed bus switches, engineered specifically for low-latency, level-shifting interconnect in mixed-voltage digital systems.
FAQ
What is the maximum operating frequency supported by the SN74CBTD16211DL?
The SN74CBTD16211DL does not specify a maximum clock frequency, as it is a passive analog switch-not a clocked device. Its usable bandwidth is determined by RC time constant: with 5-Ω Ron and 50-pF load, tpd = 0.25 ns implies effective bandwidth >1 GHz. System-level limits depend on trace impedance, termination, and driver strength-not the SN74CBTD16211DL itself.
Can the SN74CBTD16211DL translate signals from 3.3 V to 5 V?
No-the SN74CBTD16211DL is optimized for 5-V-to-3.3-V level shifting only, using an internal diode-to-VCC structure. Driving 3.3-V signals into A-side ports will result in ~3.3-V output on B-side, but no active up-shifting occurs. For bidirectional or up-shifting, external circuitry or alternate devices like TXB0108 are required.
Does the SN74CBTD16211DL require external pull-up or pull-down resistors on its control inputs?
No-TI explicitly states that unused control inputs (OE) must be held at VCC or GND to ensure proper operation, but no external resistors are needed if actively driven. The SN74CBTD16211DL has TTL-compatible input thresholds (VIH ≥ 2 V, VIL ≤ 0.8 V), so direct connection to 5-V logic outputs satisfies this requirement without pull components.
What is the thermal resistance (θJA) of the SN74CBTD16211DL in its SSOP package?
The SN74CBTD16211DL in SSOP-DL package has a specified junction-to-ambient thermal resistance (θJA) of 56°C/W under standard JEDEC test conditions. This value assumes a 2-layer board with 1-in² copper pad; actual performance improves with enhanced PCB copper area or thermal vias.
Is the SN74CBTD16211DL pin-compatible with other members of the SN74CBTD162xx family?
No-pin compatibility is not guaranteed across the SN74CBTD162xx series. For example, SN74CBTD16210DL (20-bit) uses different pin assignments for data lines versus SN74CBTD16211DL (24-bit). Always verify pinout diagrams and package drawings before substitution; the SN74CBTD16211DL's 56-pin SSOP layout is unique to its 24-bit dual-channel configuration.
SN74CBTD16211DL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBTD
- Package/Case:
- 56-BSSOP (0.295", 7.50mm Width)
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Type:
- Bus Switch
- Circuit:
- 12 x 1:1
- Independent Circuits:
- 2
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-SSOP
SN74CBTD16211DL FAQ
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6.How does Aetrix verify that SN74CBTD16211DL is sourced from the original manufacturer or authorized distributors?
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7.What is the process for return or replacement of SN74CBTD16211DL?
All SN74CBTD16211DL units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTD16211DL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBTD16211DL part is unused and in its original packaging.
Return procedure for SN74CBTD16211DL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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