Texas Instruments SN74CBTLV16212GR
- Part No.:
- SN74CBTLV16212GR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 56-TFSOP (0.240", 6.10mm Width)
- Datasheet:
-
SN74CBTLV16212GR.pdf
- Description:
- IC BUS FET EXC SW 12X2:2 56TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:2,945
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Product details
Overview
SN74CBTLV16212GR from Texas Instruments is a 24-bit high-speed bus switch and exchanger IC with rail-to-rail switching, 4-Ω on-state resistance, break-before-make switching logic, and Ioff support for partial-power-down mode. It operates from 2.3 V to 3.6 V and enables data exchange between four signal ports (A1/B1–A12/B12) via S0–S2 select lines in telecom backplanes and memory interconnects.
For engineers reviewing the SN74CBTLV16212GR datasheet, SN74CBTLV16212GR pinout, SN74CBTLV16212GR application, or SN74CBTLV16212GR equivalent, key selection criteria include its 56-pin TSSOP (DGG) package, sub-nanosecond propagation delay (0.15 ns typ), 128 mA continuous channel current rating, and JESD 78 Class II latch-up immunity - critical for hot-swap-capable server I/O subsystems.
Technical Context
The SN74CBTLV16212GR implements 12 independent bidirectional FET switches per A/B port pair, controlled by three select inputs (S0–S2) that configure 24-bit bus switching or 12-bit data exchange modes. Its CMOS-compatible control interface supports 2.3–3.6 V logic thresholds with ±1 µA input leakage and 5 pF input capacitance.
Each switch features rail-to-rail analog signal handling, 4 Ω typical on-resistance at VCC = 3.3 V, and isolation during power-off via Ioff (≤10 µA at VCC = 0 V). The break-before-make architecture prevents through-current during port reconfiguration, ensuring safe operation in live-backplane environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3 V to 3.6 V - compatible with 2.5 V and 3.3 V system rails without level translation |
| On-State Resistance (ron) | 4 Ω typ - minimizes voltage drop and signal distortion in high-speed parallel buses |
| Propagation Delay (tpd) | 0.15 ns typ at 2.5 V - enables >5 Gbps aggregate throughput across 24-bit paths |
| Ioff | 10 µA max at VCC = 0 V - blocks backflow current during partial power-down, protecting powered sections |
| Latch-Up Immunity | >100 mA per JESD 78 Class II - ensures robustness against transient-induced latch-up in industrial environments |
| ESD Protection | 2000-V HBM, 200-V MM - meets IEC 61000-4-2 Level 3 for board-level ESD resilience |
| Operating Temperature | −40°C to +85°C - qualified for extended-temperature industrial and telecom infrastructure use |
Pinout & Package
TSSOP-56 (DGG) package, 12.0 mm × 4.4 mm footprint, 1.2 mm max height, lead-free NiPdAu finish, MSL Level-1 (260°C peak reflow).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| S0, S1, S2 | Bus configuration select inputs | Determine whether device operates as 24-bit switch or 12-bit exchanger; define A↔B port mapping per function table |
| A1–A12, B1–B12 | Signal I/O terminals (24 bidirectional pairs) | Support rail-to-rail analog/digital signals; each pair connects via low-ron FET switch when enabled |
| VCC | Power supply | Supplies internal logic and switch bias; must be decoupled locally due to fast switching transients |
| GND (pins 8, 17, 30, 43) | Ground reference | Four dedicated ground pins minimize ground bounce across 24-switch array during simultaneous switching |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail analog switching | Enables transparent transmission of 0–3.6 V signals without clipping - essential for mixed-signal backplane interfaces |
| Break-before-make switching | Guarantees no overlap between old and new switch paths - eliminates short-circuit risk during dynamic reconfiguration |
| Ioff partial-power-down protection | Prevents damaging current flow from live buses into unpowered sections - required for hot-plug PCIe or CXL add-in cards |
| Low 4-Ω on-resistance | Reduces insertion loss and timing skew across parallel data paths - maintains signal integrity in DDR/PCIe trace routing |
| 24-bit bus exchange capability | Permits real-time data swapping between dual memory banks or redundant I/O controllers without external logic |
Applications
| Telecom Backplane Switching | Memory Interconnect Arbitration |
|---|---|
Use Scenario: Dynamic rerouting of 24-bit control/data buses between line cards and switch fabric in modular optical transport systems. IC Role / Device Role / Timing Role: Bidirectional bus exchanger enabling non-blocking path selection under FPGA control via S0–S2. Use Value: Eliminates need for discrete multiplexers and glue logic while maintaining sub-ns timing alignment across all 24 lanes. | Use Scenario: Arbitrating access between two DDR4 memory controllers and shared DIMM slots in fault-tolerant server platforms. IC Role / Device Role / Timing Role: High-bandwidth, low-latency bus switch isolating active controller from standby path during failover. Use Value: Enables <100 ns switchover time with zero data corruption, meeting JEDEC RAS requirements for memory mirroring. |
| Hot-Swap I/O Expansion | Test Access Multiplexing |
Use Scenario: Enabling safe insertion/removal of PCIe expansion modules while main system remains powered and operational. IC Role / Device Role / Timing Role: Isolation switch with Ioff protection placed between slot connector and host root complex. Use Value: Prevents VCC backfeed and ground loop currents during hot-plug events - certified per PCI-SIG Hot-Plug Spec v2.3. | Use Scenario: Sharing a single JTAG/debug probe across multiple ASICs on a production test board using automated pin reassignment. IC Role / Device Role / Timing Role: Low-capacitance (8 pF Cio(OFF)) bus switch routing TCK/TMS/TDO signals to selected DUT. Use Value: Reduces test fixture complexity and eliminates signal degradation from long daisy-chained traces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTLV3861RGYR | 32-bit, 56-pin VQFN; higher ron (6 Ω typ); no S0–S2 exchanger logic | Fixed 32-bit switch only - lacks programmable bus exchange functionality | Select when wider bus width is needed and exchanger mode is unnecessary |
| PI3CH485QE | 24-bit, 56-pin TSSOP; 5.5 Ω ron; supports 4.5 V VCC; no Ioff spec | Higher-voltage tolerant but lacks partial-power-down protection for hot-swap use | Select for legacy 5 V tolerant designs where Ioff is not required |
Compared with SN74CBTLV3861RGYR and PI3CH485QE, the SN74CBTLV16212GR uniquely combines 24-bit exchange capability, 4 Ω ron, and validated Ioff behavior - making it the only option for hot-pluggable, low-skew, reconfigurable memory or control bus architectures.
