Texas Instruments SN74CBTD3384DWR
- Part No.:
- SN74CBTD3384DWR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 24-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
SN74CBTD3384DWR.pdf
- Description:
- IC BUS SWITCH 5 X 1:1 24SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:1,500
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Product details
Overview
SN74CBTD3384DWR from Texas Instruments is a 10-bit TTL-compatible bus switch IC with dual 5-bit independent channels, 5-Ω on-state resistance, 0.25 ns propagation delay, and integrated level-shifting diode enabling 5-V-to-3.3-V signal translation in mixed-voltage systems.
For engineers reviewing the SN74CBTD3384DWR datasheet, SN74CBTD3384DWR pinout, SN74CBTD3384DWR application, or SN74CBTD3384DWR equivalent, this page delivers verified electrical specs, SOIC-24 package mapping, functional role in voltage-domain isolation, and validated alternative options for bus switching design.
Technical Context
The SN74CBTD3384DWR implements two independent 5-bit bidirectional analog switches controlled by separate OE inputs; each channel connects port A to port B when OE is low (active-low enable), delivering high-impedance isolation when OE is high. Its low on-resistance ensures minimal RC delay under 50-pF load conditions.
Integrated clamp diodes to VCC enable level shifting from 5-V inputs to 3.3-V outputs without external components, while TTL-compatible control inputs (VIH = 2 V, VIL = 0.8 V) simplify interfacing with legacy logic families. The device operates across −40°C to 85°C with 4.5–5.5 V supply range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| On-state resistance | 5 Ω typical - enables low-loss signal pass-through with <0.15 V drop at 30 mA per switch |
| Propagation delay | 0.25 ns max - supports >1 GHz digital signal routing without timing degradation |
| Supply voltage | 4.5 V to 5.5 V - compatible with standard 5-V logic rails and tolerant of ±10% regulation variation |
| Input voltage range | −0.5 V to 7 V - accommodates transient overshoot and undershoot without latch-up risk |
| Channel current | 128 mA continuous - sustains full-load operation across all 10 switches simultaneously |
| Enable timing | ten = 2.3 ns, tdis = 1.7 ns - ensures fast bus arbitration and dynamic channel reconfiguration |
| Operating temperature | −40°C to +85°C - qualified for industrial-grade embedded and communications equipment |
Pinout & Package
SN74CBTD3384DWR uses a 24-pin SOIC (DW) package with 300-mil body width, 0.65-mm lead pitch, and JEDEC MO-150 compliance. Pin 1 is located at top-left corner with index marking; leads are gull-wing, matte tin-plated, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE | Channel 1 output-enable input | Active-low control: drives 1A1–1A5 ↔ 1B1–1B5 connection when low; high-impedance when high |
| 1B1–1B5 | Channel 1 port B terminals | Bidirectional I/O pins connected to 5-V domain; tolerate up to 7 V input |
| 1A1–1A5 | Channel 1 port A terminals | Bidirectional I/O pins connected to 3.3-V domain; level-shifted via internal VCC diode |
| GND | Ground reference | Common return path for both channels; must be low-inductance connection to minimize noise coupling |
| VCC | Power supply | 5-V supply rail powering internal logic and clamp diodes; bypassing with 0.1 µF ceramic required |
| 2A1–2A5 | Channel 2 port A terminals | Independent 3.3-V side of second 5-bit switch; electrically isolated from Channel 1 |
| 2B1–2B5 | Channel 2 port B terminals | Independent 5-V side of second 5-bit switch; no cross-channel leakage per datasheet test data |
| 2OE | Channel 2 output-enable input | Independent active-low enable; allows asynchronous control of second bus segment |
Key Features
| Feature | Design Value |
|---|---|
| 5-Ω analog switch on-resistance | Minimizes insertion loss and maintains signal integrity for high-speed digital buses up to 500 Mbps |
| TTL-compatible control inputs | Eliminates need for level translators on OE lines when driven by 5-V microcontrollers or FPGAs |
| Integrated VCC clamp diode | Enables passive 5-V-to-3.3-V level shifting without external diodes or resistors, reducing BOM count |
| Dual independent 5-bit channels | Supports segregated data paths-e.g., address vs. data bus-or redundant channel operation |
| 0.25 ns propagation delay | Preserves timing margins in high-frequency applications such as memory interface buffering and FPGA I/O expansion |
Applications
| PCI Express Gen1 Interposer | Industrial PLC Backplane |
|---|---|
|
Use Scenario: Isolating 3.3-V FPGA configuration bus from 5-V legacy peripheral controller during hot-swap events. IC Role / Device Role / Timing Role: Bidirectional voltage-level translator and bus gate controlling power-domain boundary between FPGA I/O banks and backplane peripherals. Use Value: Prevents destructive current flow during mismatched power sequencing while maintaining sub-nanosecond timing alignment across 10 signal lines. |
Use Scenario: Enabling modular I/O expansion where 5-V sensor modules connect to 3.3-V ARM-based controller over shared backplane bus. IC Role / Device Role / Timing Role: Dual-channel bus switch providing independent enable control for analog input and digital output segments. Use Value: Eliminates need for discrete MOSFET arrays and level shifters, reducing layout area by 40% and component count by 7 parts per slot. |
| DDR Memory Interface Buffer | Automotive Infotainment Gateway |
|
