My Inquiry
My Account
Texas Instruments SN74CBTLV3125RGYR
- Part No.:
- SN74CBTLV3125RGYR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 14-VFQFN Exposed Pad
- Datasheet:
-
SN74CBTLV3125RGYR.pdf
- Description:
- IC BUS SWITCH 1 X 1:1 14VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,847
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SN74CBTLV3125RGYR from Texas Instruments is a low-voltage quadruple FET bus switch with independent 5Ω on-state resistance, rail-to-rail signal switching, and Ioff partial-power-down support. It operates from 2.3V to 3.6V, delivers sub-0.3ns propagation delay at 3.3V, and isolates ports during power-off-enabling hot-swap isolation in JTAG/SPI signal routing applications.
For engineers reviewing the SN74CBTLV3125RGYR datasheet, SN74CBTLV3125RGYR pinout, SN74CBTLV3125RGYR application, or SN74CBTLV3125RGYR equivalent, this page provides verified package mapping (VQFN-14), confirmed electrical specs (ron = 5–7 Ω, tpd = 0.25 ns, Ioff = 10 µA), thermal data (RθJA = 101.81°C/W), and real-world design guidance for protocol isolation in enterprise computing and wired networking systems.
Technical Context
The SN74CBTLV3125RGYR implements four independent bidirectional FET switches, each controlled by an active-high OE input. When OE is low, the A–B path conducts with <7Ω typical on-resistance; when OE is high, the switch enters high-impedance state with <7pF off-capacitance and <10µA Ioff leakage at VCC = 0V.
Its architecture supports rail-to-rail analog/digital signal pass-through across 0V–3.3V range, maintains isolation during power sequencing, and meets JESD78 Class II latch-up immunity (>100 mA). The VQFN-14 package enables compact layout with exposed thermal pad for enhanced thermal performance in space-constrained embedded interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| On-state resistance (ron) | 5–7 Ω at VCC = 3.3V, 64mA - ensures minimal voltage drop and signal attenuation in high-speed digital buses. |
| Propagation delay (tpd) | 0.25 ns at VCC = 3.3V - enables transparent pass-through for >1 GHz signal edges without timing degradation. |
| Ioff leakage current | 10 µA max at VCC = 0V - prevents backflow damage and enables safe live insertion into powered-backplane systems. |
| Supply voltage range | 2.3V to 3.6V - compatible with 2.5V/3.3V logic domains and mixed-voltage interface bridging. |
| Off-state capacitance (Cio) | 7 pF - minimizes capacitive loading and crosstalk on isolated signal lines during disable state. |
| Operating temperature | −40°C to +85°C - qualified for industrial-grade deployment in datacenter and networking equipment. |
| Junction-to-ambient RθJA | 101.81°C/W (VQFN-14) - defines thermal derating limits for continuous 128mA channel current in PCB layouts with standard copper pour. |
Pinout & Package
VQFN-14 (RGY) package: 3.50mm × 3.50mm body, 0.5mm pitch, exposed thermal pad (pin 14), RoHS-compliant NiPdAu finish, MSL Level-2-260°C-1 year.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE, 2OE, 3OE, 4OE | Active-high enable input | Controls individual switch conduction; tie to VCC via pullup resistor to guarantee high-Z during power-up/down. |
| 1A/1B, 2A/2B, 3A/3B, 4A/4B | Bidirectional I/O channel pair | Passes rail-to-rail signals (0–3.3V) with <7Ω resistance; no directionality or voltage translation required. |
| VCC | Power supply | Single 2.3–3.6V supply powers all four switches; requires local 0.1µF bypass capacitor adjacent to pin. |
| GND | Ground reference | Common return for all channels and internal circuitry; must connect to solid ground plane for EMI control. |
Key Features
| Feature | Design Value |
|---|---|
| 5Ω low on-resistance | Minimizes insertion loss and maintains signal integrity for high-speed parallel buses and clock distribution paths. |
| Rail-to-rail analog/digital switching | Supports full 0V–3.3V swing without level-shifting-ideal for isolating GPIO, SPI, and JTAG signals between voltage domains. |
