Texas Instruments SN74CBTLV16211VR

Overview

SN74CBTLV16211VR from Texas Instruments is a 24-bit high-speed FET bus switch IC organized as dual 12-bit switches with independent OE controls, 5-Ω on-state resistance, rail-to-rail signal switching, and Ioff partial-power-down support - used in high-bandwidth memory and data-path isolation in telecom backplanes and server DIMM interfaces.

For engineers reviewing the SN74CBTLV16211VR datasheet, SN74CBTLV16211VR pinout, SN74CBTLV16211VR application, or SN74CBTLV16211VR equivalent, key selection criteria include on-resistance matching across 24 channels, guaranteed 0.25 ns propagation delay at 3.3 V, thermal performance in TVSOP-56 (θJA = 48°C/W), and Ioff leakage <10 µA during power-off states.

Technical Context

The SN74CBTLV16211VR implements two independent 12-bit bidirectional FET switches controlled by separate OE inputs; each switch connects port A to port B when OE is low, presenting high-impedance isolation when OE is high. Its NMOS-only switch architecture enables rail-to-rail analog/digital signal pass-through without level translation.

Designed for partial-power-down operation, the device features Ioff circuitry that limits reverse current to <10 µA when VCC = 0 V and any I/O is biased between 0–3.6 V, ensuring system-level isolation during hot-swap or staggered power sequencing. Latch-up immunity exceeds 250 mA per JESD 17.

Key Specifications

Pinout & Package

SN74CBTLV16211VR uses a 56-pin TVSOP (DGV) package with 1.2 mm max height, 6.0 mm × 13.9 mm body, and 0.4 mm lead pitch - optimized for high-density PCB layouts and automated assembly.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switch applications.

Compared with SN74CBTLV16211VR, SN74CBTLV3861RGYR offers greater density but sacrifices per-switch control granularity, while PI3CH480QS trades off thermal margin, ESD robustness, and temperature range for lower unit cost in non-industrial settings.

Availability

SN74CBTLV16211VR is available at Aetrix Electronics and suitable for memory interposers, server DIMM routing, telecom backplanes, and JTAG multiplexing requiring stable component supply across long-lifecycle industrial programs.

Supply support for SN74CBTLV16211VR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with focus on reliability, scalability, and system-level integration.

The SN74CBTLV16211VR belongs to TI's Widebus™ family of high-speed bus switches, engineered specifically for low-latency, low-distortion signal routing in memory subsystems and high-density digital backplanes.

FAQ

What is the maximum operating frequency supported by the SN74CBTLV16211VR?

The SN74CBTLV16211VR does not specify a maximum clock frequency directly, but its 0.25 ns typical propagation delay at 3.3 V enables reliable operation in parallel buses running at >4 Gbps aggregate bandwidth. System-level timing depends on load capacitance and driver strength; for 30 pF loads, it supports clean edge transitions up to 1 GHz fundamental frequency. Always validate timing margins using actual board parasitics and IBIS models for SN74CBTLV16211VR.

Does the SN74CBTLV16211VR require external pull-up resistors on OE pins?

Yes - to guarantee high-impedance state during power-up or power-down, OE pins must be tied to VCC through external pull-up resistors. The minimum resistor value depends on the driving source's current-sinking capability; TI recommends ≥10 kΩ for standard CMOS drivers. Leaving OE floating risks undefined switch states and potential bus contention, so proper biasing is mandatory for robust SN74CBTLV16211VR operation.

Can the SN74CBTLV16211VR interface between 2.5 V and 3.3 V logic domains?

No - the SN74CBTLV16211VR is a passive FET switch with no level-shifting capability; it requires VCC to be set to the higher of the two domain voltages (e.g., 3.3 V) and only passes signals within the 0–VCC range. For true 2.5 V ↔ 3.3 V translation, a dedicated level shifter like TXS0108E is required. SN74CBTLV16211VR operates correctly only when both sides of each switch share the same VCC-referenced voltage domain.

What is the thermal resistance (θJA) of the SN74CBTLV16211VR in its TVSOP package?

The SN74CBTLV16211VR in the TVSOP (DGV) package has a specified junction-to-ambient thermal resistance (θJA) of 48°C/W under JEDEC-standard conditions (2-layer board, 1-in² copper). This value assumes proper PCB layout with recommended land pattern and thermal vias. In compact, multi-layer boards with enhanced copper pours, actual θJA may improve to ~35°C/W - critical for sustained 24-channel switching at 3.6 V and 85°C ambient.

How does the Ioff feature of the SN74CBTLV16211VR protect downstream circuitry?

The Ioff feature in SN74CBTLV16211VR disables internal conduction paths when VCC = 0 V, limiting reverse current to <10 µA even if I/O pins are driven to 3.6 V. This prevents damaging backflow into unpowered sections of a system - essential for hot-swap DIMM slots, modular backplanes, or power-staged subsystems. Unlike standard bus switches, SN74CBTLV16211VR maintains isolation without external circuitry, simplifying power sequencing design.