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Texas Instruments SN74CBTLV3126DR
- Part No.:
- SN74CBTLV3126DR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 14-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
SN74CBTLV3126DR.pdf
- Description:
- IC BUS SWITCH 1 X 1:1 14SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,029
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Product details
Overview
SN74CBTLV3126DR from Texas Instruments is a low-voltage quadruple FET bus switch with independent 5Ω analog switches, rail-to-rail signal switching (0–3.6 V), and Ioff partial-power-down protection. It operates from 2.3 V to 3.6 V, supports –40°C to +85°C ambient, and is used for protocol isolation (e.g., JTAG/SPI) in enterprise computing and wired networking systems.
For engineers reviewing the SN74CBTLV3126DR datasheet, SN74CBTLV3126DR pinout, SN74CBTLV3126DR application, or SN74CBTLV3126DR equivalent, key selection criteria include on-resistance stability across voltage range, guaranteed high-impedance state during power sequencing, thermal performance in SOIC-14, and compatibility with 1.8-V/3.3-V logic control interfaces.
Technical Context
The SN74CBTLV3126DR implements four independent bidirectional FET switches, each controlled by a dedicated active-high output-enable (OE) input. Switch conduction is governed by MOSFET channel resistance, not CMOS logic gates, enabling true analog signal pass-through with minimal distortion.
Its Ioff specification ensures sub-10 µA leakage when VCC = 0 V and I/O pins are biased up to 3.6 V - critical for hot-swap isolation and system-level power domain independence. The device exhibits no latch-up (exceeds 100 mA per JESD 78 Class II) and maintains rail-to-rail signal integrity without level-shifting circuitry.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| On-state resistance (ron) | 5 Ω typical at VCC = 3.3 V, 64 mA - enables low-loss signal routing with <100 mV drop under full load. |
| Supply voltage range | 2.3 V to 3.6 V - compatible with modern low-voltage I/O domains including 2.5 V and 3.3 V systems. |
| Ioff leakage current | 10 µA max at VCC = 0 V - prevents backdrive damage during partial power-down or hot insertion. |
| Operating temperature | –40°C to +85°C - validated for industrial-grade embedded and datacenter infrastructure use. |
| Propagation delay (tpd) | 0.15–0.25 ns - supports high-speed digital signal isolation up to >1 GHz effective bandwidth. |
| ESD rating (HBM) | ±2000 V - meets JEDEC JS-001 for robust handling in automated assembly and field service. |
| Switch capacitance (Cio, OFF) | 7 pF - minimizes capacitive loading on source and sink nodes during disabled state. |
Pinout & Package
SN74CBTLV3126DR is supplied in a 14-pin SOIC (D) package measuring 8.65 mm × 3.91 mm, with gull-wing leads and standard 1.27 mm pitch. Thermal pad is absent; no exposed pad soldering required.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE, 2OE, 3OE, 4OE | Input (active-high enable) | Individually controls conduction of channels 1–4; OE = low forces high-impedance isolation. |
| 1A/1B, 2A/2B, 3A/3B, 4A/4B | Bidirectional I/O | Passive analog signal paths; no directionality - A and B ports are functionally identical and interchangeable. |
| VCC | Power supply | Single 2.3–3.6 V supply powers all four switches and internal bias circuitry; no separate logic or analog rails. |
| GND | Ground reference | Common return for supply and signal paths; must be low-impedance to maintain ron stability and noise immunity. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail analog switching | Supports full 0 V to VCC signal swing on all I/O ports - eliminates need for external level shifters in mixed-voltage systems. |
| Ioff partial-power-down protection | Guarantees <10 µA back-current flow when VCC = 0 V and I/O pins are driven - enables safe hot-plug operation without power sequencing. |
| 5 Ω low on-resistance | Minimizes voltage drop and signal attenuation across switch path - preserves timing margins and signal integrity in high-speed buses. |
| Standard 126-type pinout | Pin-compatible with legacy 74-series bus switches - allows drop-in replacement in existing SOIC-14 layouts without redesign. |
| Latch-up immunity | Exceeds 100 mA per JESD 78 Class II - ensures robust operation in noisy industrial environments with transient coupling. |
Applications
| Enterprise Server Backplane Isolation | Datacenter Rack-Level Signal Routing |
|---|---|
Use Scenario: Isolating JTAG debug interfaces between host CPU and hot-swappable compute modules in 1U servers. IC Role / Device Role / Timing Role: Bidirectional analog switch enabling transparent signal pass-through during normal operation and complete isolation during module removal. Use Value: Eliminates need for sequenced power-down before module extraction - reduces maintenance downtime and avoids firmware lockup risks. |
Use Scenario: Routing SPI configuration signals between baseboard management controller (BMC) and distributed power supplies across a 48 V rack. IC Role / Device Role / Timing Role: Low-latency, low-capacitance signal gate controlling firmware update paths without introducing timing skew. Use Value: 0.25 ns propagation delay and 7 pF off-capacitance preserve SPI clock integrity up to 50 MHz while supporting 3.3 V/1.8 V mixed-domain signaling. |
| Industrial Ethernet PHY Interface Protection | Building Automation Controller Bus Expansion |
Use Scenario: Shielding Ethernet PHY registers from MCU GPIO noise during firmware updates in PoE-powered switches. IC Role / Device Role / Timing Role: High-impedance barrier inserted between microcontroller and PHY register space during reconfiguration sequences. Use Value: Ioff protection prevents register corruption when PHY remains powered while MCU resets - improves field reliability and reduces NVM wear. |
Use Scenario: Expanding RS-485 node count on HVAC controller mainboards via dynamic bus segmentation. IC Role / Device Role / Timing Role: Selectively connecting/disconnecting transceiver pairs to isolate faulted segments without disrupting active communication. Use Value: 5 Ω on-resistance adds <1% impedance mismatch to 120 Ω differential lines - maintains signal reflection coefficient below –30 dB. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FET bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTLV3245DR | Octal (8-channel) configuration, same 5 Ω ron and Ioff spec, but requires two OE inputs controlling four channels each. | Higher channel density suits memory/data bus isolation; less suitable for discrete protocol routing due to grouped enable control. | Select when consolidating multiple isolated signal paths onto one IC and board space is constrained. |
| TS3A24159DGSR | Lower 0.7 Ω typical ron, dual SPDT topology, 1.65–3.6 V supply, but no Ioff spec - leakage exceeds 1 µA at VCC = 0 V. | Better analog performance for audio/sensor signals; unsuitable for hot-swap isolation where backdrive must be blocked. | Prefer for low-distortion analog switching where power sequencing is guaranteed and Ioff is not required. |
Compared with SN74CBTLV3126DR, SN74CBTLV3245DR offers higher integration at the cost of granular channel control, while TS3A24159DGSR delivers lower resistance but lacks certified Ioff protection - making SN74CBTLV3126DR the only choice for unsequenced power domain bridging.
