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Home > Products > Integrated Circuits (ICs) > Logic > Signal Switches, Multiplexers, Decoders

Texas Instruments SN74CBTLV3245AGQNR

Name: SN74CBTLV3245AGQNR
Brand: Texas Instruments
SKU: SN74CBTLV3245AGQNR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: SN74CBTLV3245AGQNR

Manufacturer:: Texas Instruments

Category:: Signal Switches, Multiplexers, Decoders

Package:: 20-VFBGA

Datasheet:: SN74CBTLV3245AGQNR.pdf

Description:: IC BUS SWITCH 8 X 1:1 20BGA

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Product details

Overview

SN74CBTLV3245AGQNR from Texas Instruments is a low-voltage octal FET bus switch in 20-pin QFN (RGY) package, featuring 5 Ω typical on-state resistance, rail-to-rail switching, and I_off support for partial-power-down mode. It enables bidirectional signal routing between A- and B-port data buses in high-speed digital systems such as memory expansion interfaces and FPGA I/O bridging.

For engineers reviewing the SN74CBTLV3245AGQNR datasheet, SN74CBTLV3245AGQNR pinout, SN74CBTLV3245AGQNR application, or SN74CBTLV3245AGQNR equivalent, key selection criteria include its 2.3–3.6 V supply range, sub-0.25 ns propagation delay, ±40 µA I_off leakage at V_CC = 0 V, and compatibility with JEDEC-standard '245-type pinout for drop-in replacement in legacy bus-switch layouts.

Technical Context

The SN74CBTLV3245AGQNR implements eight independent NMOS FET transmission gates controlled by a single active-low output enable (OE) input. Its architecture provides true bidirectional, noninverting signal flow with no internal logic buffering-preserving edge integrity and minimizing jitter.

Designed for low-voltage operation, it supports rail-to-rail analog/digital signal pass-through across ports A and B when enabled, while maintaining high-impedance isolation during disable or power-down states via I_off protection that blocks backflow current even when V_CC = 0 V and I/O pins are biased to 3.6 V.

Key Specifications

Parameter	Value and Actual Design Meaning
V_CC Range	2.3 V to 3.6 V - Enables direct interface with 2.5 V and 3.3 V logic families without level shifters.
r_on (Typ)	5 Ω at V_CC = 2.5 V - Ensures minimal voltage drop and signal attenuation for 64 mA channel current.
t_pd	0.15–0.25 ns - Supports >4 GHz effective data rates in point-to-point high-speed interconnects.
I_off	40 µA max at V_CC = 0 V - Guarantees safe hot-insertion and partial-power-down operation in modular systems.
C_io(OFF)	9 pF - Limits capacitive loading on disabled buses, preserving signal integrity in multi-drop configurations.
ESD Rating	2000 V HBM - Meets industrial-grade robustness requirements without external protection diodes.
Latch-Up Immunity	>250 mA per JESD 17 - Prevents destructive latch-up under transient overvoltage conditions.

Pinout & Package

SN74CBTLV3245AGQNR uses a 20-pin QFN package (RGY) with exposed thermal pad, 4 mm × 4 mm body, 0.5 mm pitch, and moisture sensitivity level (MSL) 2–260°C/1 year. Pin 1 marked via top-side silkscreen dot; pin 10 = GND, pin 11 = V_CC, pin 19 = OE.

Pin/Terminal	Circuit Role	Design Meaning
1, 20	No-connect (NC)	Internally unconnected; must be left floating or tied to GND/V_CC per layout best practice.
2–9	A1–A8	Input/output port A side - Bidirectionally connected to B1–B8 when OE is low.
11	V_CC	Positive supply - Must be decoupled locally with 0.1 µF ceramic capacitor near pin.
10	GND	Ground reference - Connect to low-impedance ground plane; ties thermal pad internally.
12	OE	Active-low output enable - Pull up to V_CC via resistor during power-up to ensure high-Z default state.
13–20	B1–B8	Input/output port B side - Electrically identical to A-side; no internal directionality.

Key Features

Feature	Design Value
Rail-to-rail analog/digital switching	Supports full-swing signals from GND to V_CC without clipping or distortion on either port.
I_off partial-power-down protection	Blocks reverse current flow when V_CC = 0 V and I/O pins remain active - critical for hot-swap backplanes.
Standard '245-type pinout	Enables mechanical and functional compatibility with legacy SN74 series bus switches in existing PCB layouts.
Low 5 Ω r_on and 9 pF C_io(OFF)	Minimizes RC delay and capacitive loading - preserves signal rise/fall times in DDR, PCIe, and USB 2.0 paths.
Latch-up immunity & ESD hardening	Exceeds JESD 17 (250 mA) and JESD 22-A114A (2000 V HBM) - eliminates need for external protection in most industrial designs.

