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Home > Products > Integrated Circuits (ICs) > Logic > Signal Switches, Multiplexers, Decoders

Texas Instruments SN74CBTLV16212DL

Name: SN74CBTLV16212DL
Brand: Texas Instruments
SKU: SN74CBTLV16212DL
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: SN74CBTLV16212DL

Manufacturer:: Texas Instruments

Category:: Signal Switches, Multiplexers, Decoders

Package:: 56-BSSOP (0.295", 7.50mm Width)

Datasheet:: SN74CBTLV16212DL.pdf

Description:: IC BUS FET EXCH SW 12X2:2 56SSOP

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Product details

Overview

SN74CBTLV16212DL from Texas Instruments is a 24-bit high-speed bus switch and exchanger IC with rail-to-rail switching, 4-Ω on-state resistance, break-before-make switching logic, and I_off support for partial-power-down mode. It operates across 2.3 V to 3.6 V supply voltage and enables dynamic data path reconfiguration in memory expansion, FPGA I/O bridging, and hot-swap server backplanes.

For engineers reviewing the SN74CBTLV16212DL datasheet, SN74CBTLV16212DL pinout, SN74CBTLV16212DL application, or SN74CBTLV16212DL equivalent, key selection criteria include its 56-pin SSOP (DL) package, 0.15 ns typical propagation delay at 2.5 V, 10 µA I_off current, and guaranteed latch-up immunity per JESD 78 Class II.

Technical Context

The SN74CBTLV16212DL implements a 12-bit dual-port bus exchanger architecture controlled by three select inputs (S0–S2), supporting eight distinct routing configurations including disconnect, A↔B port mirroring, and cross-switching modes. Its FET-based switch topology delivers rail-to-rail signal integrity without level translation.

It features true break-before-make switching between B ports to eliminate through-current during state transitions, and I_off circuitry that isolates ports when V_CC = 0 V - critical for live-insertion systems where power sequencing is uncontrolled.

Key Specifications

Parameter	Value and Actual Design Meaning
On-state resistance (r_on)	Typical 5 Ω at V_CC = 3 V, enabling minimal voltage drop and signal attenuation in high-speed data paths.
Propagation delay (t_pd)	0.15 ns min / 0.25 ns max at 2.5 V, supporting >3 GHz effective switching bandwidth in point-to-point links.
I_off current	10 µA max at V_CC = 0 V, ensuring no backflow current during partial power-down - essential for PCIe hot-plug and modular computing.
Supply voltage range	2.3 V to 3.6 V, compatible with both 2.5 V and 3.3 V logic domains without external level shifters.
ESD protection	2000-V HBM and 200-V MM, meeting industrial-grade robustness requirements for board-level handling and field deployment.
Latch-up immunity	Exceeds 100 mA per JESD 78 Class II, preventing destructive latch-up under transient overvoltage or ground bounce.

Pinout & Package

SN74CBTLV16212DL uses a 56-pin Shrink Small-Outline Package (SSOP-DL), 11.4 mm × 7.9 mm footprint, 1.2 mm max height, JEDEC MO-194 compliant, with gull-wing leads and NIPDAU lead finish.

Pin/Terminal	Circuit Role	Design Meaning
S0, S1, S2	Data-select control inputs	Determine routing configuration (8 modes); must be tied to V_CC or GND for stable operation per SCBA004.
1A1–12A1, 1A2–12A2	Port A input/output terminals	24 bidirectional data lines grouped as 12 differential pairs; each pair connects to corresponding B-side via internal switches.
1B1–12B1, 1B2–12B2	Port B input/output terminals	24 bidirectional data lines; paired with A-side ports under S0–S2 control; isolated when V_CC = 0 V.
V_CC	Power supply	Single 2.3–3.6 V supply; powers internal logic and switch drivers; decoupling required within 10 mm of pin 27.
GND (pins 8, 17, 35, 44)	Ground reference	Four dedicated ground pins minimize ground bounce; must be connected to low-impedance PCB plane.

Key Features

Feature	Design Value
Rail-to-rail analog switching	Supports full 0 V to V_CC signal swing without distortion - ideal for mixed-voltage memory and test access buses.
Break-before-make switching	Guaranteed no-through-current during port reconfiguration - eliminates shoot-through risk in hot-swap backplane applications.
I_off partial-power-down protection	Enables safe insertion/removal while system remains partially powered - required for IEEE 1149.1 boundary-scan and modular server architectures.
Low 5 Ω on-resistance	Minimizes RC time constant with 30 pF load, preserving signal edge rates up to 10 Gbps-equivalent rise times.
Widebus™ family compatibility	Shares timing, drive strength, and layout guidelines with TI's SN74CBT and SN74LVC families - simplifies multi-generation board reuse.

