Texas Instruments SN74CBTLV1G125C6
- Part No.:
- SN74CBTLV1G125C6
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- -
- Datasheet:
-
SN74CBTLV1G125C6.pdf
- Description:
- SN74CBTLV1G125DCK6
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74CBTLV1G125C6 from Texas Instruments is a low-voltage single FET bus switch with 5-Ω on-state resistance, rail-to-rail signal switching, and Ioff support for partial-power-down operation. It functions as a bidirectional, OE-controlled analog switch in high-speed data paths, enabling/disabling signal flow between A and B ports in compact logic-level interfaces.
For engineers reviewing the SN74CBTLV1G125C6 datasheet, SN74CBTLV1G125C6 pinout, SN74CBTLV1G125C6 application, or SN74CBTLV1G125C6 equivalent, this device is selected for low-latency, low-capacitance signal routing in space-constrained 2.3–3.6 V systems requiring power-aware isolation and minimal propagation delay (0.15 ns typical).
Technical Context
The SN74CBTLV1G125C6 implements a single-channel, NMOS-based transmission gate architecture with no internal level-shifting circuitry. Its control logic is positive-true: OE low enables conduction (A ↔ B), OE high places both ports in high-impedance state.
It operates across 2.3 V to 3.6 V supply range with guaranteed performance at 2.5 V and 3.3 V. The device supports rail-to-rail analog/digital signal pass-through and maintains <7 pF off-state capacitance (Cio(OFF)) to minimize loading on high-speed buses.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| On-state resistance (ron) | 5 Ω typical at VCC = 3 V - ensures minimal voltage drop and signal distortion for ≤64 mA channel current. |
| Propagation delay (tpd) | 0.15 ns typical at VCC = 3.3 V - enables sub-nanosecond timing integrity in DDR, PCIe, or USB signal routing. |
| Off-state capacitance (Cio(OFF)) | 7 pF maximum at VO = 3 V - reduces crosstalk and preserves signal edge rate in dense PCB layouts. |
| Ioff leakage | 10 µA maximum at VCC = 0 V - prevents backflow current during partial power-down, protecting powered subsystems. |
| Supply voltage range | 2.3 V to 3.6 V - compatible with modern low-voltage I/O standards including LVTTL, LVCMOS, and sub-3.3 V ASIC interfaces. |
| Input capacitance (Ci) | 2.5 pF typical - minimizes driver loading and simplifies termination design for high-frequency control signals. |
| Enable/disable time (ten/tdis) | 1–4 ns typical - supports fast dynamic bus arbitration without glitches or metastability. |
Pinout & Package
SOT-23 (DBV) 5-pin plastic package, 1.45 mm max height, JEDEC MO-178 compliant, footprint-compatible with industry-standard SOT-23 land patterns.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 - OE | Output-enable control input | Active-low logic signal; must be pulled high via external resistor during power-up/down to guarantee high-Z state. |
| 2 - GND | Ground reference | Primary return path for switch current and control logic; requires low-inductance connection to system ground plane. |
| 3 - A | Data port A terminal | Bidirectional signal node; connects to upstream source (e.g., processor GPIO or memory controller). |
| 4 - B | Data port B terminal | Bidirectional signal node; connects to downstream load (e.g., peripheral interface or level translator). |
| 5 - VCC | Power supply | Supplies bias for internal FET gate drive; must be decoupled locally with ≥0.1 µF ceramic capacitor. |
Key Features
| Feature | Design Value |
|---|---|
| 5-Ω low on-resistance | Preserves signal integrity for high-speed digital and analog signals up to 200 MHz without significant attenuation. |
| Ioff partial-power-down protection | Enables safe integration into mixed-voltage systems where one side may be unpowered while the other remains active. |
| Rail-to-rail signal handling | Supports full-swing signals from GND to VCC, eliminating need for external level shifters in same-supply domain interconnects. |
| Sub-0.25 ns propagation delay | Maintains timing margins in high-frequency clock distribution, address/data multiplexing, and hot-swap control paths. |
| 7 pF off-state capacitance | Reduces capacitive loading on shared buses, improving rise/fall times and reducing EMI coupling in multi-drop topologies. |
Applications
| PCIe Gen1/Gen2 Reference Clock Switching | USB 2.0 Data Line Isolation |
|---|---|
Use Scenario: Selecting between two reference clock sources for FPGA or SoC PLL input during boot or reconfiguration. IC Role / Device Role / Timing Role: Bidirectional, low-latency clock path selector with zero added jitter and no duty-cycle distortion. Use Value: Enables glitch-free clock source switchover while maintaining <0.15 ns skew and preserving phase alignment critical for SerDes lock stability. |
Use Scenario: Isolating USB D+/D− lines during device insertion/removal to prevent bus contention and host enumeration errors. IC Role / Device Role / Timing Role: High-speed analog switch controlled by microcontroller GPIO to gate USB data traffic before VBUS presence detection. Use Value: Eliminates need for mechanical switches or complex USB transceivers; supports hot-plug compliance with <4 ns enable/disable response. |
| Low-Voltage Memory Address Multiplexing | FPGA I/O Expansion Bus Gating |
Use Scenario: Sharing a single address/data bus between two low-power SRAM banks in battery-operated IoT nodes. IC Role / Device Role / Timing Role: Low-resistance, low-capacitance bus switch enabling time-multiplexed access without signal degradation. Use Value: Reduces component count vs. dual-port RAM; maintains 100+ MHz address strobe timing with <5 Ω ron and <7 pF Cio(OFF). |
Use Scenario: Dynamically enabling/disabling I/O expansion headers on industrial FPGA carrier boards based on peripheral presence detection. IC Role / Device Role / Timing Role: Signal isolation gate for parallel GPIO, SPI, or I²C expansion buses under firmware control. Use Value: Prevents floating inputs and leakage paths when peripherals are absent; supports seamless plug-and-play with no layout changes required. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CB3Q1G125DBVR | Lower ron (2.5 Ω typ), higher ICC (20 µA), supports 1.65–3.6 V range | Better for ultra-low-loss signal paths but consumes more quiescent current | Select when minimizing voltage drop at >100 mA loads outweighs static power budget constraints. |
| NC7SZ125P5X | Higher ron (12 Ω typ), no Ioff support, 1.65–5.5 V range | Lacks partial-power-down protection; suitable only for fully powered systems | Choose for cost-sensitive designs where full-system power cycling is guaranteed and rail-to-rail switching is not required. |
Compared with SN74CBTLV1G125C6, SN74CB3Q1G125DBVR delivers lower on-resistance at the expense of higher supply current and tighter voltage margin, while NC7SZ125P5X offers broader voltage compatibility but sacrifices Ioff safety and signal fidelity-making SN74CBTLV1G125C6 optimal for robust, low-power, mixed-domain isolation.
