Texas Instruments SN74CBTLV3125DBQR
- Part No.:
- SN74CBTLV3125DBQR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 16-SSOP (0.154", 3.90mm Width)
- Datasheet:
-
SN74CBTLV3125DBQR.pdf
- Description:
- IC BUS SWITCH 1 X 1:1 16SSOP
- Quantity:
- Payment:

- Shipping:

Inventory:2,277
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Product details
Overview
SN74CBTLV3125DBQR from Texas Instruments is a low-voltage quadruple FET bus switch with independent 5Ω bidirectional switches, rail-to-rail signal handling (0–3.6 V), and Ioff partial-power-down protection. It operates from 2.3 V to 3.6 V, supports −40°C to +85°C ambient, and is used in protocol isolation for JTAG/SPI/GPIO in enterprise computing and wired networking systems.
For engineers reviewing the SN74CBTLV3125DBQR datasheet, SN74CBTLV3125DBQR pinout, SN74CBTLV3125DBQR application, or SN74CBTLV3125DBQR equivalent, this page delivers verified electrical specs, SSOP-16 package details, functional mode truth table, real-world isolation use cases, and two validated alternative parts for signal routing and hot-swap interface design.
Technical Context
The SN74CBTLV3125DBQR implements four independent NMOS transmission-gate switches, each controlled by an active-high OE input. When OE is low, the A–B path conducts with ≤8 Ω on-resistance at 3.3 V; when OE is high, the switch enters high-impedance state with <7 pF off-capacitance and <10 µA Ioff leakage at VCC = 0 V.
Its architecture enables rail-to-rail analog/digital signal switching without level translation, while Ioff ensures no backflow current during partial power-down-critical for live-insertion systems. The device meets JESD78 Class II latch-up immunity (>100 mA) and supports 0.15 ns propagation delay at 3.3 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 2.3 V to 3.6 V - Enables direct interface with 2.5 V/3.3 V logic families without level shifters. |
| On-State Resistance (ron) | 5 Ω (typ) at 3.3 V, 64 mA - Ensures minimal voltage drop and signal attenuation across switched paths. |
| Ioff Leakage | 10 µA max at VCC = 0 V - Prevents damaging back-current during system power sequencing or hot-swap events. |
| Propagation Delay (tpd) | 0.25 ns (typ) at 3.3 V - Supports high-speed digital signal routing up to >1 GHz effective bandwidth. |
| Off-Capacitance (Cio) | 7 pF max - Minimizes capacitive loading and crosstalk on isolated data lines. |
| Operating Temperature | −40°C to +85°C - Qualified for industrial and enterprise-grade embedded applications. |
| ESD Rating (HBM) | ±2000 V - Provides robust handling margin during PCB assembly and field service. |
Pinout & Package
SN74CBTLV3125DBQR is housed in a 16-pin SSOP (DBQ) package measuring 4.90 mm × 3.90 mm, with 0.65 mm lead pitch and exposed pad not present. Pin 9 is NC (no internal connection); pins 1, 5, 12, and 15 are dedicated OE inputs; pins 2/4, 6/7, 10/11, and 13/14 form four independent A/B bidirectional pairs; pin 8 is GND; pin 16 is VCC.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE, 2OE, 3OE, 4OE (Pins 1, 5, 12, 15) | Active-high enable control | Drives corresponding switch ON (low) or OFF (high); requires pullup to VCC for power-up safety. |
| 1A/1B, 2A/2B, 3A/3B, 4A/4B (Pins 2/4, 6/7, 10/11, 13/14) | Bidirectional signal path | Passes analog/digital signals in either direction with rail-to-rail swing and <8 Ω resistance. |
| GND (Pin 8) | Ground reference | Common return for all internal FET sources and substrate; must be low-impedance plane-connected. |
| VCC (Pin 16) | Power supply | Supplies bias for all four switches; requires local 0.1 µF ceramic decoupling capacitor. |
| NC (Pin 9) | No internal connection | Not bonded; must remain unconnected on PCB to avoid parasitic coupling or EMI. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail switching | Supports full 0–3.6 V signal swing on all I/O ports without distortion or clipping. |
| Ioff partial-power-down | Blocks current flow between powered and unpowered domains, enabling safe hot-swap operation. |
| 5 Ω low on-resistance | Reduces insertion loss and maintains signal integrity for high-speed buses like SPI clock/data lines. |
| Independent channel control | Four separate OE inputs allow selective isolation of JTAG TDI/TDO, SPI MOSI/MISO, or GPIO groups. |
| Latch-up immunity | Exceeds 100 mA per JESD78 Class II - eliminates risk of destructive latch-up in noisy environments. |
Applications
| Protocol Isolation | Hot-Swap Backplane Interface |
|---|---|
|
Use Scenario: Isolating JTAG debug signals between host processor and multiple target ICs in a server blade. IC Role / Device Role / Timing Role: Bidirectional signal gate that enables/disables TCK/TMS/TDI/TDO paths under software control. Use Value: Eliminates need for manual jumpering or external multiplexers; supports in-system programming without power cycling. |
Use Scenario: Enabling live insertion of line cards into a telecom chassis with mixed 3.3 V and unpowered slots. IC Role / Device Role / Timing Role: Signal isolator that blocks backfeed from powered backplane to unpowered card during insertion. Use Value: Prevents damage from Ioff-violating currents; allows seamless firmware update and field maintenance. |
| Multi-Processor GPIO Sharing | SPI Bus Multiplexing |
|
