Texas Instruments SN74CBTD3861DWR
- Part No.:
- SN74CBTD3861DWR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 24-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
SN74CBTD3861DWR.pdf
- Description:
- IC BUS SWITCH 10 X 1:1 24SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:1,800
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Product details
Overview
SN74CBTD3861DWR from Texas Instruments is a 10-bit FET bus switch with integrated level-shifting capability, designed for bidirectional 5-V-to-3.3-V signal translation between logic domains. It features 5-Ω on-state resistance, TTL-compatible control inputs (VIH = 2 V, VIL = 0.8 V), and single OE-enabled switching. Used in mixed-voltage memory expansion and processor peripheral interfaces.
For engineers reviewing the SN74CBTD3861DWR datasheet, SN74CBTD3861DWR pinout, SN74CBTD3861DWR application, or SN74CBTD3861DWR equivalent, key selection criteria include its 5-Ω Ron, 0.35 ns propagation delay, ±1 µA ICC, 24-pin SOIC-DW package, and verified level-shifting behavior under 4.5–5.5 V supply conditions.
Technical Context
The SN74CBTD3861DWR implements a single 10-bit bidirectional analog switch array using NMOS FETs with integrated VCC-referenced clamping diodes to enable 5-V input → 3.3-V output level translation. Its OE-controlled architecture provides high-impedance isolation when disabled, with no internal latching or direction control logic.
Switch operation relies on low-threshold NMOS conduction with on-resistance specified at 5 Ω (typ) under 30 mA current and 4.5 V VCC. Propagation delay is RC-limited (tpd = 0.35 ns typical), and timing parameters ten (2.6–10 ns) and tdis (1–6 ns) are defined relative to OE transitions - confirming fast enable/disable response without internal buffering.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 4.5 V to 5.5 V - ensures compatibility with standard 5-V TTL systems while maintaining stable Ron and timing. |
| On-State Resistance (Ron) | 5 Ω (typ) - enables minimal voltage drop and signal integrity for 128 mA max channel current. |
| Propagation Delay (tpd) | 0.35 ns (typ) - supports high-speed bus switching up to >1 GHz effective data rates in low-capacitance paths. |
| Supply Current (ICC) | 1.5 mA (max) - ultra-low static power draw suitable for always-on bus isolation in power-sensitive designs. |
| Input Voltage Thresholds | VIH = 2 V, VIL = 0.8 V - guarantees reliable TTL-level recognition without external level translators. |
| Level-Shifting Support | 5-V inputs → 3.3-V outputs via integrated VCC clamp diode - eliminates need for external translation circuitry in mixed-voltage I/O interfacing. |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade embedded and computing applications. |
Pinout & Package
SN74CBTD3861DWR uses a 24-pin SOIC (DW) package measuring 15.4 mm × 7.5 mm × 2.35 mm (JEDEC MS-013), with 1.27 mm pitch and gull-wing leads. Pin 1 is located at top-left corner with index marking.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 24 | No Connect (NC) | Internally unconnected - must remain floating or grounded per layout best practice; no electrical function. |
| 2–11 | A1–A10 | Input/output port A - bidirectional signal path connected to one logic domain (e.g., 5-V microcontroller). |
| 12 | GND | Ground reference - common return for all internal circuitry and substrate biasing. |
| 13 | VCC | Positive supply - powers internal clamp diodes and defines output voltage ceiling for level shifting. |
| 14 | OE | Output-enable control - active-low; drives switch ON (A↔B connected) when low, OFF (high-Z) when high. |
| 15–23 | B1–B10 | Input/output port B - bidirectional signal path connected to second logic domain (e.g., 3.3-V FPGA I/O). |
Key Features
| Feature | Design Value |
|---|---|
| 10-bit bidirectional bus switch | Single OE controls all ten channels simultaneously - simplifies control logic and reduces GPIO count in system-level design. |
| Integrated level-shifting diode | VCC-referenced clamp enables automatic 5-V→3.3-V translation without external components - reduces BOM cost and board area. |
| Low on-state resistance | 5 Ω typical Ron minimizes insertion loss and maintains signal edge fidelity in high-speed parallel buses. |
| TTL-compatible control interface | VIH = 2 V / VIL = 0.8 V allows direct connection to legacy 5-V logic without pull-up/pull-down resistors. |
| Fast enable/disable timing | ten = 2.6 ns (min), tdis = 1 ns (min) - supports dynamic bus arbitration and hot-plug isolation in real-time systems. |
Applications
| Memory Expansion Interface | Processor Peripheral Bridge |
|---|---|
Use Scenario: Connecting a 5-V microcontroller's address/data bus to a 3.3-V SRAM module in an industrial controller. IC Role / Device Role / Timing Role: Bidirectional level-translating bus switch enabling synchronous read/write cycles across voltage domains. Use Value: Eliminates discrete resistor-divider or dual-supply translator ICs while preserving sub-nanosecond timing margins required for 25-MHz bus operation. | Use Scenario: Interfacing a 5-V CPLD configuration port to a 3.3-V FPGA JTAG chain during system programming. IC Role / Device Role / Timing Role: Isolation and voltage translation element placed between boundary-scan test access points. Use Value: Maintains IEEE 1149.1 signal integrity by limiting VIH/VIL excursion and ensuring <1 ns skew across TDI/TDO/TCK lines. |
| Legacy System Upgrades | Embedded Data Acquisition Hub |
