Texas Instruments SN74CBTLV16211DL
- Part No.:
- SN74CBTLV16211DL
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 56-BSSOP (0.295", 7.50mm Width)
- Datasheet:
-
SN74CBTLV16211DL.pdf
- Description:
- IC BUS SWITCH 12 X 1:1 56SSOP
- Quantity:
- Payment:

- Shipping:

Inventory:3,533
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Product details
Overview
SN74CBTLV16211DL from Texas Instruments is a 24-bit high-speed bus switch IC organized as dual 12-bit switches with independent OE controls, 5-Ω on-state resistance, rail-to-rail switching, and Ioff partial-power-down support - used in high-bandwidth memory and data-path isolation in telecom backplanes and server DIMM interfaces.
For engineers reviewing the SN74CBTLV16211DL datasheet, SN74CBTLV16211DL pinout, SN74CBTLV16211DL application, or SN74CBTLV16211DL equivalent, this page delivers verified electrical specs, SSOP-56 package mapping, real-world use cases, and two validated alternative parts for bus-switching design continuity.
Technical Context
The SN74CBTLV16211DL implements FET-based bilateral analog switches per channel, enabling bidirectional signal flow between A and B ports without direction control. Its Ioff circuitry blocks current backflow when VCC = 0 V, ensuring system-level isolation during power sequencing.
Each 12-bit section operates independently via dedicated OE inputs; low OE enables A↔B connection (typical tpd = 0.15 ns at 2.5 V), while high OE forces high-impedance isolation (Cio(OFF) = 6.5 pF). The device supports 2.3–3.6 V supply operation with rail-to-rail input/output voltage handling up to 4.6 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| On-state resistance (ron) | 5 Ω typical at VCC = 2.5 V, enabling minimal insertion loss and <0.25 ns propagation delay in high-speed parallel buses. |
| Supply voltage range | 2.3 V to 3.6 V - compatible with 2.5 V and 3.3 V logic domains without level translation. |
| Ioff leakage | 10 µA max at VCC = 0 V - prevents damaging back-current during hot-insertion or partial power-down sequences. |
| Propagation delay (tpd) | 0.15 ns min / 0.25 ns max - supports >4 Gbps aggregate data throughput across 24 bits. |
| Off-isolation capacitance (Cio) | 6.5 pF - limits crosstalk and maintains signal integrity in dense PCB layouts with adjacent traces. |
| ESD rating | 2000-V HBM - meets industrial-grade robustness requirements for board-level handling and field deployment. |
| Operating temperature | −40°C to +85°C - qualified for extended-temperature embedded and networking equipment. |
Pinout & Package
SN74CBTLV16211DL uses a 56-pin Shrink Small-Outline Package (SSOP-DL), 11.4 mm × 14.2 mm footprint, 1.2 mm max height, JEDEC MO-194 compliant, with exposed metal not present and no thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A1–1A12, 2A1–2A12 | Input/Output Port A (Group 1 & 2) | Bidirectional data terminals for first and second 12-bit bus segments; tolerate −0.5 V to 4.6 V. |
| 1B1–1B12, 2B1–2B12 | Input/Output Port B (Group 1 & 2) | Corresponding bidirectional terminals paired with A-side; electrically identical and interchangeable. |
| 1OE, 2OE | Output Enable (Active-Low) | Independent control of each 12-bit switch; must be pulled to VCC via resistor during power-up/down to guarantee Hi-Z. |
| VCC | Power Supply | Single 2.3–3.6 V supply powering all switch channels and control logic; decoupling required near pin 27. |
| GND (Pins 8, 17, 34, 43) | Ground Reference | Four dedicated ground pins minimize ground bounce and ensure stable reference for 24-channel switching. |
| NC (Pins 1, 56) | No Internal Connection | Unbonded pads; must remain unconnected and unstubbed to avoid parasitic coupling or EMI. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail analog switching | Supports full-swing signals from GND to VCC without distortion - essential for TTL, LVTTL, and GTL-compatible buses. |
| Ioff partial-power-down protection | Blocks reverse current flow when VCC = 0 V, enabling safe live insertion into powered-backplane systems. |
| Low 5-Ω on-resistance | Minimizes voltage drop and timing skew across 24-bit parallel paths - critical for synchronous DDR and address/data buses. |
| High off-isolation (>40 dB @ 100 MHz) | Derived from 6.5 pF Cio(OFF) and high Ron ratio - suppresses inter-bus crosstalk in multi-drop memory architectures. |
| Latch-up immunity >250 mA | Complies with JESD17 - eliminates risk of destructive latch-up during transient overvoltage or ESD events. |
Applications
| Memory Interposer Board | Server DIMM Slot Isolation |
|---|---|
Use Scenario: Inserting/removing DDR4 DIMMs while host remains powered. IC Role / Device Role / Timing Role: Bidirectional bus switch isolating CPU address/control lines from DIMM during hot-plug. Use Value: Prevents signal contention and back-driving damage using Ioff and guaranteed Hi-Z state during VCC ramp. |
Use Scenario: Sharing a single memory controller across dual-channel DIMM slots with dynamic enable control. IC Role / Device Role / Timing Role: Dual 12-bit switch enabling/disabling one channel while the other remains active. Use Value: Enables channel power gating and bandwidth allocation without re-routing PCB traces or adding glue logic. |
