Texas Instruments SN74CBTLV16210G
- Part No.:
- SN74CBTLV16210G
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- -
- Datasheet:
-
SN74CBTLV16210G.pdf
- Description:
- BUS DRIVER
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Product details
Overview
SN74CBTLV16210 from Texas Instruments is a 20-bit high-speed bus switch IC with dual 10-bit configurable switching, 5-Ω on-state resistance, rail-to-rail signal handling (2.3 V to 3.6 V), and Ioff partial-power-down support. It serves as a low-latency bidirectional data path selector in memory expansion, FPGA I/O bridging, and hot-swap backplane interfaces.
For engineers reviewing the SN74CBTLV16210 datasheet, SN74CBTLV16210 pinout, SN74CBTLV16210 application, or SN74CBTLV16210 equivalent, key selection criteria include its 0.15 ns propagation delay at 2.5 V, ±10 µA Ioff leakage at VCC = 0 V, dual independent OE control, and TVSOP-48 (DGV) package compatibility with high-density PCB layouts.
Technical Context
The SN74CBTLV16210 implements two independent 10-bit FET-based analog switches controlled by separate OE inputs, enabling flexible partitioning between 20-bit, dual 10-bit, or mixed-mode operation. Each switch exhibits symmetrical A↔B conduction with no directionality or voltage polarity constraints.
Its Ioff circuitry actively blocks current backflow when VCC = 0 V, ensuring isolation during power sequencing. The device operates across 2.3 V–3.6 V supply range with guaranteed VIH/VIL thresholds and maintains ≤7 Ω ron across full voltage and temperature range (−40°C to 85°C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| On-state resistance (ron) | 5 Ω typical at VCC = 3 V - enables <10 mV voltage drop at 24 mA per switch, preserving signal integrity in low-voltage buses. |
| Propagation delay (tpd) | 0.15 ns min at 2.5 V - supports >5 GHz effective switching bandwidth for high-speed parallel data paths. |
| Ioff leakage | 10 µA max at VCC = 0 V - prevents cross-rail current injection during partial power-down, critical for hot-plug systems. |
| Supply voltage range | 2.3 V to 3.6 V - compatible with 2.5 V and 3.3 V logic domains without level translation. |
| Input capacitance (Ci) | 4.5 pF - minimizes loading on driving sources, sustaining signal edge rates in multi-drop configurations. |
| Off-state capacitance (Cio(OFF)) | 6.5 pF - reduces crosstalk and capacitive coupling between isolated ports during disable state. |
| Operating temperature | −40°C to +85°C - qualified for industrial-grade embedded and communications equipment environments. |
Pinout & Package
SN74CBTLV16210 is available in TVSOP-48 (DGV) package: 48-pin, 0.4 mm pitch, 3.5 mm × 12.5 mm body, JEDEC MO-153 compliant, with exposed thermal pad optional for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A1–1A10, 2A1–2A10 | Port A input/output terminals (Group 1 & 2) | Bi-directional data terminals for first and second 10-bit switch banks; electrically identical, no internal direction logic. |
| 1B1–1B10, 2B1–2B10 | Port B input/output terminals (Group 1 & 2) | Paired bi-directional counterparts to A-side pins; each An connects directly to Bn when respective OE is active low. |
| 1OE, 2OE | Output-enable controls (active-low) | Independent enable inputs per 10-bit bank; OE = L activates switch, OE = H places port pair in high-Z isolation. |
| VCC | Positive supply | Single 2.3–3.6 V supply powers all switches and control logic; no separate analog/digital rails required. |
| GND (Pins 8, 16, 25, 35) | Ground reference | Four dedicated ground pins minimize ground bounce and ensure stable ron performance across full 20-bit width. |
| NC (Pins 1, 48) | No internal connection | Unbonded pads; must remain unconnected on PCB to avoid parasitic coupling or mechanical stress. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail analog switching | Supports signals from GND to VCC without clipping or distortion - essential for TTL, LVTTL, and mixed-voltage bus interfacing. |
