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Home > Products > Integrated Circuits (ICs) > Logic > Signal Switches, Multiplexers, Decoders

Texas Instruments SN74CBTLV16800GR

Name: SN74CBTLV16800GR
Brand: Texas Instruments
SKU: SN74CBTLV16800GR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: SN74CBTLV16800GR

Manufacturer:: Texas Instruments

Category:: Signal Switches, Multiplexers, Decoders

Package:: 48-TFSOP (0.240", 6.10mm Width)

Datasheet:: SN74CBTLV16800GR.pdf

Description:: IC BUS SWITCH 10 X 1:1 48TSSOP

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Product details

Overview

SN74CBTLV16800GR from Texas Instruments is a low-voltage 20-bit FET bus switch with precharged B-port outputs, 5-Ω on-state resistance, rail-to-rail switching, and I_off support for partial-power-down operation. It operates from 2.3 V to 3.6 V and is used in hot-swap backplane interfaces and high-speed memory expansion subsystems.

For engineers reviewing the SN74CBTLV16800GR datasheet, SN74CBTLV16800GR pinout, SN74CBTLV16800GR application, or SN74CBTLV16800GR equivalent, key selection criteria include its dual 10-bit configurable switching architecture, BIASV-controlled precharge, propagation delay under 0.25 ns at 3.3 V, and TSSOP-48 package compatibility with live-insertion systems.

Technical Context

The SN74CBTLV16800GR implements two independent 10-bit FET bus switches, each controlled by a dedicated output-enable (OE) input. Its MOSFET-based switch topology enables rail-to-rail signal pass-through with minimal distortion and supports bidirectional data flow between A and B ports.

When OE is low, the corresponding 10-bit path connects A to B with typical on-resistance of 5 Ω at V_CC = 3 V. When OE is high, the B port is actively precharged to a user-supplied BIASV voltage (1.3 V to V_CC) via an internal ~10-kΩ equivalent resistor, suppressing noise during live insertion.

Key Specifications

Parameter	Value and Actual Design Meaning
V_CC Range	2.3 V to 3.6 V - Enables direct interface with 2.5 V and 3.3 V logic domains without level translation.
r_on (Typ)	5 Ω at V_CC = 3 V - Ensures sub-nanosecond propagation delay and minimal signal attenuation in high-speed buses.
t_pd (Max)	0.25 ns at V_CC = 3.3 V - Supports >1 GHz data rates in memory and interconnect applications.
I_off	10 µA at V_CC = 0 V - Prevents backflow current during partial power-down, protecting upstream drivers.
BIASV Range	1.3 V to V_CC - Allows precise precharge voltage tuning to match system reference levels and reduce ground bounce.
ESD Rating	2000-V HBM - Provides robust handling tolerance for board-level assembly and field service environments.
Package	TSSOP-48 (DGG) - 6.2 mm × 12.5 mm footprint with 0.5 mm pitch, optimized for dense PCB layouts.

Pinout & Package

TSSOP-48 (DGG) package: 12.5 mm × 6.2 mm body, 0.5 mm lead pitch, 1.2 mm max height, JEDEC MO-153 compliant.

Pin/Terminal	Circuit Role	Design Meaning
1A1–1A10, 2A1–2A10	A-side data inputs/outputs	First and second 10-bit input/output ports; bidirectional, rail-to-rail compatible.
1B1–1B10, 2B1–2B10	B-side data inputs/outputs	Corresponding B-side ports; internally precharged to BIASV when OE is high.
1OE, 2OE	Output-enable controls	Active-low enables for respective 10-bit sections; must be pulled up to V_CC for power-up safety.
BIASV	Bias voltage supply	User-supplied reference (1.3 V to V_CC) setting precharge level for all B-port terminals.
V_CC, GND	Power and ground	Dual V_CC/GND pairs (pins 23 & 35, 7 & 29) ensure low-impedance supply routing and noise reduction.

Key Features

Feature	Design Value
Precharged B-port outputs	Reduces live-insertion transients by holding B pins at stable BIASV instead of floating, eliminating ground bounce and false triggering.
5-Ω low on-resistance	Minimizes RC delay and signal degradation across 20-bit parallel paths, preserving edge integrity in DDR and PCI Express sideband links.
I_off protection	Blocks current flow when V_CC = 0 V, enabling safe insertion/removal of daughter cards into powered backplanes without disrupting host logic.
Rail-to-rail switching	Supports full-swing signals from GND to V_CC on both A and B ports, eliminating need for external biasing or level shifters.
Latch-up immunity	Exceeds 100 mA per JESD 78 Class II - ensures robust operation in noisy industrial and telecom environments.