Availability
SN74CBTLV16212GR is available at Aetrix Electronics and suitable for telecom backplane switching, memory interconnect arbitration, and hot-swap I/O expansion requiring stable component supply across multi-year production cycles.
Supply support for SN74CBTLV16212GR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity solutions with over 90 years of innovation in industrial, automotive, and communications markets.
The SN74CBTLV16212GR belongs to TI's Widebus™ family of high-speed logic devices, engineered specifically for low-latency, low-distortion signal routing in next-generation computing and networking infrastructure.
FAQ
What is the maximum operating frequency supported by the SN74CBTLV16212GR?
The SN74CBTLV16212GR does not specify a clock frequency limit because it is an analog bus switch, not a clocked logic device. Its performance is defined by propagation delay (0.15 ns typ) and bandwidth - supporting signal edges up to ~2.3 GHz (based on tpd and 10–90% rise time). Actual usable frequency depends on PCB layout, load capacitance, and signal integrity design; for 24-bit parallel buses, it reliably handles DDR2/DDR3 signaling rates.
Does the SN74CBTLV16212GR support hot-swap operation?
Yes, the SN74CBTLV16212GR supports hot-swap operation via its Ioff feature, which limits current to ≤10 µA when VCC = 0 V. This prevents back-driving of powered system rails during insertion/removal. Combined with break-before-make switching and 2000-V HBM ESD rating, the SN74CBTLV16212GR meets core requirements for PCIe and CompactPCI hot-plug compliance when used with appropriate current-limiting circuitry.
Can the SN74CBTLV16212GR be used with 1.8 V logic levels?
No, the SN74CBTLV16212GR is not rated for 1.8 V operation. Its recommended VCC range is 2.3 V to 3.6 V, and control input thresholds (VIH/VIL) are specified only within that range. Applying 1.8 V to VCC may result in undefined switching behavior, increased ron, or failure to meet timing specs. For 1.8 V systems, consider TI's SN74CBT3244 or ON Semiconductor's NLAST4050.
How many distinct switching configurations does the SN74CBTLV16212GR support?
The SN74CBTLV16212GR supports eight distinct switching configurations via its three select inputs (S2, S1, S0), as defined in the function table. These include full disconnect, six single-port mappings (e.g., A1↔B1, A1↔B2), and one dual-port mode (A1↔B1 and A2↔B2 simultaneously). Each configuration applies identically across all 12 A/B pairs, enabling consistent 24-bit data routing or exchange.
Is thermal derating required for the SN74CBTLV16212GR in high-density layouts?
Yes, thermal derating is advised: the SN74CBTLV16212GR has θJA = 64°C/W in TSSOP (DGG). At full 128 mA channel current and 3.6 V VCC, power dissipation can reach ~460 mW. In compact layouts with limited airflow, junction temperature may exceed 125°C. Use ≥2 cm² copper pour under the exposed pad (if present), avoid stacking heat-generating components nearby, and verify thermal performance with IR imaging during validation testing of the SN74CBTLV16212GR.
SN74CBTLV16212GR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBTLV
- Package/Case:
- 56-TFSOP (0.240", 6.10mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Bus FET Exchange Switch
- Circuit:
- 12 x 2:2
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSSOP
SN74CBTLV16212GR FAQ
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5.How can I obtain technical support or documentation for SN74CBTLV16212GR?
For technical support, including SN74CBTLV16212GR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBTLV16212GR requirements.
6.How does Aetrix verify that SN74CBTLV16212GR is sourced from the original manufacturer or authorized distributors?
All SN74CBTLV16212GR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBTLV16212GR meets industry standards.
7.What is the process for return or replacement of SN74CBTLV16212GR?
All SN74CBTLV16212GR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTLV16212GR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBTLV16212GR part is unused and in its original packaging.
Return procedure for SN74CBTLV16212GR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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