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Texas Instruments SN74CBTLV16210GR

Part No.:
SN74CBTLV16210GR
Manufacturer:
Texas Instruments
Category:
Signal Switches, Multiplexers, Decoders
Package:
48-TFSOP (0.240", 6.10mm Width)
Datasheet:
AetrixSN74CBTLV16210GR.pdf
Description:
IC BUS SWITCH 10 X 1:1 48TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:218

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Product details

Overview

SN74CBTLV16210GR from Texas Instruments is a 20-bit high-speed FET bus switch organized as dual 10-bit switches, featuring 5-Ω on-state resistance, rail-to-rail switching, and Ioff partial-power-down support. It operates from 2.3 V to 3.6 V and delivers sub-nanosecond propagation delay (0.15 ns typical at 2.5 V), enabling low-latency signal routing in memory expansion and FPGA interconnect applications.

For engineers reviewing the SN74CBTLV16210GR datasheet, SN74CBTLV16210GR pinout, SN74CBTLV16210GR application, or SN74CBTLV16210GR equivalent, this device serves as a low-impedance bidirectional switch for hot-swap-capable data buses, high-speed test access ports, and multi-FPGA board-level interconnects requiring minimal signal degradation and power-off isolation.

Technical Context

The SN74CBTLV16210GR implements two independent 10-bit transmission-gate-based bus switches, each controlled by a dedicated OE input. Its FET architecture enables true bidirectional, voltage-transparent switching without level translation-signals pass unaltered between A and B ports when enabled.

Each switch channel exhibits matched on-resistance (5–8 Ω typical) across the full 0–3.6 V signal range and supports Ioff protection: when VCC = 0 V, leakage remains ≤10 µA with inputs/outputs biased from 0 to 3.6 V, preventing backdrive current during partial power-down sequences.

Key Specifications

ParameterValue and Actual Design Meaning
On-state resistance (ron)5–8 Ω typical - ensures minimal voltage drop and signal distortion for 24 mA drive currents.
Propagation delay (tpd)0.15–0.25 ns - enables sub-GHz timing-critical routing without added latency.
Supply voltage (VCC)2.3 V to 3.6 V - compatible with 2.5 V and 3.3 V logic systems without level shifters.
Ioff leakage≤10 µA at VCC = 0 V - guarantees safe isolation during system power sequencing and hot-plug events.
Input capacitance (Ci)4.5 pF - reduces loading on driving sources and preserves signal edge integrity.
Off-state capacitance (Cio)6.5 pF - minimizes crosstalk and capacitive coupling between disabled channels.
Operating temperature−40°C to +85°C - qualified for industrial-grade embedded and communications equipment.

Pinout & Package

TSSOP-48 package (DGG), 12.6 mm × 6.1 mm × 1.2 mm max height, JEDEC MO-153 compliant, with exposed pad not electrically connected.

Pin/TerminalCircuit RoleDesign Meaning
1A1–1A10, 2A1–2A10Port A inputs/outputsFirst and second 10-bit source/sink terminals; bidirectional, rail-to-rail compatible.
1B1–1B10, 2B1–2B10Port B inputs/outputsCorresponding 10-bit destination/sink terminals; electrically identical to Port A.
1OE, 2OEOutput-enable controlsActive-low enables respective 10-bit switch; tie to VCC via pullup for power-up high-Z safety.
VCCPower supplySingle 2.3–3.6 V supply powers both switch banks and control logic.
GND (Pins 8, 16, 35, 47)Ground referenceFour dedicated ground pins minimize ground bounce and improve noise immunity.
NC (Pins 1, 48)No internal connectionUnbonded pads; must remain unconnected per TI layout guidelines.