Applications

Hot-Swap Backplane Interface	Memory Expansion Subsystem
Use Scenario: Inserting/removing line cards in a powered telecom shelf while maintaining uninterrupted data flow. IC Role / Device Role / Timing Role: Bidirectional 20-bit bus switch isolating card-side and backplane-side logic, with B-port precharge suppressing insertion noise. Use Value: Eliminates need for complex sequencing circuitry; enables zero-downtime upgrades using standard TSSOP-48 layout.	Use Scenario: Adding DIMM or LRDIMM modules to server motherboards with shared address/control buses. IC Role / Device Role / Timing Role: Low-latency 20-bit switch enabling dynamic routing of RAS/CAS/WE signals between controller and multiple memory ranks. Use Value: 0.25 ns t_pd preserves timing margins; 5 Ω r_on maintains signal fidelity at DDR4/5 speeds.
PCI Express Sideband Signal Routing	Industrial I/O Module Multiplexing
Use Scenario: Sharing SMBus, JTAG, or CLKREQ# lines across multiple PCIe slots in embedded computing platforms. IC Role / Device Role / Timing Role: Dual 10-bit switch configured as one 20-bit path, selectively connecting sideband signals to active slot controllers. Use Value: I_off prevents leakage when slots are unpowered; BIASV precharge avoids floating states during slot enumeration.	Use Scenario: Consolidating discrete sensor/actuator interfaces onto a single FPGA I/O bank in programmable logic controllers. IC Role / Device Role / Timing Role: 20-bit configurable switch routing analog monitoring, digital control, and status signals between field devices and processing unit. Use Value: Rail-to-rail operation supports mixed 2.5 V/3.3 V sensors; TSSOP-48 fits compact DIN-rail module footprints.

Hot-Swap Backplane Interface

Memory Expansion Subsystem

Use Scenario: Inserting/removing line cards in a powered telecom shelf while maintaining uninterrupted data flow.

IC Role / Device Role / Timing Role: Bidirectional 20-bit bus switch isolating card-side and backplane-side logic, with B-port precharge suppressing insertion noise.

Use Value: Eliminates need for complex sequencing circuitry; enables zero-downtime upgrades using standard TSSOP-48 layout.

Use Scenario: Adding DIMM or LRDIMM modules to server motherboards with shared address/control buses.

IC Role / Device Role / Timing Role: Low-latency 20-bit switch enabling dynamic routing of RAS/CAS/WE signals between controller and multiple memory ranks.

Use Value: 0.25 ns t_pd preserves timing margins; 5 Ω r_on maintains signal fidelity at DDR4/5 speeds.

PCI Express Sideband Signal Routing

Industrial I/O Module Multiplexing

Use Scenario: Sharing SMBus, JTAG, or CLKREQ# lines across multiple PCIe slots in embedded computing platforms.

IC Role / Device Role / Timing Role: Dual 10-bit switch configured as one 20-bit path, selectively connecting sideband signals to active slot controllers.

Use Value: I_off prevents leakage when slots are unpowered; BIASV precharge avoids floating states during slot enumeration.

Use Scenario: Consolidating discrete sensor/actuator interfaces onto a single FPGA I/O bank in programmable logic controllers.

IC Role / Device Role / Timing Role: 20-bit configurable switch routing analog monitoring, digital control, and status signals between field devices and processing unit.

Use Value: Rail-to-rail operation supports mixed 2.5 V/3.3 V sensors; TSSOP-48 fits compact DIN-rail module footprints.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FET bus switch applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74CBTLV3861PWR	10-bit (not 20-bit), same V_CC range and r_on, but no BIASV pin or precharge function.	Suitable only for non-live-insertion, lower-pin-count applications where B-port stabilization is not required.	Select when space or cost constraints eliminate need for 20-bit width and live-insertion support.
SN74CBT16210DGVR	20-bit, 3.3 V only, no I_off or BIASV; higher r_on (12 Ω typical) and slower t_pd (2.5 ns).	Applicable in static, non-hot-swap systems with relaxed timing and power-down requirements.	Choose only if legacy 3.3 V-only design forbids voltage scaling and live-insertion is absent.

Compared with SN74CBTLV3861PWR and SN74CBT16210DGVR, the SN74CBTLV16800GR uniquely combines 20-bit width, BIASV-controlled precharge, I_off-enabled partial power-down, and sub-0.3 ns propagation delay - making it the sole option for high-density, hot-pluggable, low-voltage bus isolation.