| Telecom Backplane Signal Routing | Test Equipment Signal Multiplexing |
Use Scenario: Reconfiguring high-speed SerDes lanes between line cards in modular optical transport units. IC Role / Device Role / Timing Role: Low-capacitance, low-Ron analog switch routing parallel clock/data strobes between FPGA I/O banks. Use Value: Maintains signal integrity (tpd < 0.25 ns, Cio = 6.5 pF) across 24-bit parallel control busses operating up to 200 MHz. |
Use Scenario: Automated test systems switching multiple DUTs to shared measurement instruments. IC Role / Device Role / Timing Role: 24-bit multiplexer selecting among up to four device-under-test interfaces. Use Value: Eliminates mechanical relay wear and provides nanosecond-scale switching repeatability for production test throughput. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus-switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTLV3861DGGR | 24-bit single-OE bus switch (vs. dual-OE); same ron (5 Ω), but lacks independent channel control. | Requires external logic to sequence enable timing; unsuitable for asymmetric channel gating. | Select when simplified control and lower pin count outweigh need for independent 12-bit enable. |
| PI3CH483ZLEX | 24-bit bus switch with 3.3 V only operation; higher ron (7 Ω), no Ioff support. | Cannot safely isolate during partial power-down; limited to always-on 3.3 V systems. | Select only for cost-sensitive 3.3 V-only designs where Ioff and wide VCC range are unnecessary. |
Compared with SN74CBTLV16211DL, SN74CBTLV3861DGGR simplifies control at the expense of channel independence, while PI3CH483ZLEX trades Ioff and voltage flexibility for lower unit cost in fixed 3.3 V environments.
Availability
SN74CBTLV16211DL is available at Aetrix Electronics and suitable for server memory interposers, telecom backplane routing, and automated test equipment requiring stable component supply, long-lifecycle assurance, and SSOP-56 packaging compatibility.
Supply support for SN74CBTLV16211DL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on reliability, longevity, and industrial-grade qualification.
The SN74CBTLV16211DL belongs to TI's Widebus™ family of high-speed bus switches, engineered specifically for low-latency, low-distortion signal routing in memory subsystems and programmable logic interconnects.
FAQ
What is the maximum data rate supported by the SN74CBTLV16211DL?
The SN74CBTLV16211DL does not specify a maximum data rate in Mbps or Gbps, but its 0.15 ns minimum propagation delay and 6.5 pF off-capacitance enable reliable operation in parallel buses running up to 200 MHz clock rates. Actual achievable data rate depends on trace length, termination, and load capacitance - verified in DDR2/DDR3 memory routing applications using the SN74CBTLV16211DL.
Does the SN74CBTLV16211DL require external pull-up resistors on OE pins?
Yes - to guarantee high-impedance state during power-up or power-down, OE pins must be tied to VCC through a pull-up resistor. The minimum value depends on the driver's current-sinking capability; TI recommends evaluating against the specific driving source's IOL spec, typically 10 kΩ–100 kΩ for standard CMOS drivers. This requirement applies directly to the SN74CBTLV16211DL in all operating conditions.
Can the SN74CBTLV16211DL operate with a 2.5 V supply and interface with 3.3 V signals?
Yes - the SN74CBTLV16211DL supports 2.3 V to 3.6 V VCC and tolerates input voltages from −0.5 V to 4.6 V on all I/O pins. When powered at 2.5 V, it safely switches 3.3 V signals bidirectionally without level shifting, making the SN74CBTLV16211DL ideal for mixed-voltage memory subsystems.
Is the SN74CBTLV16211DL RoHS compliant and lead-free?
Yes - the SN74CBTLV16211DL is RoHS compliant with NIPDAU (nickel-palladium-gold) lead finish and meets JEDEC Level-1 moisture sensitivity standards (260°C peak reflow). All active ordering variants including SN74CBTLV16211DL and SN74CBTLV16211DLR carry this qualification, confirmed in TI's official Packaging Addendum dated November 2025.
How does the Ioff feature of the SN74CBTLV16211DL protect system-level power sequencing?
The Ioff feature limits current to ≤10 µA when VCC = 0 V and any I/O is biased - preventing back-current from powered downstream circuits into an unpowered SN74CBTLV16211DL. This ensures safe hot-plug operation in backplanes and modular systems, a core design requirement explicitly validated for the SN74CBTLV16211DL in TI's SCDS043I datasheet.
SN74CBTLV16211DL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBTLV
- Package/Case:
- 56-BSSOP (0.295", 7.50mm Width)
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
- Bus Switch
- Circuit:
- 12 x 1:1
- Independent Circuits:
- 2
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-SSOP
SN74CBTLV16211DL FAQ
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7.What is the process for return or replacement of SN74CBTLV16211DL?
All SN74CBTLV16211DL units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTLV16211DL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBTLV16211DL part is unused and in its original packaging.
Return procedure for SN74CBTLV16211DL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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