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Texas Instruments SN74CBTLV16211GR
- Part No.:
- SN74CBTLV16211GR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 56-TFSOP (0.240", 6.10mm Width)
- Datasheet:
-
SN74CBTLV16211GR.pdf
- Description:
- IC BUS SWITCH 12 X 1:1 56TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,024
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Product details
Overview
SN74CBTLV16211GR from Texas Instruments is a 24-bit high-speed FET bus switch IC organized as dual 12-bit switches with independent OE controls, featuring 5-Ω on-state resistance, rail-to-rail signal switching, and Ioff partial-power-down support - used in high-bandwidth memory/data bus isolation and hot-swap interface applications.
For engineers reviewing the SN74CBTLV16211GR datasheet, SN74CBTLV16211GR pinout, SN74CBTLV16211GR application, or SN74CBTLV16211GR equivalent, key selection criteria include guaranteed 5-Ω ron at 2.5 V/3.3 V, sub-1 ns enable/disable timing, −40°C to 85°C operation, TSSOP-56 package thermal performance (θJA = 64°C/W), and JESD 17 latch-up immunity.
Technical Context
This device implements two independent 12-bit bidirectional analog/digital bus switches using low-threshold NMOS FETs, enabling rail-to-rail signal pass-through without level translation. Each switch block responds to its dedicated OE input: logic-low enables A↔B connection; logic-high forces high-impedance isolation.
The Ioff feature actively blocks current backflow when VCC = 0 V, supporting live-insertion and partial-power-down system architectures. ESD protection exceeds 2000-V HBM and 200-V MM, and latch-up immunity exceeds 250 mA per JESD 17.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3 V to 3.6 V - supports both 2.5 V and 3.3 V system rails without external level shifters |
| ron (Typ) | 5 Ω at VCC = 2.5 V / 3.3 V - ensures minimal voltage drop and signal distortion across full data path |
| tpd (Max) | 0.25 ns - enables >1 GHz data rate compatibility in high-speed parallel bus applications |
| ten/tdis (Max) | 7.7 ns - allows fast dynamic bus reconfiguration for multiplexed memory or peripheral interfaces |
| Ioff (Max) | 10 µA at VCC = 0 V - prevents power-domain leakage during partial shutdown |
| ESD HBM | 2000 V - meets industrial-grade robustness requirements for board-level handling and field operation |
| Operating Temp | −40°C to +85°C - qualified for extended-temperature industrial and telecom infrastructure use |
Pinout & Package
TSSOP-56 (DGG) package: 12.0 mm × 6.1 mm × 1.2 mm body, 0.5 mm pitch, exposed pad not present, JEDEC MO-153 compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A1–1A12, 2A1–2A12 | Input/Output Port A (Group 1 & 2) | Bidirectional data terminals for first and second 12-bit bus segments; rail-to-rail compatible |
| 1B1–1B12, 2B1–2B12 | Input/Output Port B (Group 1 & 2) | Corresponding bidirectional terminals connected to A ports when respective OE is active low |
| 1OE, 2OE | Output Enable (Active-Low) | Independent control inputs - low enables 12-bit A↔B path; high isolates ports into high-Z state |
| VCC | Power Supply | Single 2.3–3.6 V supply powering all switch FETs and internal logic; no separate I/O supply required |
| GND | Ground Reference | Four dedicated ground pins (pins 8, 17, 35, 44) minimize ground bounce in high-speed switching |
| NC | No Internal Connection | Pins 1 and 56 are unconnected - must be left floating or tied to GND per layout best practice |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail analog/digital switching | Supports signals from GND to VCC without clipping - preserves full logic swing in mixed-voltage systems |
| Ioff partial-power-down protection | Blocks reverse current flow when VCC = 0 V - enables safe hot-plug insertion in modular backplane designs |
| 5-Ω typical on-state resistance | Minimizes propagation delay (<0.25 ns) and insertion loss - critical for maintaining signal integrity in DDR/PCI buses |
| 2000-V HBM ESD rating | Eliminates need for external TVS diodes in board-level ESD protection schemes |
| Dual independent 12-bit control | Enables flexible partitioning - e.g., one group for address lines, another for data lines, each with separate timing control |
Applications
| Memory Bus Isolation | Hot-Swap Backplane Interface |
|---|---|
|
Use Scenario: Isolating DDR SDRAM address/control lines between controller and multiple memory modules to prevent contention during module insertion/removal. IC Role / Device Role / Timing Role: Bidirectional bus switch enabling/disabling physical connection under firmware control; timing-critical path with <0.25 ns tpd. Use Value: Eliminates need for tri-state buffers and glue logic while preserving signal rise/fall times and reducing PCB layer count. |
Use Scenario: Connecting hot-pluggable line cards to a shared backplane data bus in telecom chassis systems. IC Role / Device Role / Timing Role: Ioff-enabled isolation switch ensuring zero current injection during card insertion; OE synchronized to power sequencing. Use Value: Prevents system reset or corruption during live card replacement - validated per GR-63-CORE shock/vibration specs. |
| PCI/PCI-X Slot Multiplexing | FPGA I/O Expansion Hub |
|
Use Scenario: Sharing a single PCI host interface among multiple peripheral slots via time-multiplexed access. IC Role / Device Role / Timing Role: High-speed 24-bit bidirectional switch controlled by FPGA logic; ten/tdis < 7.7 ns enables cycle-accurate slot arbitration. Use Value: Reduces host-side PCIe root complex complexity and eliminates need for multi-port PCI bridges. |
Use Scenario: Expanding I/O count of a resource-constrained FPGA by routing signals through an external switch matrix to off-chip peripherals. IC Role / Device Role / Timing Role: Low-ron analog switch extending FPGA pin reach without degrading setup/hold margins. Use Value: Enables reuse of same FPGA design across multiple SKUs with varying peripheral configurations - reduces NRE cost. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBT16211DGGR | Same architecture but CBT (not CBTLV) family - higher ron (12 Ω typ), wider VCC range (4.5–5.5 V), no Ioff support | Restricted to 5 V-only systems; unsuitable for partial-power-down or mixed-voltage hot-swap | Select only if legacy 5 V bus compatibility is mandatory and power sequencing is fully controlled. |
| PI3CH406QE | 6-bit, 3.3 V-only, 6 Ω ron, integrated 10-kΩ pull-downs on OEs, smaller TSSOP-24 package | Limited channel count requires four devices for 24-bit coverage; lacks dual-OE granularity | Prefer for space-constrained designs where modular 6-bit switching suffices and OE pull-down simplifies control logic. |
Compared with SN74CBTLV16211GR, SN74CBT16211DGGR trades Ioff and low-voltage operation for 5 V tolerance, while PI3CH406QE offers footprint savings at the cost of scalability and independent 12-bit control - making SN74CBTLV16211GR optimal for integrated 24-bit, mixed-rail, hot-swap systems.