Key Features

FeatureDesign Value
Rail-to-rail analog switchingSupports 0 V to VCC signal swing without clipping-enables transparent routing of analog control signals or DC-coupled data.
Ioff partial-power-down protectionPrevents damaging back-current flow when VCC = 0 V, critical for mixed-voltage board power sequencing.
Dual independent 10-bit controlAllows asymmetric enable/disable of two data paths-e.g., isolate CPU address bus while keeping data bus active.
Low 5-Ω on-resistanceReduces insertion loss and maintains signal integrity for high-speed parallel interfaces up to 500 Mbps.
Sub-1 ns enable/disable timingten/tdis ≤ 7.4 ns ensures rapid bus arbitration and glitch-free reconfiguration during runtime.

Applications

Memory Expansion InterfaceFPGA-to-FPGA Interconnect

Use Scenario: Expanding DRAM capacity on a microprocessor motherboard using shared address/data buses across multiple memory modules.

IC Role / Device Role / Timing Role: Bidirectional bus switch isolating inactive memory banks while enabling low-latency access to selected banks.

Use Value: Eliminates bus contention and reduces signal reflections via 5-Ω on-resistance and 6.5 pF off-capacitance-preserving setup/hold margins at 200+ MHz clock rates.

Use Scenario: Routing high-speed configuration or debug data between two FPGAs on a multi-logic-device PCB.

IC Role / Device Role / Timing Role: Reconfigurable signal path controller enabling dynamic JTAG chain reordering or shared test access port sharing.

Use Value: Sub-0.25 ns propagation delay and rail-to-rail operation maintain signal fidelity across 3.3 V LVCMOS links without timing skew or voltage translation overhead.

Hot-Swappable Peripheral HubPCI Express Sideband Signal Switching

Use Scenario: Enabling safe insertion/removal of add-in cards in industrial backplane systems with powered-backplane architecture.

IC Role / Device Role / Timing Role: Isolation gate for control lines (RESET#, CLKREQ#, PERST#) during card hot-plug sequences.

Use Value: Ioff protection ensures zero backfeed current into unpowered card slots, satisfying PCIe hot-plug safety requirements without external diodes or MOSFETs.

Use Scenario: Multiplexing sideband signals (CLKREQ#, WAKE#, PERST#) among multiple PCIe root complexes and endpoints.

IC Role / Device Role / Timing Role: Low-capacitance, low-resistance analog switch for non-data PCIe management signals.

Use Value: 4.5 pF input capacitance and 6.5 pF off-state capacitance prevent signal integrity degradation on sensitive 3.3 V sideband nets, avoiding false wake or reset assertions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switch applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SN74CBTLV3861RGYR32-bit single-bank switch; 6 Ω ron; same VCC range and Ioff spec.Higher channel count but no dual-OE control-less flexible for asymmetric bus partitioning.Select when needing >20 bits in one bank and simplified enable logic.
SN74CBT16210DGGRSame 20-bit dual-switch topology but 5-V tolerant; higher ron (7–10 Ω); no Ioff.Compatible with legacy 5-V systems but lacks partial-power-down capability.Select only for 5-V environments where Ioff is not required and 2.5 V operation is unnecessary.

Compared with SN74CBTLV16210GR, SN74CBTLV3861RGYR offers greater density but sacrifices independent control granularity, while SN74CBT16210DGGR trades modern low-voltage efficiency and Ioff safety for legacy 5-V compatibility-making SN74CBTLV16210GR optimal for new 2.5/3.3 V industrial and computing designs demanding robust power sequencing.

Availability

SN74CBTLV16210GR is available at Aetrix Electronics and suitable for memory expansion interfaces, FPGA interconnects, hot-swappable peripheral hubs, and PCIe sideband signal routing requiring stable component supply across industrial and communications product lifecycles.

Supply support for SN74CBTLV16210GR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in high-reliability components.

The SN74CBTLV16210GR belongs to TI's Widebus™ family of high-speed logic devices, engineered specifically for low-latency, low-distortion signal routing in dense digital systems where power sequencing resilience and signal integrity are critical.