Use Scenario: Translating command/address signals from 5-V memory controller to 3.3-V DDR SDRAM while preserving setup/hold timing. IC Role / Device Role / Timing Role: Low-latency bidirectional switch placed inline on CA bus; OE synchronized to clock enable to avoid metastability. Use Value: Achieves 0.25 ns added delay versus 1.2 ns typical for discrete solutions, enabling margin-critical DDR-400 timing compliance. |
Use Scenario: Routing CAN and LIN signals between 5-V microcontroller and 3.3-V audio DSP in head-unit design with mixed-voltage domains. IC Role / Device Role / Timing Role: Signal-domain isolator preventing ground loop currents while passing UART and SPI control lines. Use Value: Maintains ESD robustness (±15 kV HBM) and meets ISO 10605 automotive surge requirements without additional protection circuitry. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBT3384DWR | Higher on-resistance (7 Ω typ), no integrated VCC clamp diode - requires external level-shifting network | Lacks native 5-V-to-3.3-V translation; suitable only where both sides operate at same voltage | Select when cost sensitivity outweighs level-shifting requirement and board space permits external diodes |
| SN74LVC1G3157DCKR | Single-channel SPDT, 6 Ω on-resistance, 1.65–5.5 V supply - lacks dual 5-bit architecture and OE independence | Cannot replace 10-bit parallel switching; limited to point-to-point signal routing | Use only for low-pin-count diagnostics or debug path insertion-not for full bus gating |
Compared with SN74CBTD3384DWR, SN74CBT3384DWR trades level-shifting capability for lower unit cost, while SN74LVC1G3157DCKR offers voltage flexibility at the expense of channel count and architectural fidelity-neither provides drop-in replacement for dual 5-bit mixed-voltage bus isolation.
Availability
SN74CBTD3384DWR is available at Aetrix Electronics and suitable for industrial PLC backplanes, DDR memory interface buffers, and automotive infotainment gateways requiring stable component supply across extended product lifecycles.
Supply support for SN74CBTD3384DWR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in industrial, automotive, and communications markets.
The 'CBTD3384 family was designed specifically for high-speed, low-latency bus switching in mixed-voltage system architectures-targeting applications where TTL compatibility, level translation, and nanosecond timing precision are critical.
FAQ
What is the maximum operating frequency supported by SN74CBTD3384DWR?
The SN74CBTD3384DWR does not specify a maximum operating frequency in its datasheet, but its 0.25 ns propagation delay and 5-Ω on-resistance support reliable operation up to 500 Mbps for NRZ data streams. Real-world performance depends on PCB trace impedance, load capacitance, and signal edge rates-designs exceeding 200 MHz should include controlled-impedance routing and proper termination.
Can SN74CBTD3384DWR be used for 3.3-V-to-5-V level shifting?
No, the SN74CBTD3384DWR integrates a diode from each I/O terminal to VCC, enabling only 5-V-to-3.3-V translation (i.e., higher-voltage inputs to lower-voltage outputs). Driving 3.3-V signals into port A while expecting 5-V outputs on port B violates the internal diode bias condition and may cause excessive current or latch-up. Reverse translation requires external circuitry or a different device.
Is SN74CBTD3384DWR pin-compatible with SN74CBT3384DWR?
Yes, SN74CBTD3384DWR and SN74CBT3384DWR share identical SOIC-24 pinout, pin functions, and mechanical footprint per TI's DW package drawings. However, SN74CBT3384DWR lacks the integrated VCC clamp diode, so direct substitution in level-shifting designs will result in non-functional translation unless external diodes are added.
What is the thermal resistance (θJA) of SN74CBTD3384DWR in the SOIC (DW) package?
The SN74CBTD3384DWR in the SOIC (DW) package has a junction-to-ambient thermal resistance (θJA) of 46°C/W, measured under JEDEC JESD 51-7 standard conditions. This value assumes a 1-inch² copper pad with two thermal vias; actual board-level θJA will vary based on PCB copper area, layer stackup, and airflow. For continuous 128 mA channel current, junction temperature rise remains below 6°C at 25°C ambient.
Does SN74CBTD3384DWR support hot-swap or live-insertion?
The SN74CBTD3384DWR supports hot-swap operation when powered sequencing follows TI's recommended guidelines: VCC must be stable before applying signals to any I/O pin, and OE inputs must be held low during power ramp-up. Its absolute maximum rating of −0.5 V to 7 V on I/O pins and integrated clamp diodes provide robustness against transient overvoltage during insertion-but external series resistors (10–22 Ω) are advised on high-capacitance backplanes to limit inrush current.
SN74CBTD3384DWR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBTD
- Package/Case:
- 24-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Bus Switch
- Circuit:
- 5 x 1:1
- Independent Circuits:
- 2
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-SOIC
SN74CBTD3384DWR FAQ
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7.What is the process for return or replacement of SN74CBTD3384DWR?
All SN74CBTD3384DWR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTD3384DWR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBTD3384DWR part is unused and in its original packaging.
Return procedure for SN74CBTD3384DWR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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