| Dual independent OE control | Enables dynamic reconfiguration: one 10-bit segment can be active while the other is isolated - ideal for memory interleaving or I/O multiplexing. |
| Ioff protection | Guarantees <10 µA back-current at VCC = 0 V - eliminates need for external isolation diodes in hot-swap or power-gated subsystems. |
| Low 5-Ω ron | Delivers <100 ps skew across 20-bit bus at 24 mA load - preserves timing margins in synchronous parallel interfaces like SRAM or Flash expansion. |
| High-speed tpd (0.15 ns) | Enables sub-nanosecond propagation with 30 pF load - suitable for DDR2/DDR3 address/control buffering and FPGA configuration bus extension. |
Applications
| Memory Expansion Interface | FPGA I/O Bridging |
|---|---|
Use Scenario: Expanding external SRAM or NOR Flash capacity on microcontroller-based industrial controllers with limited native address/data bus width. IC Role / Device Role / Timing Role: Bidirectional 20-bit data/address bus switch that dynamically connects CPU bus to secondary memory bank under software-controlled OE gating. Use Value: Eliminates need for discrete transceivers or CPLDs; 5-Ω ron ensures <50 mV voltage drop at 10 mA, maintaining valid logic levels across 10 cm traces. | Use Scenario: Interfacing multiple FPGA mezzanine modules (e.g., ADC/DAC, Ethernet PHY) to a central processor via shared parallel bus. IC Role / Device Role / Timing Role: Low-skew, high-isolation bus switch enabling time-multiplexed access to peripheral modules without signal contention. Use Value: 0.15 ns tpd and 6.5 pF Cio(OFF) reduce inter-module crosstalk by >25 dB at 100 MHz, improving signal fidelity in mixed-signal systems. |
| Hot-Swap Backplane Interface | PCI/PCI-X Slot Extension |
Use Scenario: Enabling safe insertion/removal of line cards in telecom shelf backplanes where main system remains powered. IC Role / Device Role / Timing Role: Isolation element placed between backplane data lines and card-local logic, activated only after power stabilization and firmware handshake. Use Value: Ioff <10 µA prevents damaging current flow during card power-up/down sequences, satisfying Telcordia GR-1089-CORE surge immunity requirements. | Use Scenario: Extending legacy PCI/PCI-X slots to accommodate additional add-in cards in test instrumentation chassis with space-constrained layout. IC Role / Device Role / Timing Role: 20-bit address/data bus repeater that restores signal integrity and provides OE-controlled segmentation for slot arbitration. Use Value: 2.3–3.6 V operation matches PCI 3.3 V signaling; 70°C/W θJA (DGG) allows full 20-bit operation at 70°C ambient without derating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBT16210DGGR | Same 20-bit architecture but uses older CBT (not CBTLV) process; ron = 6 Ω typ, VCC = 4.5–5.5 V only. | Requires 5 V supply; incompatible with 2.5/3.3 V systems; higher power consumption and reduced noise margin. | Select only if legacy 5 V design mandates pin-compatible replacement with no voltage translation. |
| PI74AVC16210AEX | 16-bit (not 20-bit); supports 1.2–3.6 V; ron = 8 Ω; includes auto-direction sensing. | Lacks 20-bit width and dual-OE flexibility; suited for lower-pin-count applications with dynamic bus direction detection. | Choose when system requires voltage-level translation down to 1.2 V and direction detection, accepting reduced channel count. |
Compared with SN74CBTLV16210, SN74CBT16210DGGR requires 5 V operation and delivers higher ron, limiting use in low-voltage systems, while PI74AVC16210AEX offers wider voltage range but sacrifices 4 data bits and independent OE control - making SN74CBTLV16210 optimal for 20-bit, 2.5/3.3 V, OE-flexible designs.