Applications

Memory Expansion Interface	FPGA I/O Bridging
Use Scenario: Expanding DRAM address/data bus between controller and multiple memory modules in embedded computing. IC Role / Device Role / Timing Role: Bidirectional bus switch enabling time-multiplexed access to parallel memory banks without signal contention. Use Value: 5 Ω r_on ensures <10 mV voltage drop at 64 mA, preserving setup/hold timing margins across 16-bit wide buses.	Use Scenario: Isolating and routing configurable I/O signals between FPGA banks and peripheral ASICs operating at different voltage domains. IC Role / Device Role / Timing Role: Voltage-agnostic signal pass-through device supporting mixed 1.8 V, 2.5 V, and 3.3 V I/O standards on same board. Use Value: Rail-to-rail operation and 0.25 ns t_pd maintain sub-nanosecond timing alignment required for source-synchronous interfaces like LVDS or RGMII.
Hot-Swappable Module Backplane	PCI Express Gen1 Lane Multiplexing
Use Scenario: Enabling safe insertion/removal of compute or storage modules in telecom line cards with powered backplanes. IC Role / Device Role / Timing Role: Power-aware isolation element that prevents backfeeding into unpowered modules via I_off protection. Use Value: 40 µA I_off at V_CC = 0 V guarantees no damaging current flows from live backplane to module under test.	Use Scenario: Sharing a single PCIe x1 slot between two endpoints using dynamic lane reconfiguration in server mezzanine cards. IC Role / Device Role / Timing Role: Low-capacitance, low-resistance analog switch for PCIe 2.5 GT/s differential pairs routed through common connector. Use Value: 9 pF C_io(OFF) and 5 Ω r_on minimize insertion loss and return loss degradation - maintains PCIe Gen1 eye diagram compliance.

Memory Expansion Interface

FPGA I/O Bridging

Use Scenario: Expanding DRAM address/data bus between controller and multiple memory modules in embedded computing.

IC Role / Device Role / Timing Role: Bidirectional bus switch enabling time-multiplexed access to parallel memory banks without signal contention.

Use Value: 5 Ω r_on ensures <10 mV voltage drop at 64 mA, preserving setup/hold timing margins across 16-bit wide buses.

Use Scenario: Isolating and routing configurable I/O signals between FPGA banks and peripheral ASICs operating at different voltage domains.

IC Role / Device Role / Timing Role: Voltage-agnostic signal pass-through device supporting mixed 1.8 V, 2.5 V, and 3.3 V I/O standards on same board.

Use Value: Rail-to-rail operation and 0.25 ns t_pd maintain sub-nanosecond timing alignment required for source-synchronous interfaces like LVDS or RGMII.

Hot-Swappable Module Backplane

PCI Express Gen1 Lane Multiplexing

Use Scenario: Enabling safe insertion/removal of compute or storage modules in telecom line cards with powered backplanes.

IC Role / Device Role / Timing Role: Power-aware isolation element that prevents backfeeding into unpowered modules via I_off protection.

Use Value: 40 µA I_off at V_CC = 0 V guarantees no damaging current flows from live backplane to module under test.

Use Scenario: Sharing a single PCIe x1 slot between two endpoints using dynamic lane reconfiguration in server mezzanine cards.

IC Role / Device Role / Timing Role: Low-capacitance, low-resistance analog switch for PCIe 2.5 GT/s differential pairs routed through common connector.

Use Value: 9 pF C_io(OFF) and 5 Ω r_on minimize insertion loss and return loss degradation - maintains PCIe Gen1 eye diagram compliance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switch applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74CBTLV3245APWR	TSSOP-20 package (PW), same electrical specs, 70-unit tube vs. 1000-unit reel for SN74CBTLV3245AGQNR.	Lower-density PCB assembly; less suitable for automated pick-and-place due to larger footprint and no exposed thermal pad.	Preferred for prototyping or low-volume production where QFN reflow capability is unavailable.
SN74CBTLV3245ADGVR	TVSOP-20 package (DGV), identical AC/DC specs, but higher θ_JA (92°C/W vs. 37°C/W for RGY).	Reduced thermal performance limits sustained 64 mA switching in compact enclosures without forced airflow.	Selected when board space constraints prohibit QFN but thermal load remains within 50% duty cycle limits.

