Texas Instruments SN74CBTLV16292GR

Overview

SN74CBTLV16292GR from Texas Instruments is a 12-bit 1-of-2 high-speed FET multiplexer/demultiplexer with 4-Ω on-state resistance, rail-to-rail switching, and I_off partial-power-down support. It routes bidirectional data between port A and either B1 or B2 based on select (S) logic level, enabling dynamic signal path reconfiguration in memory and bus interface applications.

For engineers reviewing the SN74CBTLV16292GR datasheet, SN74CBTLV16292GR pinout, SN74CBTLV16292GR application, or SN74CBTLV16292GR equivalent, key selection criteria include make-before-break timing (≤2 ns), low propagation delay (0.15–0.25 ns), 2.3–3.6 V supply operation, and TSSOP-56 package compatibility with high-density PCB layouts.

Technical Context

This device implements a dual-port, 12-channel FET switch architecture with independent A/B1/B2 routing controlled by a single S input. Each channel features internal 500-Ω pulldown resistors to ground and supports bidirectional signal flow without direction control pins.

The I_off specification (10 µA max at V_CC = 0 V) ensures isolation during partial power-down, while latch-up performance exceeds 250 mA per JESD 17. Switching is rail-to-rail across the full 2.3–3.6 V V_CC range, with no level-shifting required between ports.

Key Specifications

Pinout & Package

TSSOP-56 (DGG) package: 12.0 mm × 4.4 mm × 1.2 mm body, 0.5 mm pitch, lead-free NiPdAu finish, MSL Level-1, RoHS compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 12-bit FET multiplexer applications.

Compared with SN74CBTLV16292GR, SN74CBTLV3861RGYR offers higher integration density but sacrifices RINT and pulldown features, while PI3CH480ELEX matches pin count and package but adds design overhead for power-down safety and termination.

Availability

SN74CBTLV16292GR is available at Aetrix Electronics and suitable for memory subsystems, PCIe backplane routing, JTAG test access, and FPGA I/O expansion requiring stable component supply, long-term lifecycle support, and RoHS-compliant TSSOP packaging.

Supply support for SN74CBTLV16292GR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in high-speed logic and interface solutions.

The SN74CBTLV16292GR belongs to TI's Widebus™ family of high-speed FET switches, designed specifically for low-latency, rail-to-rail signal routing in memory, bus, and test infrastructure applications.

FAQ

What is the maximum operating temperature range for the SN74CBTLV16292GR?

The SN74CBTLV16292GR is rated for operation from −40°C to +85°C ambient temperature. This range is validated across all electrical specifications including r_on, t_pd, and I_off, and aligns with industrial-grade requirements for embedded computing and communications equipment where thermal stability is critical. The TSSOP-56 package's θ_JA of 64°C/W supports reliable thermal dissipation within this envelope.

Does the SN74CBTLV16292GR support hot-swap or partial-power-down operation?

Yes, the SN74CBTLV16292GR fully supports partial-power-down via its I_off feature, which limits leakage to 10 µA max when V_CC = 0 V and any I/O is biased between 0 V and 3.6 V. This prevents damaging backflow current and maintains isolation - a key requirement for hot-plug modules, redundant power domains, and systems with staggered power sequencing. The SN74CBTLV16292GR datasheet explicitly validates this behavior per JESD 78.

What is the purpose of the RINT pin on the SN74CBTLV16292GR?

The RINT pin on the SN74CBTLV16292GR serves as a reference input that connects internally to either B1 or B2 depending on the S select state: when S = L, RINT → B2; when S = H, RINT → B1. It is intended for use in impedance-matched or bias-controlled configurations - for example, connecting to a termination voltage or reference source to stabilize switching thresholds in high-speed memory or bus applications. Unlike standard I/O pins, RINT has no driver circuitry and functions solely as a routed node.

Can the SN74CBTLV16292GR be used with 1.8-V logic interfaces?

No, the SN74CBTLV16292GR is not rated for 1.8 V operation. Its recommended V_CC range is 2.3 V to 3.6 V, and absolute maximum ratings specify −0.5 V to 4.6 V. At 1.8 V, VIH/VIL thresholds fall outside guaranteed logic levels (VIH min = 1.7 V at V_CC = 2.3 V), and r_on increases significantly beyond datasheet specs. For 1.8 V systems, consider TI's SN74CBTLV3861 or compatible low-voltage FET switches instead of the SN74CBTLV16292GR.

How does the make-before-break feature operate in the SN74CBTLV16292GR?

The SN74CBTLV16292GR guarantees a make-before-break window of 0–2 ns during S-input transitions, meaning the newly selected path (e.g., A→B2) closes before the previously active path (e.g., A→B1) opens. This eliminates momentary open-circuit conditions that could cause glitches or data corruption in synchronous bus environments. The timing is measured per JEDEC JESD68 and is independent of V_CC or temperature within the specified operating range - a verified behavior documented in the SN74CBTLV16292GR switching characteristics table.