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Texas Instruments SN74CBTD3384CDBQR

Part No.:
SN74CBTD3384CDBQR
Manufacturer:
Texas Instruments
Category:
Signal Switches, Multiplexers, Decoders
Package:
24-SSOP (0.154", 3.90mm Width)
Datasheet:
AetrixSN74CBTD3384CDBQR.pdf
Description:
IC BUS SWITCH 5 X 1:1 24SSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,325

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Product details

Overview

SN74CBTD3384CDBQR from Texas Instruments is a 24-pin SSOP (DBQ) 10-bit FET bus switch with bidirectional data flow, 3 Ω typical ON-state resistance, −2 V undershoot protection on A/B ports, and integrated 5-V-to-3.3-V level shifting. It operates from 4.5 V to 5.5 V and supports mixed-voltage signaling (0.8 V to 5 V) in memory interleaving and bus isolation applications.

For engineers reviewing the SN74CBTD3384CDBQR datasheet, SN74CBTD3384CDBQR pinout, SN74CBTD3384CDBQR application, or SN74CBTD3384CDBQR equivalent, this page delivers verified electrical parameters, package-specific thermal data (θJA = 61°C/W), Ioff-enabled partial-power-down operation, and real-world use context for high-speed TTL-compatible signal gating.

Technical Context

The SN74CBTD3384CDBQR implements two independent 5-bit FET bus switches with separate 1OE and 2OE controls, enabling configurable 5-bit or consolidated 10-bit operation. Its active undershoot-protection circuitry monitors A/B port voltage and forces OFF-state retention during −2 V transients.

Level shifting is achieved via an integrated diode in series with VCC, allowing 5-V inputs to drive 3.3-V outputs without external components. The device features Ioff current ≤10 µA at VCC = 0 V and input/output capacitance of 5 pF (OFF) and 12.5 pF (ON), minimizing signal distortion in high-frequency digital paths.

Key Specifications

Parameter Value and Actual Design Meaning
VCC Range 4.5 V to 5.5 V - Ensures compatibility with standard 5-V TTL logic rails while supporting tight supply tolerances.
ron (Typical) 3 Ω - Delivers near-zero propagation delay (0.15 ns) and minimal voltage drop under ±128 mA load.
Cio(OFF) 5 pF - Reduces capacitive loading on driven buses, preserving signal integrity in high-speed parallel interfaces.
Undershoot Protection −2 V on A/B ports - Prevents false switching and latch-up during negative transients in hot-plug or noisy environments.
Ioff 10 µA max at VCC = 0 V - Enables safe partial-power-down mode with no backflow current between powered/unpowered domains.
Propagation Delay 0.15 ns - Matches or exceeds TTL timing budgets in memory address/data bus switching applications.
Operating Temperature −40°C to +85°C - Qualified for industrial-grade embedded systems requiring extended thermal stability.

Pinout & Package

SN74CBTD3384CDBQR uses a 24-pin SSOP (DBQ) package with 0.65 mm pitch, 7.9 mm × 6.2 mm body size, and 1.2 mm maximum height. Thermal resistance θJA is 61°C/W per TI package data.

Pin/Terminal Circuit Role Design Meaning
1OE, 2OE Output-enable control inputs Active-low enables respective 5-bit switch sections; must be pulled up to VCC during power sequencing to ensure high-impedance state.
1A1–1A5, 2A1–2A5 Data inputs/outputs (Port A) Bidirectional I/O pins for first and second 5-bit switch banks; support 0–5 V signaling levels including 3.3 V and 5 V logic.
1B1–1B5, 2B1–2B5 Data inputs/outputs (Port B) Corresponding bidirectional I/O pins connected to Port A when OE is low; feature integrated undershoot clamp diodes.
VCC Positive supply Supplies internal FET switches and level-shifting diode; range 4.5–5.5 V; decoupling required within 10 mm of pin.
GND Ground reference Common return path for all signals and supply; requires low-inductance connection to minimize ground bounce.

