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Texas Instruments SN74CBTLV16211DGG
- Part No.:
- SN74CBTLV16211DGG
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- -
- Datasheet:
-
SN74CBTLV16211DGG.pdf
- Description:
- BUS SWITCH 2-ELEMENT
- Quantity:
- Payment:
- Shipping:
Inventory:830
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Product details
Overview
SN74CBTLV16211 from NXP Semiconductors is a dual 12-bit high-speed CMOS bus switch with independent active-low output enables (1OE, 2OE), 5 Ω typical ON-state resistance, rail-to-rail switching capability, and operation across 2.3 V to 3.6 V supply. It serves as a low-latency bidirectional signal path in memory expansion, FPGA I/O buffering, and hot-swap data routing applications.
For engineers reviewing the SN74CBTLV16211 datasheet, SN74CBTLV16211 pinout, SN74CBTLV16211 application, or SN74CBTLV16211 equivalent, key selection criteria include its 0.2 ns max propagation delay at 3.3 V, IOFF partial power-down protection, Schmitt-trigger control inputs for noise immunity, and TSSOP56 package compatibility with high-density PCB layouts.
Technical Context
This device implements two independent 12-bit bidirectional analog switches, each controlled by a dedicated active-low OE input. Its low on-resistance (≤7.0 Ω at 3.3 V) and minimal parasitic capacitance (CS(ON) = 14.3 pF) enable sub-nanosecond signal integrity in high-speed digital interconnects.
The IOFF circuitry ensures zero backflow current during partial power-down states, while Schmitt-trigger inputs tolerate slow edge rates (up to 200 ns/V) across the full 2.3–3.6 V VCC range - supporting robust operation in mixed-voltage systems with marginal slew rate margins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply voltage | 2.3 V to 3.6 V - supports direct interface with 2.5 V and 3.3 V logic families without level translation |
| ON-state resistance | 4.0 Ω (typ) at 3.3 V - minimizes voltage drop and timing skew across 12-bit parallel paths |
| Propagation delay | 0.2 ns (max) at 3.3 V - enables <1 GHz data rate handling in point-to-point or stubbed bus topologies |
| IOFF leakage | ±10 μA at VCC = 0 V - prevents destructive current flow when one side is powered and the other is not |
| Operating temperature | −40 °C to +125 °C - qualified for industrial and extended-temperature embedded control environments |
| ESD rating | HBM >2000 V - provides robust handling margin during board assembly and system integration |
| Switch capacitance | 14.3 pF (ON-state), 5.2 pF (OFF-state) - maintains signal integrity with ≤30 pF load targets per channel |
Pinout & Package
TSSOP56 plastic thin shrink small outline package (SOT364-1), 56-pin, body width 6.1 mm, 0.5 mm pitch, lead finish matte tin.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE, 2OE | Active-low output enable | Independent control of each 12-bit switch bank; HIGH forces high-impedance OFF-state |
| 1A0–1A11, 1B0–1B11 | Bidirectional data terminals (Bank 1) | 12 pairs of A/B ports; no fixed direction - signal flows A→B or B→A depending on external drive |
| 2A0–2A11, 2B0–2B11 | Bidirectional data terminals (Bank 2) | Second independent 12-bit switch bank, electrically isolated from Bank 1 |
| VCC | Power supply | Single 2.3–3.6 V supply powers both banks and control logic; no separate I/O voltage required |
| GND (pins 8,19,38,49) | Ground reference | Four dedicated ground pins reduce ground bounce and improve noise rejection in high-speed switching |
| n.c. (pin 1) | No connection | Unused pad; must remain unconnected to avoid unintended coupling or thermal stress |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail switching | Supports full 0 V to VCC signal swing on all I/O ports - eliminates need for external biasing in AC-coupled or mixed-voltage interfaces |
| IOFF partial power-down | Blocks current flow between live and unpowered domains - essential for hot-plug, modular backplane, and power-gated subsystem designs |
| Schmitt-trigger control inputs | Enables reliable switching with slow-rising/falling enable signals up to 200 ns/V - reduces sensitivity to noise and trace impedance mismatches |
| Low ON-state resistance | 4.0 Ω typical at 3.3 V - preserves signal amplitude and edge rate across 12-bit parallel buses with ≤128 mA per switch |
| High noise immunity | Exceeds JEDEC JESD8-5 and JESD8-B standards - ensures stable operation in electrically noisy industrial and automotive-adjacent environments |
Applications
| Memory Expansion Interface | FPGA I/O Buffering |
|---|---|
Use Scenario: Expanding DRAM or SRAM capacity in microcontroller-based industrial controllers using shared address/data buses. IC Role / Device Role / Timing Role: Bidirectional bus switch isolating memory banks during access arbitration; enables time-multiplexed sharing of 24-bit data/address lines. Use Value: Eliminates contention and timing conflicts between multiple memory devices, leveraging 0.2 ns propagation delay to maintain setup/hold margins at 100+ MHz clock rates. | Use Scenario: Interfacing heterogeneous I/O standards (LVCMOS, SSTL, HSTL) between FPGA and peripheral ICs in test equipment. IC Role / Device Role / Timing Role: Voltage-agnostic signal path enabling level-flexible routing without translation logic; controlled via FPGA GPIOs. Use Value: Reduces BOM count and PCB area by replacing discrete level shifters; 5 Ω RON ensures minimal skew across 24-bit parallel channels. |
| Hot-Swap Data Routing | PCI Express Lane Multiplexing |