Use Scenario: Sharing a single set of GPIO pins among three microcontrollers in an industrial PLC controller. IC Role / Device Role / Timing Role: Low-latency bidirectional switch enabling time-division access to shared status/control lines. Use Value: Reduces pin count and PCB layer count vs. discrete logic; maintains signal fidelity up to 100 MHz. |
Use Scenario: Routing SPI signals from one master MCU to four different flash memory devices on a storage module. IC Role / Device Role / Timing Role: Channel-selectable bus switch that connects MOSI/MISO/SCLK/SS to selected peripheral only. Use Value: Avoids signal contention and reflections; supports simultaneous read/write operations via time-sliced access. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FET bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTLV3245DBQR | Octal (8-channel) configuration, same 5 Ω ron and Ioff spec, but larger 24-pin SSOP package. | Used where higher channel density is required; occupies more board area and consumes more routing layers. | Select when consolidating eight signal paths; verify layout space and thermal derating for 24-pin footprint. |
| SN74LVC1G3157DCKR | Single-channel SPDT switch, 6 Ω ron, supports 1.65–5.5 V supply, smaller SC70-6 package. | Applicable for point-to-point isolation rather than quad-bus routing; lacks independent OE per channel. | Choose for compact, low-cost isolation of individual lines (e.g., reset or interrupt signals) where quad control is unnecessary. |
Compared with SN74CBTLV3125DBQR, SN74CBTLV3245DBQR offers double channel count at the cost of footprint and routing complexity, while SN74LVC1G3157DCKR trades channel independence and density for miniaturization and wider voltage range-making each suitable for distinct partitioning strategies in system-level signal management.
Availability
SN74CBTLV3125DBQR is available at Aetrix Electronics and suitable for enterprise computing, wired networking, and building automation applications requiring stable component supply, long-term industrial lifecycle support, and RoHS-compliant sourcing.
Supply support for SN74CBTLV3125DBQR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in high-reliability components.
The SN74CBTLV3125DBQR belongs to TI's CBTLV low-voltage bus switch family, engineered for signal integrity preservation, hot-swap resilience, and seamless integration into high-density digital systems.
FAQ
What is the maximum operating temperature for SN74CBTLV3125DBQR?
The SN74CBTLV3125DBQR is rated for operation from −40°C to +85°C ambient temperature. This specification applies specifically to the DBQ (SSOP-16) package variant, as confirmed in TI's official orderable addendum and thermal characterization data. Operation beyond +85°C may cause parametric drift or reliability degradation.
Does SN74CBTLV3125DBQR support 1.8 V logic levels?
Yes, SN74CBTLV3125DBQR supports 1.8 V–compatible control thresholds: VIH is 0.7 V min at VCC = 2.3–2.7 V, and VIL is 0.8 V max at VCC = 2.7–3.6 V. Its rail-to-rail I/O allows 1.8 V signals to pass unattenuated when VCC = 3.3 V, making it suitable for interfacing 1.8 V peripherals with 3.3 V hosts.
Is SN74CBTLV3125DBQR pin-compatible with other packages in the same family?
No - SN74CBTLV3125DBQR uses a 16-pin SSOP (DBQ) footprint with NC on pin 9, whereas D/DGV/PW/RGY variants use 14-pin layouts and different pinouts. The DBQ package has unique pin mapping (e.g., VCC on pin 16, GND on pin 8), and mechanical dimensions (4.90 mm × 3.90 mm) differ from SOIC or TVSOP. PCB redesign is required for package substitution.
How does the Ioff feature protect SN74CBTLV3125DBQR during partial power-down?
The Ioff feature limits leakage current to ≤10 µA when VCC = 0 V and any I/O is biased between 0–3.6 V. This prevents reverse current flow from powered downstream circuits into the unpowered SN74CBTLV3125DBQR, avoiding latch-up, data corruption, or damage - a critical safeguard in hot-swap and modular power architectures.
What is the typical on-state resistance of SN74CBTLV3125DBQR at 3.3 V supply?
The typical on-state resistance (ron) of SN74CBTLV3125DBQR is 5 Ω at VCC = 3.3 V and II = 64 mA, with a maximum of 7 Ω under those conditions. This value is measured between A and B terminals with the lower voltage terminal defining the reference, ensuring consistent low-loss performance across all four channels.
SN74CBTLV3125DBQR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBTLV
- Package/Case:
- 16-SSOP (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Bus Switch
- Circuit:
- 1 x 1:1
- Independent Circuits:
- 4
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SSOP
SN74CBTLV3125DBQR FAQ
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For technical support, including SN74CBTLV3125DBQR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBTLV3125DBQR requirements.
6.How does Aetrix verify that SN74CBTLV3125DBQR is sourced from the original manufacturer or authorized distributors?
All SN74CBTLV3125DBQR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBTLV3125DBQR meets industry standards.
7.What is the process for return or replacement of SN74CBTLV3125DBQR?
All SN74CBTLV3125DBQR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTLV3125DBQR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBTLV3125DBQR part is unused and in its original packaging.
Return procedure for SN74CBTLV3125DBQR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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