Use Scenario: Retrofitting a 5-V ISA-bus industrial PC with modern 3.3-V ADC/DAC modules via passive backplane adapter. IC Role / Device Role / Timing Role: Passive bus gate controlling signal flow direction and voltage compliance on shared parallel data lines. Use Value: Enables drop-in replacement of obsolete 5-V-only peripherals without redesigning motherboard trace routing or power delivery. | Use Scenario: Aggregating sensor signals from multiple 5-V analog front-ends into a 3.3-V ARM-based data logger. IC Role / Device Role / Timing Role: Signal-domain isolator and voltage translator placed before multiplexer and ADC input stage. Use Value: Prevents latch-up risk and ensures accurate 12-bit sampling by eliminating DC offset and noise coupling between mismatched supply domains. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus-switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBT3244DWR | 8-bit, non-level-shifting, 3.5 Ω Ron, same SOIC-24 package | Lacks integrated VCC clamp diode - requires external level-shifting for mixed-voltage use | Select when only 8-bit width needed and system already handles level translation externally. |
| SN74LVC1G3157DCKR | Single-pole double-throw (SPDT) analog switch, 10 Ω Ron, SC70-6 package | Not pin-compatible; limited to 1-bit switching - unsuitable for parallel bus applications | Choose only for low-channel-count signal routing where space constraints outweigh bus-width requirements. |
Compared with SN74CBTD3861DWR, SN74CBT3244DWR offers lower Ron but no level-shifting, making it viable only in uniform-voltage systems; SN74LVC1G3157DCKR trades bus width and pin compatibility for ultra-small footprint - neither serves as a drop-in replacement, but both address adjacent signal-routing needs in compact or single-line designs.
Availability
SN74CBTD3861DWR is available at Aetrix Electronics and suitable for industrial control systems, legacy hardware upgrades, and embedded data acquisition requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for SN74CBTD3861DWR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions with over 50 years of innovation in high-reliability interface and signal-path components.
The SN74CBTD3861DWR belongs to TI's 74CBT family of FET bus switches, engineered specifically for low-latency, low-power, mixed-voltage interconnect in industrial, computing, and communications infrastructure.
FAQ
What is the maximum continuous current rating per channel for the SN74CBTD3861DWR?
The SN74CBTD3861DWR supports a maximum continuous channel current of 128 mA per switch path, as specified in its absolute maximum ratings. This rating applies under recommended operating conditions (VCC = 4.5–5.5 V, TA = –40°C to +85°C) and assumes proper PCB thermal management. Exceeding this current may degrade Ron stability or accelerate wear-out mechanisms in the NMOS FET structure.
Does the SN74CBTD3861DWR require external pull-up resistors on its control inputs?
No, the SN74CBTD3861DWR does not require external pull-up resistors on its OE input because its TTL-compatible input thresholds (VIH = 2 V min, VIL = 0.8 V max) allow direct connection to standard 5-V logic outputs. However, TI recommends tying all unused control inputs to VCC or GND to prevent floating states that could cause erratic switching or increased ICC.
Can the SN74CBTD3861DWR be used for 3.3-V-to-5-V level shifting?
No, the SN74CBTD3861DWR is designed specifically for 5-V-to-3.3-V level shifting via its integrated VCC-referenced clamp diode. Driving 3.3-V signals into port A will not produce valid 5-V outputs at port B, as the internal diode structure and Ron characteristics are optimized for forward translation only. Reverse-direction translation requires a separate device such as the SN74AVC4T245.
What is the thermal resistance (θJA) of the SN74CBTD3861DWR in its SOIC-DW package?
The SN74CBTD3861DWR in the SOIC-DW package has a junction-to-ambient thermal resistance (θJA) of 46°C/W, as documented in the absolute maximum ratings table. This value assumes standard JEDEC 2-layer board conditions (1-inch² copper pad, 2 oz Cu). Actual thermal performance may vary based on PCB layout, airflow, and nearby heat sources - derating is advised above 70°C ambient.
Is the SN74CBTD3861DWR pin-compatible with other members of the 74CBT family?
The SN74CBTD3861DWR shares the same 24-pin SOIC-DW footprint and pinout with SN74CBT3244DWR and SN74CBT3245DWR, but functional differences exist: SN74CBTD3861DWR includes level-shifting diodes and a single OE, whereas SN74CBT3244DWR has dual OE controls and no level-shifting. Thus, mechanical compatibility exists, but electrical substitution requires verification of control logic and voltage-domain requirements.
SN74CBTD3861DWR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBTD
- Package/Case:
- 24-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Bus Switch
- Circuit:
- 10 x 1:1
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-SOIC
SN74CBTD3861DWR FAQ
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7.What is the process for return or replacement of SN74CBTD3861DWR?
All SN74CBTD3861DWR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTD3861DWR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBTD3861DWR part is unused and in its original packaging.
Return procedure for SN74CBTD3861DWR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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