Use Scenario: Dynamic reconfiguration of sensor data streams in modular medical imaging modules where boards are inserted/removed under power. IC Role / Device Role / Timing Role: Isolation element preventing backfeed during insertion; IOFF blocks current when downstream VCC is absent. Use Value: Enables safe hot-swap compliance without auxiliary power sequencing circuitry - meets IEC 61000-4-2 Level 4 ESD immunity requirements. | Use Scenario: Sharing limited PCIe root complex lanes among multiple endpoint devices (e.g., NVMe SSD, GPU, network controller) in edge AI gateways. IC Role / Device Role / Timing Role: Low-capacitance, low-resistance analog switch enabling lane reallocation without retiming or protocol-aware switching. Use Value: Maintains PCIe Gen2 signal integrity (≤14.3 pF CS(ON)) while supporting dynamic lane assignment via firmware-controlled OE signals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTLV3861PVR | Single 24-bit bus switch; identical 5 Ω RON and 0.2 ns tpd, but only one OE input | Lacks independent bank control - unsuitable for split-bus architectures requiring staggered enable timing | Select when full 24-bit path control suffices and board space permits larger 56-pin TSSOP footprint |
| PI74CBTLV3245AEX | 24-bit single-bank switch with 3-state outputs; requires external pull-ups for high-Z; no IOFF | No power-down isolation - cannot safely interface powered/unpowered domains | Prefer only in legacy 3.3 V-only systems where partial power-down is unnecessary and cost is primary constraint |
Compared with SN74CBTLV3861PVR and PI74CBTLV3245AEX, the SN74CBTLV16211 uniquely delivers dual independent 12-bit banks with IOFF and Schmitt-trigger enables - making it the only option for fault-tolerant, hot-swappable, or mixed-voltage bus segmentation where bank-level isolation and robust enable timing are mandatory.
Availability
SN74CBTLV16211 is available at Aetrix Electronics and suitable for memory expansion, FPGA I/O buffering, hot-swap data routing, and PCIe lane multiplexing requiring stable component supply across industrial temperature ranges.
Supply support for SN74CBTLV16211 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The 74CBTLV family delivers high-speed, low-power bus switches optimized for signal integrity in mixed-voltage digital systems - designed specifically for memory expansion, FPGA interfacing, and hot-plug infrastructure where minimal propagation delay and power-domain isolation are critical.
FAQ
What is the maximum operating frequency supported by the SN74CBTLV16211?
The SN74CBTLV16211 does not specify a maximum clock frequency directly, but its 0.2 ns maximum propagation delay at 3.3 V enables reliable operation with data rates exceeding 1 GHz in point-to-point configurations. Signal integrity depends on trace length, load capacitance (≤30 pF recommended), and termination - actual usable frequency must be validated per PCB layout and system-level timing analysis for the SN74CBTLV16211.
Does the SN74CBTLV16211 support level shifting between different voltage domains?
No, the SN74CBTLV16211 is not a level shifter. It operates as a bidirectional analog switch with rail-to-rail conduction, meaning it passes signals within the 0 V to VCC range only. Both sides of each switch pair must remain within the same VCC domain (2.3 V to 3.6 V); crossing voltage domains risks violating absolute maximum ratings and may damage the SN74CBTLV16211.
How should the 1OE and 2OE pins be handled during power-up to ensure high-impedance state?
To guarantee high-impedance OFF-state during power-up or power-down, 1OE and 2OE must be tied to VCC through external pull-up resistors. The minimum resistor value depends on the current-sinking capability of the driving source - typically 10 kΩ is sufficient for most microcontroller GPIOs. This ensures OE remains HIGH (inactive) until valid control logic is established, preventing bus contention during SN74CBTLV16211 initialization.
Is the SN74CBTLV16211 suitable for automotive applications?
No - the SN74CBTLV16211 is not automotive-qualified. While it operates from −40 °C to +125 °C, it lacks AEC-Q100 qualification, automotive-grade reliability testing, and automotive-specific documentation. For automotive use, NXP offers qualified alternatives such as the 74CBTLV3861A; the SN74CBTLV16211 is intended for industrial, computing, and communications equipment only.
What is the purpose of the n.c. (no-connect) pin on the SN74CBTLV16211?
The n.c. pin (pin 1) on the SN74CBTLV16211 is an unconnected internal pad with no electrical function. It must remain unconnected on the PCB to avoid unintended coupling, thermal stress, or mechanical interference. Solder mask should fully cover this pad, and no trace or copper pour should contact it - doing so could compromise signal integrity or long-term reliability of the SN74CBTLV16211.
SN74CBTLV16211DGG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
- -
- Circuit:
- -
- Independent Circuits:
- -
- Current - Output High, Low:
- -
- Voltage Supply Source:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
SN74CBTLV16211DGG FAQ
1.How can I place an order for SN74CBTLV16211DGG through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CBTLV16211DGG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of SN74CBTLV16211DGG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBTLV16211DGG is usually 5 days.
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5.How can I obtain technical support or documentation for SN74CBTLV16211DGG?
For technical support, including SN74CBTLV16211DGG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBTLV16211DGG requirements.
6.How does Aetrix verify that SN74CBTLV16211DGG is sourced from the original manufacturer or authorized distributors?
All SN74CBTLV16211DGG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBTLV16211DGG meets industry standards.
7.What is the process for return or replacement of SN74CBTLV16211DGG?
All SN74CBTLV16211DGG units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTLV16211DGG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBTLV16211DGG part is unused and in its original packaging.
Return procedure for SN74CBTLV16211DGG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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