| Ioff partial-power-down protection | Blocks damaging back-current when VCC = 0V, enabling hot-swap capability without external power sequencing circuitry. |
| High-impedance state during power transition | Guarantees isolation at power-up/down when OE is pulled up to VCC-prevents bus contention in multi-rail systems. |
| JESD78 Class II latch-up immunity | Withstands >100 mA fault current-ensures robust operation in noisy industrial and datacenter environments. |
Applications
| Protocol Isolation | Hot-Swap Backplane Interface |
|---|---|
|
Use Scenario: Isolating JTAG debug, SPI configuration, or GPIO control lines between processor and peripheral ICs in server motherboard designs. IC Role / Device Role / Timing Role: Bidirectional signal gate that enables/disables physical layer connectivity without altering logic levels or timing margins. Use Value: Eliminates need for sequenced power-up of peripherals; allows safe reconfiguration while main SoC remains active. |
Use Scenario: Enabling live insertion/removal of line cards in enterprise switches or routers with powered backplanes. IC Role / Device Role / Timing Role: Signal-level isolation barrier that blocks backfeed current and maintains bus integrity during card insertion events. Use Value: Prevents system reset or corruption caused by uncontrolled voltage transients during hot-swap operations. |
| Industrial I/O Multiplexing | Wired Networking Signal Routing |
|
Use Scenario: Sharing limited MCU GPIO pins across multiple sensors, actuators, or communication modules in building automation controllers. IC Role / Device Role / Timing Role: Low-latency, low-loss analog/digital multiplexer that preserves signal fidelity across shared traces. Use Value: Reduces BOM count and PCB layer count versus discrete MOSFET solutions while maintaining sub-nanosecond timing. |
Use Scenario: Routing Ethernet PHY management signals (MDIO/MDC), SFP+ control lines, or PCIe sideband signals in telecom access equipment. IC Role / Device Role / Timing Role: High-bandwidth, low-capacitance bus switch supporting >100 MHz digital control interfaces. Use Value: Enables flexible board-level signal routing without degrading rise/fall times or introducing jitter. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FET bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTLV3245RGYR | Octal (8-channel) vs. quad (4-channel); identical ron (5–7 Ω), tpd (0.25 ns), and Ioff (10 µA) specs. | Higher channel density suits wider data buses (e.g., 8-bit parallel interfaces); larger VQFN-24 footprint increases layout area. | Select when expanding signal isolation capacity beyond 4 channels without changing voltage or timing requirements. |
| SN74LVC1G3157DCKR | Single-channel; higher ron (9 Ω typ), slower tpd (3.5 ns), but extends operating temp to 125°C (VCC = 1.65–5.5V). | Rated for extended temperature industrial motor drives; lacks quad integration and rail-to-rail performance below 1.8V. | Choose for single-line isolation in high-temp environments where quad integration is unnecessary and 3.5ns delay is acceptable. |
Compared with SN74CBTLV3245RGYR and SN74LVC1G3157DCKR, the SN74CBTLV3125RGYR uniquely balances quad-channel density, sub-0.3ns speed, and 5Ω on-resistance in a compact VQFN-14 package-making it optimal for space-constrained, high-speed protocol isolation where thermal headroom is moderate (−40°C to 85°C).
Availability
SN74CBTLV3125RGYR is available at Aetrix Electronics and suitable for datacenter computing, wired networking infrastructure, and building automation systems requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant VQFN packaging.
Supply support for SN74CBTLV3125RGYR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with over 90 years of innovation in industrial, automotive, and communications markets.
The SN74CBTLV3125RGYR belongs to TI's CBTLV low-voltage logic family, engineered specifically for high-speed, low-power signal routing and hot-swap isolation in enterprise and infrastructure equipment.
FAQ
What is the maximum continuous current per channel for SN74CBTLV3125RGYR?