Availability
SN74CBTLV16211GR is available at Aetrix Electronics and suitable for memory bus isolation, hot-swap backplane interfaces, and FPGA I/O expansion requiring stable component supply, long-term industrial lifecycle support, and consistent tape-and-reel delivery.
Supply support for SN74CBTLV16211GR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in high-reliability silicon solutions.
The SN74CBTLV16211GR belongs to TI's Widebus™ family of high-speed bus switches, designed specifically for low-latency, low-distortion signal routing in memory subsystems, telecom infrastructure, and programmable logic interconnects.
FAQ
What is the maximum operating frequency supported by the SN74CBTLV16211GR?
The SN74CBTLV16211GR does not specify a clock frequency limit because it is an analog bus switch, not a clocked device. Its 0.25 ns max propagation delay enables reliable operation with data rates exceeding 1 GHz in parallel bus applications such as DDR memory interfaces and PCI-X data paths, provided PCB layout maintains controlled impedance and minimizes stub length.
Can the SN74CBTLV16211GR be used with 1.8 V I/O signals?
No - the SN74CBTLV16211GR requires VCC between 2.3 V and 3.6 V and is not characterized for 1.8 V operation. Applying 1.8 V signals while VCC ≥ 2.3 V is permissible only if the input voltage stays within −0.5 V to VCC + 0.3 V, but signal swing will be clipped below ~0.7 V due to FET threshold. For true 1.8 V compatibility, consider TI's SN74AVC16T245 instead.
How should unused OE pins be handled on the SN74CBTLV16211GR?
Unused OE pins must be held static at either VCC or GND to prevent floating inputs that could cause undefined switching states and increased ICC. TI recommends tying unused OE to VCC via a 10-kΩ pullup resistor to ensure default high-impedance isolation - this aligns with the device's partial-power-down design intent and avoids unintended bus contention.
Does the SN74CBTLV16211GR support hot-plug operation with powered-backplane insertion?
Yes - the SN74CBTLV16211GR's Ioff specification guarantees ≤10 µA leakage when VCC = 0 V and any I/O is biased between 0–3.6 V, enabling safe insertion into a live backplane. This feature, combined with 2000-V HBM ESD rating and JESD 17 latch-up immunity (>250 mA), makes SN74CBTLV16211GR suitable for GR-63-compliant telecom hot-swap modules.
What is the thermal resistance (θJA) of the SN74CBTLV16211GR in its TSSOP-56 package?
The SN74CBTLV16211GR in TSSOP-56 (DGG) package has a specified junction-to-ambient thermal resistance (θJA) of 64°C/W under standard JEDEC test conditions (1-layer 2-oz copper, 1-in² pad). Actual thermal performance improves significantly with PCB copper pour under the package and thermal vias - typical production layouts achieve 40–50°C/W.
SN74CBTLV16211GR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBTLV
- Package/Case:
- 56-TFSOP (0.240", 6.10mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Bus Switch
- Circuit:
- 12 x 1:1
- Independent Circuits:
- 2
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSSOP
SN74CBTLV16211GR FAQ
1.How can I place an order for SN74CBTLV16211GR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CBTLV16211GR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74CBTLV16211GR reliable?
The price and inventory of SN74CBTLV16211GR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBTLV16211GR is usually 5 days.
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Once your SN74CBTLV16211GR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74CBTLV16211GR?
For technical support, including SN74CBTLV16211GR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBTLV16211GR requirements.
6.How does Aetrix verify that SN74CBTLV16211GR is sourced from the original manufacturer or authorized distributors?
All SN74CBTLV16211GR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBTLV16211GR meets industry standards.
7.What is the process for return or replacement of SN74CBTLV16211GR?
All SN74CBTLV16211GR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTLV16211GR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBTLV16211GR part is unused and in its original packaging.
Return procedure for SN74CBTLV16211GR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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