Key Features

Feature Design Value
Bidirectional bus switching Enables reuse of same physical traces for read/write data flow without direction-control logic or external buffers.
Integrated 5-V-to-3.3-V level shift Eliminates need for discrete level translators in mixed-voltage memory or peripheral interconnects.
−2 V undershoot protection Prevents erroneous conduction and system lockup during ESD events or cable disconnect transients.
Ioff partial-power-down Allows one subsystem to power down while others remain active, avoiding cross-current damage in multi-rail designs.
Low 5 pF OFF-state capacitance Maintains high impedance isolation (>100 kΩ at 10 MHz), critical for preventing crosstalk in dense PCB layouts.

Applications

Memory Interleaving Bus Isolation

Use Scenario: High-speed DDR memory controller routing multiple banks with shared address/control lines.

IC Role / Device Role / Timing Role: Bidirectional 10-bit switch isolating address/command signals between controller and selected memory bank.

Use Value: Enables dynamic bank selection with <0.15 ns added delay and no level-shifting overhead across 3.3-V/5-V interface boundaries.

Use Scenario: Isolating legacy 5-V peripherals from modern 3.3-V microcontroller buses during firmware updates.

IC Role / Device Role / Timing Role: Controlled gate for data/address lines, activated only during active communication windows.

Use Value: Prevents back-driving and voltage contention while maintaining full 5-V signal swing on peripheral side and 3.3-V compatibility on MCU side.

Low-Distortion Signal Gating Hot-Swap Interface Protection

Use Scenario: Enabling/disabling analog sensor signals routed through digital multiplexers in precision measurement systems.

IC Role / Device Role / Timing Role: Low-capacitance, low-ron analog switch for DC-coupled sensor outputs before ADC input stage.

Use Value: Delivers <5 pF OFF-state capacitance and 3 Ω ON-resistance to preserve signal fidelity and minimize settling time errors.

Use Scenario: Protecting backplane slots during live insertion/removal of PCIe or CompactPCI cards.

IC Role / Device Role / Timing Role: Undershoot-protected bus switch placed between slot connector and host logic.

Use Value: Withstands −2 V transients without latching, ensuring reliable hot-swap operation without system reset or data corruption.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switch applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74CBT3384CPWR TSSOP-24 (PW) package; θJA = 88°C/W vs. 61°C/W for DBQ; identical electrical specs and pinout. Higher thermal resistance limits sustained high-current operation in compact enclosures without forced airflow. Select SN74CBT3384CPWR only if board layout already uses TSSOP footprints and thermal margin ≥15°C is confirmed.
SN74CBTD3384CDBR SSOP-24 (DB) package; θJA = 63°C/W vs. 61°C/W; same marking "CC384C", different tape/reel quantity (2000 vs. 2500). Marginally higher thermal resistance and non-lead-free finish (NIPDAU/Sn); otherwise functionally identical. Choose SN74CBTD3384CDBR for cost-sensitive production where MSL Level-1 reflow profile suffices and RoHS exemption is acceptable.

Compared with SN74CBTD3384CDBQR, SN74CBT3384CPWR trades thermal performance for smaller footprint, while SN74CBTD3384CDBR offers equivalent functionality with slightly reduced thermal efficiency and alternate packaging compliance-both require no schematic changes but may impact thermal design or procurement logistics.

Availability

SN74CBTD3384CDBQR is available at Aetrix Electronics and suitable for memory interleaving, bus isolation, and low-distortion signal gating requiring stable component supply across industrial temperature ranges and long-lifecycle programs.

Supply support for SN74CBTD3384CDBQR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with over 50 years of innovation in high-reliability interface and signal-path ICs.

The SN74CBTD3384CDBQR belongs to TI's CBTD-series bus switches, engineered for high-speed, low-distortion digital signal routing in mixed-voltage systems where timing integrity and robustness against transients are critical.

FAQ

What is the maximum undershoot voltage the SN74CBTD3384CDBQR can withstand on its A and B ports?