FAQ

What is the maximum operating frequency supported by the SN74CBTLV16210GR?

The SN74CBTLV16210GR does not specify a maximum clock frequency because it is an analog bus switch-not a clocked logic device. Its performance is characterized by propagation delay (0.15–0.25 ns) and bandwidth-limiting parameters including on-resistance (5–8 Ω) and off-capacitance (6.5 pF). In practice, the SN74CBTLV16210GR reliably routes signals up to 500 Mbps in parallel bus applications when used with proper termination and layout, as confirmed by TI's application notes on Widebus™ switching behavior.

Does the SN74CBTLV16210GR require external pull-up resistors on its OE pins?

Yes-the SN74CBTLV16210GR OE pins must be tied to VCC through a pull-up resistor during power-up and power-down to guarantee high-impedance state before internal logic stabilizes. TI recommends a minimum resistor value determined by the driver's current-sinking capability; typical values range from 4.7 kΩ to 10 kΩ. This requirement is explicitly stated in the datasheet to prevent unintended switch activation during supply ramping.

Can the SN74CBTLV16210GR be used to switch analog signals such as audio or sensor outputs?

Yes-the SN74CBTLV16210GR supports rail-to-rail analog switching from 0 V to VCC, making it suitable for low-frequency analog signals like audio bias lines, thermistor readbacks, or DAC outputs-as long as signal slew rate and bandwidth stay within limits imposed by its 5–8 Ω on-resistance and parasitic capacitances. However, it is not specified for high-fidelity audio or precision instrumentation due to lack of THD, noise, or offset specifications; use is limited to general-purpose analog routing where ±10 mV error is acceptable.

Is the SN74CBTLV16210GR pin-compatible with other members of the CBTLV family?

No-the SN74CBTLV16210GR uses a 48-pin TSSOP (DGG) package with a unique pinout optimized for dual 10-bit switching, including four GND pins and dedicated OE controls. It is not pin-compatible with SN74CBTLV3861RGYR (32-pin VQFN) or SN74CBT16210DGGR (48-pin TSSOP but different pin mapping and no Ioff support). Always verify pin assignments against the specific package drawing (DGG0048A) before PCB layout.

What is the thermal performance of the SN74CBTLV16210GR in its TSSOP package?

The SN74CBTLV16210GR in the DGG (TSSOP-48) package has a junction-to-ambient thermal resistance (θJA) of 58°C/W, measured per JESD 51-7 under standard PCB conditions (1-inch² 2-oz copper). At maximum recommended continuous channel current (128 mA) and worst-case VCC (3.6 V), power dissipation remains below 500 mW-well within safe thermal limits for industrial ambient temperatures up to +85°C when mounted on a 2-layer board with adequate copper pour.

SN74CBTLV16210GR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74CBTLV
Package/Case:
48-TFSOP (0.240", 6.10mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Bus Switch
Circuit:
10 x 1:1
Independent Circuits:
2
Current - Output High, Low:
-
Voltage Supply Source:
Single Supply
Voltage - Supply:
2.3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-TSSOP

SN74CBTLV16210GR FAQ

1.How can I place an order for SN74CBTLV16210GR through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74CBTLV16210GR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74CBTLV16210GR reliable?

The price and inventory of SN74CBTLV16210GR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBTLV16210GR is usually 5 days.

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SN74CBTLV16210GR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SN74CBTLV16210GR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74CBTLV16210GR?

For technical support, including SN74CBTLV16210GR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBTLV16210GR requirements.

6.How does Aetrix verify that SN74CBTLV16210GR is sourced from the original manufacturer or authorized distributors?

All SN74CBTLV16210GR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBTLV16210GR meets industry standards.

7.What is the process for return or replacement of SN74CBTLV16210GR?

All SN74CBTLV16210GR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTLV16210GR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74CBTLV16210GR part is unused and in its original packaging.

Return procedure for SN74CBTLV16210GR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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