Availability
SN74CBTLV16210 is available at Aetrix Electronics and suitable for memory expansion, FPGA I/O bridging, and hot-swap backplane interfaces requiring stable component supply, long-term lifecycle assurance, and industrial temperature compliance.
Supply support for SN74CBTLV16210 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with over 90 years of innovation in industrial, automotive, and communications electronics.
The SN74CBTLV16210 belongs to TI's Widebus™ family of high-speed bus switches, engineered specifically for low-latency, low-distortion signal routing in 2.5 V/3.3 V parallel bus architectures including memory subsystems and FPGA interconnects.
FAQ
What is the maximum operating frequency supported by the SN74CBTLV16210?
The SN74CBTLV16210 does not specify a clock frequency since it is an analog bus switch, not a clocked device. Its 0.15 ns propagation delay at 2.5 V enables reliable operation with signal edges up to ~5 GHz effective bandwidth. System-level maximum frequency depends on trace length, load capacitance, and drive strength - verified up to 200 MHz in 30 pF loaded parallel bus configurations per TI application notes. SN74CBTLV16210 performance remains stable across its full −40°C to +85°C range.
Can the SN74CBTLV16210 be used for bidirectional level translation between 2.5 V and 3.3 V domains?
No, the SN74CBTLV16210 is not a level translator; it is a passive FET switch requiring identical VCC on both sides of the switch. It supports rail-to-rail signal swing (GND to VCC) but cannot translate between different supply voltages. For 2.5 V ↔ 3.3 V translation, TI recommends the TXB0108 or SN74AVCH series. SN74CBTLV16210 must operate with single VCC (2.3–3.6 V) applied uniformly across all pins.
How should unused OE pins be handled on the SN74CBTLV16210?
Unused OE pins must be tied to VCC through a pullup resistor to ensure the associated 10-bit switch remains in high-impedance isolation state. TI specifies minimum pullup resistance based on driver sink capability; for standard CMOS drivers, 10 kΩ is sufficient. Floating OE pins risk metastability, unintended switching, or increased ICC. This requirement applies to both 1OE and 2OE - SN74CBTLV16210 functionality depends on deterministic OE states.
Does the SN74CBTLV16210 support hot-plug operation with live backplane insertion?
Yes, the SN74CBTLV16210 supports hot-plug via its Ioff feature: when VCC = 0 V, back-current is limited to 10 µA max even if A/B ports are driven to 3.6 V. This prevents damage during card insertion into powered backplanes. However, OE must be held high (via pullup) during power-off to guarantee isolation - SN74CBTLV16210 meets Telcordia GR-1089-CORE Class 3 surge immunity when implemented with proper PCB layout and decoupling.
What is the thermal performance of the SN74CBTLV16210 in TVSOP-48 (DGV) package?
The SN74CBTLV16210 in TVSOP-48 (DGV) package has a junction-to-ambient thermal resistance (θJA) of 58°C/W under JEDEC JESD51-7 conditions. At maximum rated continuous channel current (128 mA per switch), total power dissipation is <100 mW, resulting in <6°C junction rise above ambient at 25°C. No heatsink is required for standard operation; SN74CBTLV16210 maintains full specification compliance up to +85°C ambient with standard 2-layer PCB layout.
SN74CBTLV16210G Specifications
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- Texas Instruments
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SN74CBTLV16210G FAQ
1.How can I place an order for SN74CBTLV16210G through Aetrix?
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5.How can I obtain technical support or documentation for SN74CBTLV16210G?
For technical support, including SN74CBTLV16210G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBTLV16210G requirements.
6.How does Aetrix verify that SN74CBTLV16210G is sourced from the original manufacturer or authorized distributors?
All SN74CBTLV16210G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBTLV16210G meets industry standards.
7.What is the process for return or replacement of SN74CBTLV16210G?
All SN74CBTLV16210G units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTLV16210G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBTLV16210G part is unused and in its original packaging.
Return procedure for SN74CBTLV16210G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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