Compared with SN74CBTLV3245APWR and SN74CBTLV3245ADGVR, the SN74CBTLV3245AGQNR delivers superior thermal dissipation (37°C/W), smallest PCB footprint (4 mm × 4 mm), and optimal suitability for high-volume automated assembly - making it the preferred choice for thermally demanding, space-constrained, and production-scale applications.

Availability

SN74CBTLV3245AGQNR is available at Aetrix Electronics and suitable for memory expansion interfaces, FPGA I/O bridging, and hot-swappable module backplanes requiring stable component supply, consistent parametric performance, and long-term lifecycle assurance.

Supply support for SN74CBTLV3245AGQNR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog, embedded processing, and logic solutions for industrial, automotive, and communications markets since 1930.

The SN74CBTLV3245AGQNR belongs to TI's CBTLV (ColdFire Bus Transceiver Low-Voltage) logic family, engineered specifically for high-speed, low-power, rail-to-rail bus switching in next-generation digital systems with mixed-voltage I/O architectures.

FAQ

What is the maximum recommended operating temperature for SN74CBTLV3245AGQNR?

The SN74CBTLV3245AGQNR is fully specified for operation from –40°C to +85°C ambient temperature. Its QFN package (RGY) features a thermal impedance of 37°C/W, enabling reliable performance at full rated current (64 mA per channel) within this range when mounted on a 2-layer PCB with adequate copper pour under the thermal pad.

Does SN74CBTLV3245AGQNR support hot-plug operation?

Yes, the SN74CBTLV3245AGQNR supports hot-plug operation via its I_off feature: when V_CC = 0 V, leakage current is limited to 40 µA maximum even if A/B pins are biased to 3.6 V. This prevents damaging back-current flow, making SN74CBTLV3245AGQNR suitable for use in hot-swappable backplane and modular system designs.

Is SN74CBTLV3245AGQNR pin-compatible with standard '245 devices?

Yes, the SN74CBTLV3245AGQNR follows the industry-standard '245-type pinout: A1–A8 on pins 2–9, OE on pin 12, V_CC on pin 11, GND on pin 10, and B1–B8 on pins 13–20. This allows direct PCB-level replacement of legacy 74-series bus switches without layout changes - provided the QFN footprint is supported.

What is the typical on-state resistance of SN74CBTLV3245AGQNR at 3.3 V supply?

At V_CC = 3.3 V, the typical on-state resistance (r_on) of SN74CBTLV3245AGQNR is 5 Ω for IO = 24 mA and VI = 2.4 V, and 7 Ω maximum. This low r_on ensures minimal voltage drop (<170 mV) and preserves signal integrity in high-speed digital interconnects using the SN74CBTLV3245AGQNR.

Can SN74CBTLV3245AGQNR be used with 1.8 V logic signals?

No - the SN74CBTLV3245AGQNR requires V_CC between 2.3 V and 3.6 V and does not support 1.8 V supply operation. However, it can pass 1.8 V signals bidirectionally when V_CC ≥ 2.3 V, as its rail-to-rail switching architecture accepts input voltages from GND to V_CC; thus SN74CBTLV3245AGQNR safely routes 1.8 V logic levels in mixed-voltage systems.

SN74CBTLV3245AGQNR Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: 74CBTLV

Package/Case:: 20-VFBGA

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Type:: Bus Switch

Circuit:: 8 x 1:1

Independent Circuits:: 1

Current - Output High, Low:: -

Voltage Supply Source:: Single Supply

Voltage - Supply:: 2.3V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 20-BGA MICROSTAR JUNIOR (4x3)

SN74CBTLV3245AGQNR FAQ

1.How can I place an order for SN74CBTLV3245AGQNR through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74CBTLV3245AGQNR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74CBTLV3245AGQNR reliable?

The price and inventory of SN74CBTLV3245AGQNR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBTLV3245AGQNR is usually 5 days.

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SN74CBTLV3245AGQNR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SN74CBTLV3245AGQNR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74CBTLV3245AGQNR?

For technical support, including SN74CBTLV3245AGQNR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBTLV3245AGQNR requirements.

6.How does Aetrix verify that SN74CBTLV3245AGQNR is sourced from the original manufacturer or authorized distributors?

All SN74CBTLV3245AGQNR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBTLV3245AGQNR meets industry standards.

7.What is the process for return or replacement of SN74CBTLV3245AGQNR?

All SN74CBTLV3245AGQNR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTLV3245AGQNR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74CBTLV3245AGQNR part is unused and in its original packaging.

Return procedure for SN74CBTLV3245AGQNR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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