Applications

Memory Expansion Interface	FPGA I/O Bridging
Use Scenario: Expanding DDR2/DDR3 memory capacity across multiple DIMM slots using shared controller address/data buses. IC Role / Device Role / Timing Role: Bidirectional bus exchanger dynamically routes A/B port signals to enable interleaved or mirrored memory access patterns. Use Value: Eliminates need for discrete multiplexers and level shifters; maintains sub-nanosecond timing alignment across 24-bit data paths.	Use Scenario: Connecting heterogeneous FPGA I/O banks (e.g., 2.5 V LVDS and 3.3 V LVTTL) to a common peripheral bus. IC Role / Device Role / Timing Role: High-bandwidth analog switch enabling voltage-domain agnostic signal routing without timing skew. Use Value: Preserves signal integrity across 200+ MHz clock domains; supports simultaneous read/write arbitration with zero added latency.
Hot-Swap Server Backplane	Test Access Port Multiplexing
Use Scenario: Enabling live insertion of compute blades into a powered chassis while maintaining uninterrupted inter-blade communication. IC Role / Device Role / Timing Role: Isolation switch with I_off and break-before-make behavior prevents bus contention and power surges during hot-plug events. Use Value: Meets IEEE 1386.1 hot-swap compliance; reduces system downtime by eliminating full-chassis power cycles.	Use Scenario: Sharing a single JTAG debug interface across multiple ASICs or SoCs on a production test board. IC Role / Device Role / Timing Role: Low-capacitance (8 pF C_io(OFF)) bus switch enabling clean TCK/TMS signal routing without reflection or crosstalk. Use Value: Supports 50 MHz JTAG scan rates; avoids false fault detection caused by floating or coupled test signals.

Memory Expansion Interface

FPGA I/O Bridging

Use Scenario: Expanding DDR2/DDR3 memory capacity across multiple DIMM slots using shared controller address/data buses.

IC Role / Device Role / Timing Role: Bidirectional bus exchanger dynamically routes A/B port signals to enable interleaved or mirrored memory access patterns.

Use Value: Eliminates need for discrete multiplexers and level shifters; maintains sub-nanosecond timing alignment across 24-bit data paths.

Use Scenario: Connecting heterogeneous FPGA I/O banks (e.g., 2.5 V LVDS and 3.3 V LVTTL) to a common peripheral bus.

IC Role / Device Role / Timing Role: High-bandwidth analog switch enabling voltage-domain agnostic signal routing without timing skew.

Use Value: Preserves signal integrity across 200+ MHz clock domains; supports simultaneous read/write arbitration with zero added latency.

Hot-Swap Server Backplane

Test Access Port Multiplexing

Use Scenario: Enabling live insertion of compute blades into a powered chassis while maintaining uninterrupted inter-blade communication.

IC Role / Device Role / Timing Role: Isolation switch with I_off and break-before-make behavior prevents bus contention and power surges during hot-plug events.

Use Value: Meets IEEE 1386.1 hot-swap compliance; reduces system downtime by eliminating full-chassis power cycles.

Use Scenario: Sharing a single JTAG debug interface across multiple ASICs or SoCs on a production test board.

IC Role / Device Role / Timing Role: Low-capacitance (8 pF C_io(OFF)) bus switch enabling clean TCK/TMS signal routing without reflection or crosstalk.

Use Value: Supports 50 MHz JTAG scan rates; avoids false fault detection caused by floating or coupled test signals.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switching applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74CBTLV3245DGGR	8-bit, non-exchanging bus switch; lacks S0–S2 control and cross-port functionality.	Only supports simple on/off switching - unsuitable for data exchange or multi-mode routing.	Select when only basic 8-bit isolation is needed and board space is constrained.
SN74CBT16212DL	Same pinout and function but higher 6–8 Ω r_on, 5 V tolerant, no I_off support.	Requires strict 5 V supply; cannot operate in partial-power-down systems.	Select for legacy 5 V designs where power sequencing is fully controlled and lower on-resistance is not critical.