Availability
SN74CBTLV3126DR is available at Aetrix Electronics and suitable for enterprise server backplanes, datacenter rack controllers, and industrial Ethernet PHY interfaces requiring stable component supply across multi-year production cycles.
Supply support for SN74CBTLV3126DR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 50 years of innovation in high-reliability interface solutions.
The SN74CBTLV3126DR belongs to TI's CBTLV (low-voltage translation) logic family, designed specifically for high-speed, low-power signal routing in data-intensive infrastructure equipment where power sequencing flexibility and signal fidelity are critical.
FAQ
What is the maximum continuous current per channel for SN74CBTLV3126DR?
The SN74CBTLV3126DR supports up to 128 mA continuous channel current per switch, verified across the full operating temperature range (–40°C to +85°C) and supply voltage (2.3 V to 3.6 V). This rating ensures reliable operation in high-drive digital buses such as address/data lines and configuration interfaces without thermal derating under typical PCB layout conditions.
Does SN74CBTLV3126DR require external pull-up or pull-down resistors on OE pins?
Yes - to guarantee a defined high-impedance state during power-up or power-down, SN74CBTLV3126DR OE inputs must be actively held low via a pull-down resistor to GND. TI specifies minimum resistor value based on driver sink capability; typical values range from 1 kΩ to 10 kΩ depending on source strength and noise margin requirements.
Can SN74CBTLV3126DR operate with 1.8-V control signals while powered at 3.3 V?
Yes - SN74CBTLV3126DR accepts 1.8-V logic-high inputs on OE pins when VCC = 3.3 V, as its VIH threshold is specified at 2.0 V min (VCC = 2.7–3.6 V). This enables direct interfacing with 1.8-V microcontrollers without level-shifting circuitry, preserving timing and reducing BOM count.
Is SN74CBTLV3126DR pin-compatible with older 74LVX3126 devices?
No - although both share the "3126" functional designation and 14-pin SOIC package, SN74CBTLV3126DR uses standard 126-type pinout (1OE on Pin 1), whereas 74LVX3126 places 1A on Pin 1. Physical insertion into legacy footprints will result in incorrect signal mapping and functional failure.
What is the thermal resistance (RθJA) of SN74CBTLV3126DR in SOIC-14 package?
The junction-to-ambient thermal resistance (RθJA) for SN74CBTLV3126DR in SOIC-14 (D) package is 123.0°C/W under standard JEDEC test conditions (1-layer board, 1 in² copper). This value assumes proper PCB layout with adequate copper pour and decoupling - actual performance improves with 2+ layer boards and thermal vias.
SN74CBTLV3126DR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBTLV
- Package/Case:
- 14-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Bus Switch
- Circuit:
- 1 x 1:1
- Independent Circuits:
- 4
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 14-SOIC
SN74CBTLV3126DR FAQ
1.How can I place an order for SN74CBTLV3126DR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CBTLV3126DR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74CBTLV3126DR reliable?
The price and inventory of SN74CBTLV3126DR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBTLV3126DR is usually 5 days.
3.What payment methods are accepted for SN74CBTLV3126DR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74CBTLV3126DR transactions.
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4.How is shipping managed for SN74CBTLV3126DR?
SN74CBTLV3126DR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74CBTLV3126DR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74CBTLV3126DR?
For technical support, including SN74CBTLV3126DR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBTLV3126DR requirements.
6.How does Aetrix verify that SN74CBTLV3126DR is sourced from the original manufacturer or authorized distributors?
All SN74CBTLV3126DR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBTLV3126DR meets industry standards.
7.What is the process for return or replacement of SN74CBTLV3126DR?
All SN74CBTLV3126DR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTLV3126DR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBTLV3126DR part is unused and in its original packaging.
Return procedure for SN74CBTLV3126DR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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