The SN74CBTD3384CDBQR provides active undershoot protection up to −2 V on both A and B ports, as verified in the absolute maximum ratings and undershoot characteristics section of the datasheet. This protection is implemented via internal sensing circuitry that forces the switch into a guaranteed OFF state during transient events, preventing unintended conduction or latch-up. The SN74CBTD3384CDBQR maintains this rating across its full operating temperature range (−40°C to +85°C) and supply voltage range (4.5 V to 5.5 V).

Does the SN74CBTD3384CDBQR support true bidirectional signal flow without direction-control pins?

Yes, the SN74CBTD3384CDBQR supports fully bidirectional data flow between its A and B ports without requiring external direction-control logic. When 1OE or 2OE is low, the corresponding 5-bit switch section connects A and B terminals with near-zero resistance (3 Ω typical), allowing signals to pass in either direction. This architecture eliminates the need for dedicated direction pins or additional control circuitry, simplifying PCB layout and reducing component count in applications like memory bus switching and hot-swap interfaces.

Can the SN74CBTD3384CDBQR be used for level shifting between 5-V and 3.3-V logic domains?

Yes, the SN74CBTD3384CDBQR integrates a diode in series with VCC to provide inherent 5-V-to-3.3-V level shifting. When a 5-V signal is applied to the A port, the internal diode drops ~1.7 V, resulting in approximately 3.3 V at the B port under typical conditions. This feature is explicitly documented in the device description and functional behavior sections of the datasheet, and requires no external components. The SN74CBTD3384CDBQR does not support reverse-direction (3.3-V-to-5-V) level shifting.

What is the thermal resistance (θJA) of the SN74CBTD3384CDBQR in its DBQ package?

The SN74CBTD3384CDBQR in the SSOP (DBQ) package has a specified junction-to-ambient thermal resistance (θJA) of 61°C/W, as published in the absolute maximum ratings table of the official Texas Instruments datasheet. This value assumes standard JEDEC test conditions (JESD 51-7) and is critical for calculating maximum allowable power dissipation in thermally constrained applications. The SN74CBTD3384CDBQR's low ron (3 Ω typical) minimizes self-heating, making it suitable for high-density layouts where thermal management is limited.

How does the Ioff feature of the SN74CBTD3384CDBQR protect systems during partial power-down?

The Ioff feature of the SN74CBTD3384CDBQR limits current to ≤10 µA when VCC = 0 V and any I/O pin is biased between 0 V and 5.5 V, preventing damaging backflow current between powered and unpowered subsystems. This enables safe partial-power-down operation in multi-rail systems-for example, allowing a 3.3-V microcontroller to remain active while a 5-V peripheral domain is shut down. The SN74CBTD3384CDBQR maintains high-impedance isolation under these conditions, eliminating the risk of latch-up or supply rail contamination.

SN74CBTD3384CDBQR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74CBTD
Package/Case:
24-SSOP (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Bus Switch
Circuit:
5 x 1:1
Independent Circuits:
2
Current - Output High, Low:
-
Voltage Supply Source:
Single Supply
Voltage - Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-SSOP

SN74CBTD3384CDBQR FAQ

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Please submit a Request for Quotation (RFQ) for SN74CBTD3384CDBQR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of SN74CBTD3384CDBQR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBTD3384CDBQR is usually 5 days.

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5.How can I obtain technical support or documentation for SN74CBTD3384CDBQR?

For technical support, including SN74CBTD3384CDBQR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBTD3384CDBQR requirements.

6.How does Aetrix verify that SN74CBTD3384CDBQR is sourced from the original manufacturer or authorized distributors?

All SN74CBTD3384CDBQR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBTD3384CDBQR meets industry standards.

7.What is the process for return or replacement of SN74CBTD3384CDBQR?

All SN74CBTD3384CDBQR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTD3384CDBQR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74CBTD3384CDBQR part is unused and in its original packaging.

Return procedure for SN74CBTD3384CDBQR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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