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Texas Instruments SN74CBTLV3125DR
- Part No.:
- SN74CBTLV3125DR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 14-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
SN74CBTLV3125DR.pdf
- Description:
- IC BUS SWITCH 1 X 1:1 14SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:365
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Product details
Overview
SN74CBTLV3125DR from Texas Instruments is a low-voltage quadruple FET bus switch with independent 5Ω on-state resistance per channel, rail-to-rail signal switching (0 V to VCC), and Ioff partial-power-down protection. It operates from 2.3 V to 3.6 V, supports −40°C to +85°C ambient, and is used for protocol isolation (e.g., JTAG, SPI) in enterprise computing and wired networking systems.
For engineers reviewing the SN74CBTLV3125DR datasheet, SN74CBTLV3125DR pinout, SN74CBTLV3125DR application, or SN74CBTLV3125DR equivalent, key selection criteria include on-resistance stability across voltage range, guaranteed Ioff leakage (<10 µA at VCC = 0), OE-controlled high-impedance state during power sequencing, and SOIC-14 package compatibility with legacy board layouts.
Technical Context
The SN74CBTLV3125DR implements four independent bilateral analog switches using NMOS pass transistors with no body diode conduction path, enabling true rail-to-rail bidirectional signal routing. Each channel is controlled by a dedicated active-high output-enable (OE) input, and the device features no internal level-shifting-signal integrity is preserved across the full 0 V to VCC range.
Its Ioff specification ensures sub-10 µA back-current flow when VCC = 0 V and any I/O port is biased between 0 V and 3.6 V, satisfying JEDEC JESD78 Class II latch-up immunity (>100 mA). Thermal performance is characterized for SOIC (D) package with RθJA = 123.0°C/W.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| On-state resistance (ron) | 5 Ω typical at VCC = 2.5 V, 64 mA - enables <50 mV voltage drop under full-load signal conditions |
| Supply voltage range | 2.3 V to 3.6 V - compatible with 2.5 V and 3.3 V logic domains without level shifters |
| Ioff leakage current | ≤10 µA at VCC = 0 V, VI/O = 0–3.6 V - prevents damaging backflow during hot-swap or partial power-down |
| Propagation delay (tpd) | 0.25 ns typical at VCC = 3.3 V - supports >1 GHz signal bandwidth with minimal timing skew |
| Operating temperature | −40°C to +85°C - qualified for industrial and enterprise infrastructure environments |
| ESD rating (HBM) | ±2000 V - meets standard handling requirements for automated assembly and field service |
| Input capacitance (Ci) | 2.5 pF - minimizes capacitive loading on high-speed control lines (e.g., OE) |
Pinout & Package
SN74CBTLV3125DR is packaged in a 14-pin SOIC (D) with 8.65 mm × 3.91 mm body size and standard 1.27 mm pitch. Pin 1 is top-left corner, pin 14 is top-right corner, with GND (pin 7) and VCC (pin 8) centrally located for optimal decoupling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A, 1B, 2A, 2B, 3A, 3B, 4A, 4B | I/O channel terminals | Bidirectional signal paths; each pair forms one switch channel with no polarity restriction |
| 1OE, 2OE, 3OE, 4OE | Active-high enable inputs | Asserting high disables corresponding A–B path; OE must be pulled to VCC or GND to avoid floating states |
| VCC | Power supply | Single 2.3–3.6 V supply powers all four channels and internal logic; requires local 0.1 µF bypass capacitor |
| GND | Ground reference | Common return for all signals and supply; must connect to solid ground plane to minimize noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail analog switching | Supports 0 V to VCC signal swing on all I/O ports - preserves full logic high/low margins without clipping |
| Independent per-channel OE control | Enables selective isolation of JTAG, SPI, or GPIO lines without affecting other system buses |
| Ioff partial-power-down protection | Guarantees <10 µA leakage when unpowered - eliminates need for external power sequencing in hot-swap designs |
| Low 5 Ω on-resistance | Minimizes insertion loss and distortion for high-speed digital and low-voltage analog signals up to 100 MHz |
| JEDEC Class II latch-up immunity | Withstands >100 mA transient current - ensures robust operation in noisy industrial environments |
Applications
| Server Backplane Signal Routing | JTAG Debug Isolation |
|---|---|
Use Scenario: Isolating PCIe, SMBus, or management interface signals between CPU and peripheral modules in 1U/2U rack servers. IC Role / Device Role / Timing Role: Bidirectional bus switch providing dynamic signal path enable/disable under BMC or firmware control. Use Value: Enables safe firmware updates and hot-plug diagnostics without disrupting adjacent lanes or requiring full system reset. | Use Scenario: Segregating JTAG TDI/TDO/TCK/TMS lines between host processor and multiple FPGA or ASIC targets on a shared debug header. IC Role / Device Role / Timing Role: Protocol-selective analog gate preventing cross-talk and contention during multi-device boundary scan. Use Value: Eliminates need for manual jumper configuration or external multiplexers while maintaining IEEE 1149.1 timing compliance. |
| SPI Flash Memory Multiplexing | Industrial I/O Signal Conditioning |
Use Scenario: Sharing a single SPI controller among multiple flash memory devices (e.g., boot ROM, configuration EEPROM, firmware update storage) in network switches. IC Role / Device Role / Timing Role: Low-latency, low-capacitance signal switch enabling time-multiplexed access without clock stretching or added propagation delay. Use Value: Reduces PCB layer count and BOM cost versus discrete MOSFET solutions while preserving 25 MHz SPI timing margins. | Use Scenario: Protecting microcontroller GPIO pins from overvoltage transients in building automation controllers interfacing with 24 V sensor/actuator circuits. IC Role / Device Role / Timing Role: High-impedance isolation barrier activated during MCU reset or brown-out events. Use Value: Prevents latch-up or damage to 3.3 V I/O structures when external 24 V signals are present during power transitions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FET bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTLV3245DR | Octal (8-channel) configuration, same 5 Ω ron and Ioff spec, but requires two OE pins controlling four channels each | Better suited for dense data bus isolation (e.g., parallel address/data lines); higher pin count and layout footprint | Select when consolidating multiple SN74CBTLV3125DR functions into one IC to reduce component count and routing complexity |
| TS3A24159DGSR | Lower 0.9 Ω ron at 3.3 V, dual SPDT topology, supports 0.8–4.8 V supply, but lacks Ioff spec and has higher 15 pF Cio(OFF) | Preferred for ultra-low-loss analog switching (e.g., audio, sensor front-end); not rated for partial-power-down use cases | Choose only if on-resistance is critical and power sequencing is fully controlled; verify absence of Ioff requirement in target system |
Compared with SN74CBTLV3125DR, SN74CBTLV3245DR offers higher channel density at identical performance per channel, while TS3A24159DGSR delivers lower ron but sacrifices Ioff protection and introduces higher off-capacitance-making SN74CBTLV3125DR the optimal choice for industrial hot-swap and enterprise server isolation where power-domain independence is mandatory.