Availability

SN74CBTLV16800GR is available at Aetrix Electronics and suitable for hot-swap backplane interfaces, memory expansion subsystems, and PCIe sideband signal routing requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for SN74CBTLV16800GR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and communications markets.

The SN74CBTLV16800GR belongs to TI's Widebus™ family of high-speed bus switches, designed specifically for low-voltage, low-distortion, live-insertion-capable interconnect in telecom infrastructure and enterprise computing systems.

FAQ

What is the maximum operating temperature range for the SN74CBTLV16800GR?

The SN74CBTLV16800GR is fully specified for operation from –40°C to +85°C ambient temperature. This range is validated per TI's recommended operating conditions and supported across all electrical parameters including on-resistance, propagation delay, and I_off. The device uses a TSSOP-48 (DGG) package with JEDEC MO-153 compliance and Level-1 moisture sensitivity rating, ensuring reliable performance in industrial and telecom environments where thermal cycling occurs.

Does the SN74CBTLV16800GR require external pull-up resistors on its OE pins?

Yes, the SN74CBTLV16800GR requires external pull-up resistors on both 1OE and 2OE pins to ensure a defined high state during power-up and power-down sequences. TI specifies that OE should be tied to V_CC through a pullup resistor, with minimum value determined by the current-sinking capability of the driving source. This prevents undefined switch states and guarantees high-impedance isolation before system initialization completes - a critical requirement for hot-swap safety in backplane designs using the SN74CBTLV16800GR.

Can the BIASV pin of the SN74CBTLV16800GR be left unconnected?

No, the BIASV pin of the SN74CBTLV16800GR must be actively driven within 1.3 V to V_CC - it cannot be left floating or unconnected. When OE is high, the B-port outputs are precharged through an internal ~10-kΩ equivalent resistor to the BIASV voltage. An open or undefined BIASV causes unpredictable precharge levels, leading to signal distortion, increased ground bounce, or false logic transitions during live insertion. TI's datasheet explicitly defines BIASV as a user-supplied bias voltage, not an optional feature.

Is the SN74CBTLV16800GR pin-compatible with other members of the Widebus™ family?

No, the SN74CBTLV16800GR is not pin-compatible with other Widebus™ devices such as SN74CBTLV3861 or SN74CBT16210. Its TSSOP-48 (DGG) package contains 48 pins with unique assignments including dual OE controls, dedicated BIASV, and split power/ground distribution. Pinouts differ significantly across bit-widths and feature sets - for example, SN74CBTLV3861PWR uses a 24-pin TSSOP and lacks BIASV entirely. Direct substitution would require PCB redesign; the SN74CBTLV16800GR must be laid out using its specific DGG mechanical drawing.

What is the typical on-state resistance (r_on) of the SN74CBTLV16800GR at 2.5 V supply?

The typical on-state resistance (r_on) of the SN74CBTLV16800GR is 5 Ω at V_CC = 2.5 V, measured with VI = 0 V and II = 24 mA per switch. This value is confirmed in TI's Electrical Characteristics table and applies uniformly across all 20 channels. At this low r_on, the device achieves minimal voltage drop and signal attenuation - critical for maintaining timing margins in high-speed parallel buses where the SN74CBTLV16800GR is deployed.

SN74CBTLV16800GR Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: 74CBTLV

Package/Case:: 48-TFSOP (0.240", 6.10mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Active

Type:: Bus Switch

Circuit:: 10 x 1:1

Independent Circuits:: 2

Current - Output High, Low:: -

Voltage Supply Source:: Single Supply

Voltage - Supply:: 2.3V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 48-TSSOP

SN74CBTLV16800GR FAQ

1.How can I place an order for SN74CBTLV16800GR through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74CBTLV16800GR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74CBTLV16800GR reliable?

The price and inventory of SN74CBTLV16800GR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBTLV16800GR is usually 5 days.

3.What payment methods are accepted for SN74CBTLV16800GR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74CBTLV16800GR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SN74CBTLV16800GR?

SN74CBTLV16800GR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SN74CBTLV16800GR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74CBTLV16800GR?

For technical support, including SN74CBTLV16800GR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBTLV16800GR requirements.

6.How does Aetrix verify that SN74CBTLV16800GR is sourced from the original manufacturer or authorized distributors?

All SN74CBTLV16800GR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBTLV16800GR meets industry standards.

7.What is the process for return or replacement of SN74CBTLV16800GR?

All SN74CBTLV16800GR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTLV16800GR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74CBTLV16800GR part is unused and in its original packaging.

Return procedure for SN74CBTLV16800GR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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