The SN74CBTLV3125RGYR supports up to 128 mA continuous channel current per switch, as specified in Absolute Maximum Ratings. This rating applies under recommended operating conditions (VCC = 2.3V–3.6V, TA = −40°C to +85°C) and assumes proper PCB thermal design with the VQFN-14 package's exposed thermal pad connected to a sufficient copper area.
Does SN74CBTLV3125RGYR require external pull-up resistors on OE pins?
Yes, SN74CBTLV3125RGYR requires pull-up resistors on all OE inputs to ensure high-impedance state during power-up and power-down. TI recommends tying each OE to VCC through a resistor sized based on the driver's current-sinking capability-typically 10 kΩ for standard CMOS drivers-to prevent floating control inputs and unintended switch activation.
Can SN74CBTLV3125RGYR operate with 1.8V logic signals?
Yes, SN74CBTLV3125RGYR supports rail-to-rail switching down to 0V and up to VCC (2.3V–3.6V), so 1.8V logic signals pass through with full fidelity when VCC ≥ 2.3V. Its control inputs (OE) accept 1.8V-compatible thresholds (VIH = 1.7V min at VCC = 2.3V–2.7V), making it interoperable with 1.8V microcontrollers without level shifters.
What is the thermal resistance (RθJA) of SN74CBTLV3125RGYR in its VQFN package?
The SN74CBTLV3125RGYR in VQFN-14 (RGY) package has a junction-to-ambient thermal resistance of 101.81°C/W, measured under standard JEDEC test conditions (1-layer 2 oz copper, 1 in² pad). This value assumes proper thermal via placement beneath the exposed pad and guides derating calculations for sustained 128mA channel current in production PCB layouts.
Is SN74CBTLV3125RGYR pin-compatible with other packages of the same part number?
No, SN74CBTLV3125RGYR (VQFN-14) is not pin-compatible with SOIC-14 (D), TVSOP-14 (DGV), TSSOP-14 (PW), or SSOP-16 (DBQ) variants. Pin assignments differ significantly-especially GND/VCC locations and OE/A/B ordering-and mechanical footprints are incompatible. Board redesign is required when migrating between packages.
SN74CBTLV3125RGYR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBTLV
- Package/Case:
- 14-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Bus Switch
- Circuit:
- 1 x 1:1
- Independent Circuits:
- 4
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 14-VQFN (3.5x3.5)
SN74CBTLV3125RGYR FAQ
1.How can I place an order for SN74CBTLV3125RGYR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CBTLV3125RGYR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74CBTLV3125RGYR reliable?
The price and inventory of SN74CBTLV3125RGYR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBTLV3125RGYR is usually 5 days.
3.What payment methods are accepted for SN74CBTLV3125RGYR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74CBTLV3125RGYR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74CBTLV3125RGYR?
SN74CBTLV3125RGYR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74CBTLV3125RGYR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74CBTLV3125RGYR?
For technical support, including SN74CBTLV3125RGYR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBTLV3125RGYR requirements.
6.How does Aetrix verify that SN74CBTLV3125RGYR is sourced from the original manufacturer or authorized distributors?
All SN74CBTLV3125RGYR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBTLV3125RGYR meets industry standards.
7.What is the process for return or replacement of SN74CBTLV3125RGYR?
All SN74CBTLV3125RGYR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTLV3125RGYR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBTLV3125RGYR part is unused and in its original packaging.
Return procedure for SN74CBTLV3125RGYR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SN74CBTLV3125RGYR Tags
-
SN74HC138DR
Texas Instruments
-
TC7SB3157CFU,LF(CT
Toshiba Semiconductor and Storage
-
74CBTLV3257PW,118
Nexperia USA Inc.
-
SN74CBTLV3257PWR
Texas Instruments
-
74CBTLV3257GUX
Nexperia USA Inc.
-
74HC154BQ,118
Nexperia USA Inc.
-
P3S0200GMX
NXP USA Inc.
-
SN74CB3Q3245PWR
Texas Instruments
-
SN74CB3Q3257RGYR
Texas Instruments
-
TCA9543APWR
Texas Instruments
-
TCA9546APWR
Texas Instruments
-
SN74HC138N
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