Availability
SN74CBTLV3125DR is available at Aetrix Electronics and suitable for enterprise computing, wired networking, and building automation applications requiring stable component supply, long-term industrial lifecycle support, and SOIC-14 footprint compatibility.
Supply support for SN74CBTLV3125DR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and communications markets since 1930.
The SN74CBTLV3125DR belongs to TI's CBTLV (CrossBar Transistor Logic Very-Low-Voltage) family, engineered specifically for high-speed, low-distortion signal routing in mixed-voltage systems where power sequencing constraints and signal integrity are critical.
FAQ
What is the maximum continuous current rating per channel for SN74CBTLV3125DR?
The SN74CBTLV3125DR supports a continuous channel current of 128 mA per switch, verified across the full operating temperature range (−40°C to +85°C) and supply voltage range (2.3 V to 3.6 V). This rating applies to both A→B and B→A directions and is defined under steady-state DC conditions with proper PCB thermal relief.
Does SN74CBTLV3125DR support operation at 2.5 V supply voltage?
Yes, SN74CBTLV3125DR is fully specified for 2.5 V operation: recommended VCC range includes 2.3 V minimum, and electrical characteristics such as 5 Ω typical on-resistance, 0.15 ns propagation delay, and Ioff ≤10 µA are all validated at VCC = 2.5 V per TI SCDS037K datasheet Section 5.5.
How should unused OE pins be handled on SN74CBTLV3125DR?
All unused OE pins on SN74CBTLV3125DR must be tied to either VCC or GND to prevent floating states that could cause unintended channel conduction. TI recommends pullup resistors to VCC (minimum value determined by driver sink capability) to ensure default high-impedance mode during power-up, aligning with functional safety requirements in enterprise systems.
Is SN74CBTLV3125DR compatible with 1.8 V logic control inputs?
Yes, SN74CBTLV3125DR accepts 1.8 V as a valid high-level control input (VIH) when VCC = 2.3 V to 2.7 V (min VIH = 1.7 V), and remains compatible at VCC = 2.7 V to 3.6 V (min VIH = 2.0 V). This allows direct interfacing with 1.8 V GPIOs without level-shifting circuitry in mixed-voltage designs.
What is the thermal resistance (RθJA) of SN74CBTLV3125DR in its SOIC package?
The SN74CBTLV3125DR in SOIC (D) package has a junction-to-ambient thermal resistance (RθJA) of 123.0°C/W, measured under standard JEDEC test conditions (single-layer copper, 1 in² pad). This value assumes proper PCB layout with thermal vias and adequate copper pour to sustain continuous 128 mA per channel at +85°C ambient.
SN74CBTLV3125DR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBTLV
- Package/Case:
- 14-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Bus Switch
- Circuit:
- 1 x 1:1
- Independent Circuits:
- 4
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 14-SOIC
SN74CBTLV3125DR FAQ
1.How can I place an order for SN74CBTLV3125DR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CBTLV3125DR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74CBTLV3125DR reliable?
The price and inventory of SN74CBTLV3125DR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBTLV3125DR is usually 5 days.
3.What payment methods are accepted for SN74CBTLV3125DR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74CBTLV3125DR transactions.
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4.How is shipping managed for SN74CBTLV3125DR?
SN74CBTLV3125DR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74CBTLV3125DR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74CBTLV3125DR?
For technical support, including SN74CBTLV3125DR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBTLV3125DR requirements.
6.How does Aetrix verify that SN74CBTLV3125DR is sourced from the original manufacturer or authorized distributors?
All SN74CBTLV3125DR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBTLV3125DR meets industry standards.
7.What is the process for return or replacement of SN74CBTLV3125DR?
All SN74CBTLV3125DR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTLV3125DR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBTLV3125DR part is unused and in its original packaging.
Return procedure for SN74CBTLV3125DR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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