Texas Instruments SN74CBTK6800GVR

Overview

SN74CBTK6800GVR from Texas Instruments is a 10-bit FET bus switch with precharged outputs and active-clamp undershoot protection, designed for high-speed TTL-compatible signal routing in hot-swap systems. It features 5-Ω on-state resistance, ±2-V undershoot clamping, and B-port precharge to user-selectable BIASV (1.3 V to VCC) to minimize live-insertion noise in backplane and modular computing applications.

For engineers reviewing the SN74CBTK6800GVR datasheet, SN74CBTK6800GVR pinout, SN74CBTK6800GVR application, or SN74CBTK6800GVR equivalent, key selection criteria include bidirectional low-Ron switching, power-off high-impedance disable, active undershoot protection down to –2 V, bias-voltage-controlled precharge, and latch-up immunity exceeding 100 mA per JESD 78 Class II.

Technical Context

The SN74CBTK6800GVR implements a single 10-bit analog switch array controlled by one active-low ON input. When enabled, it establishes near-zero-delay bidirectional conduction between A and B ports via low-threshold FETs; when disabled, B ports are pulled to BIASV through an internal ~10-kΩ path while A ports float.

Its active-clamp undershoot-protection circuit supplies current from VCC to clamp I/O voltages down to –2 V during transient undershoot events-preventing pass-transistor turn-on and eliminating false logic states. The device operates across 4 V to 5.5 V VCC and supports BIASV from 1.3 V up to VCC, enabling compatibility with mixed-voltage system interfaces.

Key Specifications

Pinout & Package

SN74CBTK6800GVR is housed in a 24-pin TVSOP (DGV) package measuring 4.4 mm × 5.0 mm × 1.2 mm, optimized for high-density PCB layouts and thermal performance (θ_JA = 86°C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FET bus switch applications.

Compared with SN74CBTK6800GVR, SN74CBT16210DGGR offers more bits but omits live-insertion safeguards, while SN74LVC1G3157DCKR provides compact SPDT routing but cannot replicate 10-bit synchronized switching with BIASV control and –2 V clamping - making SN74CBTK6800GVR uniquely suited for mission-critical hot-swap infrastructure.

Availability

SN74CBTK6800GVR is available at Aetrix Electronics and suitable for modular server backplanes, hot-swappable PCIe expansion cards, and industrial PLC I/O modules requiring stable component supply, long-term lifecycle support, and guaranteed RoHS-compliant sourcing.

Supply support for SN74CBTK6800GVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and logic solutions for industrial, automotive, and communications markets.

The SN74CBTK6800GVR belongs to TI's 74CBT logic family, engineered specifically for high-reliability hot-swap and live-insertion applications in telecom infrastructure and enterprise computing systems.

FAQ

What is the maximum undershoot voltage the SN74CBTK6800GVR can safely clamp?

The SN74CBTK6800GVR actively clamps undershoots down to –2 V on both A and B ports, as confirmed by undershoot characterization tests in the SCDS107B datasheet. This clamping action draws current from VCC to hold the I/O voltage above –2 V, preventing pass-transistor turn-on and false logic states during connector mating or ESD events. The SN74CBTK6800GVR maintains this specification across its full operating temperature range (–40°C to 85°C) and VCC range (4 V to 5.5 V).

Does the SN74CBTK6800GVR require external pull-up or pull-down resistors on its control inputs?

No, the SN74CBTK6800GVR does not require external pull-up or pull-down resistors on the ON input. Its TTL-compatible input thresholds (VIH = 2 V min, VIL = 0.8 V max) allow direct interfacing with standard logic drivers. However, TI recommends holding all unused control inputs at VCC or GND to ensure predictable operation - a guideline explicitly stated in the "Recommended Operating Conditions" section of the SN74CBTK6800GVR datasheet.

Can the SN74CBTK6800GVR operate with BIASV set to 0 V (GND)?

No - the SN74CBTK6800GVR requires BIASV to be between 1.3 V and VCC per the "Recommended Operating Conditions" table. Setting BIASV = 0 V violates the minimum BIASV specification and may impair precharge functionality or cause undefined behavior during disable. For GND-referenced precharge, external circuitry or alternative devices with wider BIASV range must be used; the SN74CBTK6800GVR is not characterized for 0-V BIASV operation.

What is the thermal resistance (θ_JA) of the SN74CBTK6800GVR in its TVSOP package?

The SN74CBTK6800GVR in the TVSOP (DGV) package has a junction-to-ambient thermal resistance (θ_JA) of 86°C/W, as specified in the "Absolute Maximum Ratings" table of the SCDS107B datasheet. This value assumes standard JEDEC 51-7 PCB mounting conditions and is critical for thermal design in high-density applications such as blade servers or compact test equipment where airflow is limited.

Is the SN74CBTK6800GVR pin-compatible with other packages in the same family, such as SN74CBTK6800DWR or SN74CBTK6800DBQR?

No - the SN74CBTK6800GVR (TVSOP/DGV), SN74CBTK6800DWR (SOIC/DW), and SN74CBTK6800DBQR (SSOP/DBQ) share identical logic functionality and pin assignments (24-pin layout with ON, A1–A10, B1–B10, VCC, GND, BIASV), but their physical footprints differ significantly. While electrical pinout is consistent, PCB land patterns are not interchangeable due to distinct package dimensions, pad spacing, and thermal pad requirements - requiring separate layout files for each variant. The SN74CBTK6800GVR itself uses a 0.4-mm pitch TVSOP footprint incompatible with SOIC or SSOP stencils.