Texas Instruments SN74CBTLV3251DGVR

Overview

SN74CBTLV3251DGVR from Texas Instruments is a low-voltage 1-of-8 FET multiplexer/demultiplexer with 5 Ω on-state resistance, rail-to-rail switching capability, and I_off partial-power-down support. It operates from 2.3 V to 3.6 V, delivers sub-0.25 ns propagation delay at 3.3 V, and is used in high-speed data routing for enterprise computing and wired networking systems.

For engineers reviewing the SN74CBTLV3251DGVR datasheet, SN74CBTLV3251DGVR pinout, SN74CBTLV3251DGVR application, or SN74CBTLV3251DGVR equivalent, key selection criteria include on-resistance stability across voltage swing, I_off-enabled isolation during power sequencing, thermal performance in TVSOP-16 packaging, and compatibility with 3.3 V/2.5 V logic domains in dense PCB layouts.

Technical Context

The SN74CBTLV3251DGVR implements eight bidirectional FET switches controlled by three binary select lines (S0–S2) and an active-low output-enable (OE), enabling precise 1:8 signal path selection. Its CMOS-compatible control interface supports standard logic thresholds and requires OE to be pulled up to V_CC via external resistor to guarantee high-impedance state during power-up/down.

Each switch exhibits rail-to-rail conduction with minimal voltage drop-typical on-resistance is 5 Ω at V_CC = 2.5 V and 64 mA-and maintains <40 pF off-capacitance on the B port, ensuring low crosstalk and fast edge integrity in high-frequency data paths.

Key Specifications

Pinout & Package

SN74CBTLV3251DGVR uses a 16-pin TVSOP (Thin Very Small Outline Package) with 0.65 mm pitch, 3.60 mm × 4.40 mm body size, and 1.2 mm max height - optimized for space-constrained, high-density PCBs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FET multiplexer applications.

Compared with SN74CBTLV3251DGVR, SN74CBTLV3257DGVR offers channel-count modularity but doubles component count for 8-path routing, while 74LVC1G3157GW,125 trades integration density for extreme miniaturization and lacks I_off support for true partial-power-down systems.

Availability

SN74CBTLV3251DGVR is available at Aetrix Electronics and suitable for datacenter infrastructure, industrial HMI, and wired networking equipment requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant TVSOP packaging.

Supply support for SN74CBTLV3251DGVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with decades of expertise in high-speed logic and interface solutions.

The SN74CBTLV3251DGVR belongs to TI's CBTLV low-voltage FET switch family, engineered for zero-latency, rail-to-rail signal routing in bandwidth-critical applications such as memory subsystems and real-time control interfaces.

FAQ

What is the maximum continuous current rating per channel for SN74CBTLV3251DGVR?

The SN74CBTLV3251DGVR supports up to 128 mA continuous channel current per switch, as specified in its Absolute Maximum Ratings table. This rating applies under steady-state conditions with proper PCB thermal management and remains valid across the full operating temperature range of –40 °C to +85 °C. Exceeding this limit risks thermal overstress and long-term reliability degradation in the SN74CBTLV3251DGVR.

Does SN74CBTLV3251DGVR require external pull-up resistors on its control pins?

Yes - the OE pin of SN74CBTLV3251DGVR must be tied to V_CC through an external pull-up resistor to guarantee high-impedance state during power-up and power-down sequences. The minimum resistor value depends on the current-sinking capability of the driving source, and unused S0/S1/S2 inputs should also be held at V_CC or GND to prevent floating states that could cause undefined switching behavior in the SN74CBTLV3251DGVR.

Can SN74CBTLV3251DGVR operate with a 2.5 V supply while interfacing with 3.3 V logic levels?

Yes - SN74CBTLV3251DGVR supports rail-to-rail switching and operates across 2.3 V to 3.6 V, allowing direct interface between 2.5 V and 3.3 V domains without level shifters. Its VIH and VIL thresholds scale with V_CC, ensuring reliable recognition of 3.3 V logic highs even at 2.5 V supply. This interoperability is a core design feature of the SN74CBTLV3251DGVR.

What is the thermal resistance (R_θJA) of SN74CBTLV3251DGVR in its TVSOP package?

The junction-to-ambient thermal resistance (R_θJA) of SN74CBTLV3251DGVR in the DGV (TVSOP-16) package is 120 °C/W, as specified in Section 5.4 of its datasheet. This value assumes standard JEDEC 2-layer board conditions and informs thermal design margining - for sustained operation near maximum ambient temperature, PCB copper area and airflow must be evaluated to keep junction temperature below 150 °C in the SN74CBTLV3251DGVR.

Is SN74CBTLV3251DGVR pin-compatible with other packages in the same family?

No - SN74CBTLV3251DGVR uses the TVSOP-16 (DGV) footprint, which differs mechanically and electrically from SOIC (D), SSOP (DBQ), TSSOP (PW), and VQFN (RGY) variants. While all share identical logic functionality and pin functions, their land patterns, pitch, and thermal characteristics are not interchangeable. Board layout must match the DGV mechanical outline to use SN74CBTLV3251DGVR.