Availability
SN74CBTLV1G125C6 is available at Aetrix Electronics and suitable for PCIe clock routing, USB 2.0 isolation, and FPGA I/O expansion applications requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for SN74CBTLV1G125C6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on reliability, precision, and energy efficiency across industrial, automotive, and communications markets.
The SN74CBTLV1G125C6 belongs to TI's CBTLV (low-voltage FET bus switch) product line, engineered specifically for high-speed, low-power signal gating in portable, space-constrained, and mixed-supply electronic systems.
FAQ
What is the recommended pull-up resistor value for the OE pin of SN74CBTLV1G125C6 during power-up?
The minimum pull-up resistor value for the OE pin of SN74CBTLV1G125C6 is determined by the current-sinking capability of the driving source. TI specifies that OE must be tied to VCC through a pull-up resistor to ensure high-impedance state during power transitions. For standard CMOS drivers with 8 mA sink capability, a 10 kΩ resistor is commonly used; values between 4.7 kΩ and 100 kΩ maintain noise immunity while limiting current draw. Always verify against the actual driver's IOL rating per the SN74CBTLV1G125C6 datasheet Section 7.3.
Does SN74CBTLV1G125C6 support bidirectional signal flow between A and B ports?
Yes, SN74CBTLV1G125C6 supports fully bidirectional signal flow: when OE is low, the internal FET switch creates a symmetric, low-resistance path between A and B terminals, allowing signals to pass in either direction without polarity inversion or level translation. This behavior is confirmed in the functional table and simplified schematic of the SN74CBTLV1G125C6 datasheet, and applies across the full 2.3–3.6 V supply range with rail-to-rail voltage handling.
Can SN74CBTLV1G125C6 be used in 1.8 V systems?
No, SN74CBTLV1G125C6 is not rated for 1.8 V operation. Its recommended operating supply voltage range is 2.3 V to 3.6 V, with absolute maximum VCC of 4.6 V and minimum functional VCC of 2.3 V. At 1.8 V, the internal FET gate drive is insufficient to achieve specified ron or switching speed; functionality is not guaranteed. For 1.8 V systems, consider TI's SN74CBTLV3125 or ON Semiconductor's NL17SZ125 as alternatives explicitly characterized down to 1.65 V.
What is the thermal resistance (θJA) of SN74CBTLV1G125C6 in the DBV package?
The junction-to-ambient thermal resistance (θJA) of SN74CBTLV1G125C6 in the SOT-23 (DBV) package is 206 °C/W, as specified in the Absolute Maximum Ratings table of the official SN74CBTLV1G125C6 datasheet. This value assumes standard JEDEC test conditions (single-layer board, 1 in² copper pad). Actual thermal performance improves with enhanced PCB copper area, thermal vias, or airflow, but derating is required above 85°C ambient per TI's recommended operating conditions.
Is SN74CBTLV1G125C6 pin-compatible with SN74CBTLV1G125DBVR or SN74CBTLV1G125DCKR?
Yes, SN74CBTLV1G125C6 shares identical pinout (OE, GND, A, B, VCC) and function with SN74CBTLV1G125DBVR (SOT-23) and SN74CBTLV1G125DCKR (SC-70); all three variants use the same logic diagram, functional table, and electrical specifications. However, physical package dimensions differ: DBV is 2.92 × 1.62 mm, DCK is 2.0 × 1.25 mm. Layout adaptation is required when substituting between packages, though schematic connectivity remains unchanged.
SN74CBTLV1G125C6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBTLV
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Type:
- Bus Switch
- Circuit:
- 1 x 1:1
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- -
SN74CBTLV1G125C6 FAQ
1.How can I place an order for SN74CBTLV1G125C6 through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CBTLV1G125C6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74CBTLV1G125C6 reliable?
The price and inventory of SN74CBTLV1G125C6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBTLV1G125C6 is usually 5 days.
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5.How can I obtain technical support or documentation for SN74CBTLV1G125C6?
For technical support, including SN74CBTLV1G125C6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBTLV1G125C6 requirements.
6.How does Aetrix verify that SN74CBTLV1G125C6 is sourced from the original manufacturer or authorized distributors?
All SN74CBTLV1G125C6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBTLV1G125C6 meets industry standards.
7.What is the process for return or replacement of SN74CBTLV1G125C6?
All SN74CBTLV1G125C6 units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTLV1G125C6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBTLV1G125C6 part is unused and in its original packaging.
Return procedure for SN74CBTLV1G125C6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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