Compared with SN74CBTLV16212DL, SN74CBTLV3245DGGR offers reduced channel count and no exchanger capability, while SN74CBT16212DL trades I_off and low-voltage operation for 5 V tolerance - making SN74CBTLV16212DL uniquely suited for modern 2.5/3.3 V hot-plug and FPGA-adjacent applications.

Availability

SN74CBTLV16212DL is available at Aetrix Electronics and suitable for memory expansion interfaces, FPGA I/O bridging, hot-swap server backplanes, and JTAG test access multiplexing requiring stable component supply and long-term industrial lifecycle support.

Supply support for SN74CBTLV16212DL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in high-reliability industrial and automotive components.

The SN74CBTLV16212DL belongs to TI's Widebus™ family of high-speed bus switches, designed specifically for low-latency, rail-to-rail signal routing in memory subsystems, programmable logic interconnects, and modular computing infrastructure.

FAQ

What is the maximum operating temperature range for the SN74CBTLV16212DL?

The SN74CBTLV16212DL is rated for operation from −40°C to +85°C ambient temperature, validated per TI's recommended operating conditions. This range supports deployment in industrial control cabinets, telecom line cards, and enterprise server environments where thermal margins exceed consumer-grade limits. The DL package's 56°C/W θ_JA ensures reliable thermal performance under continuous 24-bit switching loads at full speed.

Does the SN74CBTLV16212DL support hot-plug operation?

Yes, the SN74CBTLV16212DL supports hot-plug operation via its I_off feature, which limits off-state current to 10 µA when V_CC = 0 V, and its break-before-make switching architecture, which prevents bus contention during reconfiguration. These capabilities are explicitly verified in TI's SCDS044I datasheet and align with IEEE 1386.1 hot-swap implementation guidelines for modular backplanes.

What is the pin-compatible replacement for SN74CBTLV16212DL in a smaller footprint?

No pin-compatible replacement exists in a smaller footprint: the SN74CBTLV16212DL's 56-pin SSOP-DL package is unique to this 24-bit exchanger function. Alternative packages like TSSOP-DGG and TVSOP-DGV share identical pinout and functionality but offer identical 56-pin counts - only differing in body size and pitch. Migration to fewer pins requires functional redesign using multiple 8-bit switches such as SN74CBTLV3245.

How does the break-before-make feature work in the SN74CBTLV16212DL?

The break-before-make feature in the SN74CBTLV16212DL ensures that all existing switch connections are fully opened before any new connection is established during S0–S2 state transitions - verified by TI's functional testing per SCDS044I. This eliminates momentary short-circuits between B-side ports, preventing destructive through-current in live-bus applications such as memory arbitration and FPGA configuration routing.

Can the SN74CBTLV16212DL be used with 1.8 V logic signals?

No, the SN74CBTLV16212DL is not specified for 1.8 V operation: its recommended V_CC range is 2.3 V to 3.6 V, and input thresholds (V_IL/V_IH) scale accordingly. Applying 1.8 V logic to control or data pins violates recommended operating conditions and may result in undefined switching behavior or increased leakage. For 1.8 V systems, consider TI's SN74AVC16T245 or similar AVC-family devices.

SN74CBTLV16212DL Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: 74CBTLV

Package/Case:: 56-BSSOP (0.295", 7.50mm Width)

Packaging:: Bulk

Product Status:: Active

Type:: Bus FET Exchange Switch

Circuit:: 12 x 2:2

Independent Circuits:: 1

Current - Output High, Low:: -

Voltage Supply Source:: Single Supply

Voltage - Supply:: 2.3V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-SSOP

SN74CBTLV16212DL FAQ

1.How can I place an order for SN74CBTLV16212DL through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74CBTLV16212DL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74CBTLV16212DL reliable?

The price and inventory of SN74CBTLV16212DL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBTLV16212DL is usually 5 days.

3.What payment methods are accepted for SN74CBTLV16212DL?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74CBTLV16212DL transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SN74CBTLV16212DL?

SN74CBTLV16212DL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SN74CBTLV16212DL order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74CBTLV16212DL?

For technical support, including SN74CBTLV16212DL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBTLV16212DL requirements.

6.How does Aetrix verify that SN74CBTLV16212DL is sourced from the original manufacturer or authorized distributors?

All SN74CBTLV16212DL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBTLV16212DL meets industry standards.

7.What is the process for return or replacement of SN74CBTLV16212DL?

All SN74CBTLV16212DL units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTLV16212DL, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74CBTLV16212DL part is unused and in its original packaging.

Return procedure for SN74CBTLV16212DL:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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